Teradyne Introduces Photon 100

Key Terms

silicon photonics technical

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

co-packaged optics technical

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

optical interconnects technical

Optical interconnects are systems that use light instead of electrical signals to move data between parts of computers, data centers, or telecom equipment, like replacing copper wires with tiny light pipes. They matter to investors because they can greatly increase speed and capacity while lowering power use and heat, making digital networks faster and cheaper to scale; think of swapping a crowded city road for a high-speed rail line that carries much more traffic efficiently.

wafer-level technical

Wafer-level describes manufacturing steps performed on a whole round silicon slice (the wafer) before it is cut into individual chips, similar to frosting and testing a cookie sheet before breaking it into single cookies. Doing work at the wafer level can lower per-chip cost, shrink final package size, speed production and improve quality, so it matters to investors because it can boost margins, supply efficiency and the competitiveness of semiconductor products.

Comprehensive Automated Test Platform Accelerates High-Volume Silicon Photonics and Co-Packaged Optics Manufacturing

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.

Teradyne Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics and co-packaged optics manufacturing.

As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating industry-leading optical and electrical instrumentation with Teradyne’s proven UltraFLEXplus platform, Teradyne Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions. This solution simplifies operations, accelerates time-to-market, and enables rapid scaling for silicon photonics and co-packaged optics manufacturing.

"The Photon 100 delivers unmatched value to our customers by providing a comprehensive, scalable, and integrated solution that simplifies the complexities of high-volume silicon photonics and co-packaged optics testing,” said Geeta Athalye, vice president of Silicon Photonics Test at Teradyne. “The integration of the proven Teradyne UltraFLEXplus platform with state-of-the-art optical and electrical instrumentation ensures seamless performance at scale today and the flexibility to evolve alongside our customers’ needs as the industry continues to innovate."

Key Features and Benefits

• Integrated Optical & Electrical Instrumentation: Combines advanced optical and electrical test capabilities.
• Scalable for High-Volume Manufacturing: Designed to support the rigorous demands of high-volume SiPh and CPO production environments.
• Comprehensive Test Coverage: Supports wafer (single and double-sided), optical engine, and CPO test insertions.
• Customizable Optical Instrumentation: Standard configuration available, with the ability to tailor optical instrumentation if needed.
• Operational Simplicity: Designed, built and maintained by Teradyne, eliminating the need for customers to integrate and support multi-vendor solutions.
• Open Ecosystem: Customers can choose their preferred ecosystem partners for high-volume manufacturing, including wafer-level and die-level probe options.

With the Photon 100, Teradyne reinforces its leadership position in high-volume SiPh and CPO test, delivering an integrated, scalable, and automated solution for today’s most advanced manufacturing challenges. By combining cutting-edge optical and electrical instrumentation with the proven UltraFLEXplus platform, Teradyne Photon 100 empowers customers to accelerate innovation, reduce operational complexity, and scale production to meet the growing demands of AI and next-generation data centers. The Photon 100 underscores Teradyne’s commitment to driving the future of silicon photonics and co-packaged optics manufacturing with industry-leading test solutions.

To learn more about Teradyne Photon 100 for SiPh automated test, visit us at OFC 2026, booth 4732, March 17 - 19 in Los Angeles, California. For more information about the Teradyne Photon 100, visit our website at https://www.teradyne.com/photon-100.

About Teradyne
Teradyne (NASDAQ:TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260317783269/en/

Amy McAndrews


Investor Relations


Tel 978-370-3945


investor.relations@teradyne.com

Source: Teradyne, Inc.