STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip
Rhea-AI Summary
STMicroelectronics (NYSE: STM) launched the ST25DA-C, an industry-first secure NFC chip designed for Matter 1.5 smart‑home onboarding to enable right‑first‑time, tap-to-pair commissioning of lights, locks, cameras, and other IoT devices.
The chip supports energy harvesting for battery‑less NFC commissioning, embeds Common Criteria‑certified secure elements, and targets GlobalPlatform SESIP level 3 certification. Evaluation samples are available now in a DFN8 package, with mass production scheduled to begin in 2026.
Positive
- First commercial NFC chip supporting Matter 1.5
- Enables tap-to-pair onboarding for multiple devices in one step
- Energy harvesting enables battery-less NFC commissioning
- Evaluation samples available now; mass production 2026
Negative
- Mass production not until 2026, delaying broad adoption
- Certification to GlobalPlatform SESIP level 3 is a target, not completed
Insights
STMicroelectronics launched the ST25DA-C, an NFC chip implementing Matter 1.5 to simplify secure smart‑home onboarding.
ST’s ST25DA-C provides NFC-based, tap-to-pair device commissioning that performs cryptographic operations via energy harvesting, enabling commissioning of unpowered devices and parallel installation of accessories. The chip is described as the first commercial solution supporting Matter 1.5 enhancements and is based on Common Criteria-certified hardware while targeting GlobalPlatform SESIP level 3 certification.
Key dependencies include successful certification to SESIP level 3 and uptake by device makers and the Matter ecosystem, which the release frames as helping accelerate adoption. Technical strengths are on-device cryptography and energy-harvesting NFC commissioning; watch for engineering-sample feedback and certification milestones through
STMicroelectronics streamlines smart-home device integration
with industry-first Matter NFC chip
- Matter 1.5 enhances the consumer experience at home with right-first-time NFC onboarding of multiple devices as fast and easy as paying by phone
- Market-first secure chip supporting new Matter 1.5 smart-home networking specification is ready for integration into smart-home devices
Geneva, November 25, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home standard. ST’s ST25DA-C chip lets users add lighting, access control, security cameras, or any IoT device to their home network in one step by tapping their phone. The chip is the first commercial solution fulfilling newly published enhancements in Matter—the latest open-source standard now making smart home devices secure, reliable, and seamless to use.
“The integration of NFC-based onboarding in Matter 1.5 is a timely enhancement to the smart home experience. Our market-first ST25DA-C chip leverages this capability to simplify device commissioning through tap-to-pair functionality. This reduces setup complexity, especially for installations that are difficult to access, thanks to NFC-enabled battery-less connectivity. This aligns well with the broader momentum in the smart home market to serve consumers who increasingly prioritize ease of use, interoperability, and security. NFC-enabled Matter devices are positioned to play a key role in driving even greater adoption,” said David Richetto, Group VP, Division General Manager, Connected Security at STMicroelectronics.
“Matter is an important standard for the smart-home industry, enabling seamless communication across devices, mobile apps, and cloud services. Its primary benefit is simplifying technology for non-expert consumers, which could help accelerate adoption of connected devices. The new STMicroelectronics’ ST25DA-C secure NFC chip is one example of next generation chipset that supports this standard, providing device makers with tools to develop the next generation of smart-home products,” said Shobhit Srivastava, Senior Principal Analyst at Omdia.
Technical information
Enhanced usability: ST’s new NFC Forum Type 4 chip significantly improves the user experience, leveraging NFC technology present in most smartphone devices. NFC-enabled device commissioning is faster, more reliable, and secure compared to conventional pairing using technologies such as Bluetooth® or QR codes, which are not always possible.
The ST25DA-C secure NFC tag can operate cryptographic operations required for Matter device commissioning using energy harvesting from the RF field. This mechanism allows users to jump-start adding unpowered devices to the smart home network. It also simplifies the installation of multiple accessories in parallel.
Focused on security: The ST25DA-C brings strong security to smart homes, leveraging ST’s proven expertise in embedded secure elements for protecting assets with device authentication, secure storage for cryptographic keys, certificates, and network credentials.
Based on Common Criteria-certified hardware, the ST25DA-C also targets certification to the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP level 3).
Availability: The ST25DA-C is available for evaluation and sampling in a tiny DFN8 package, with mass production scheduled to begin in 2026. Detailed documentation, engineering samples, and evaluation kits are available through local ST sales representatives.
About STMicroelectronics
At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our
INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
jerome.ramel@st.com
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Alexis Breton
Corporate External Communications
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alexis.breton@st.com
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FAQ
What is STMicroelectronics announcing about Matter 1.5 and NFC for STM?
How does the ST25DA-C speed smart‑home setup for STM devices?
Can the ST25DA-C power unpowered devices during onboarding for STM?
What security credentials does the ST25DA-C provide for STM products?
When will STM customers get production quantities of the ST25DA-C?
How can device makers evaluate the ST25DA-C for STM smart‑home products?
