Teradyne Launches Advanced UltraFLEXplus Instruments Engineered for AI and Data Center Computing Devices

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Suite of instruments delivers speed, power, and precision to meet emerging AI and data center device test challenges.

Teradyne announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing.

“As the AI and data center market drives unprecedented growth in semiconductor complexity, Teradyne remains committed to delivering innovative solutions that enable our customers to stay ahead in this rapidly evolving market,” said Greg Smith, CEO of Teradyne. “This new suite of instruments expands the capabilities of our UltraFLEXplus platform, offering the industry’s most advanced, future-proof solutions for testing cutting-edge devices.”

UltraPin5000-EM

The UltraPin5000-EM is Teradyne's next-generation digital instrument, purpose-built to address the demands of pattern-intensive AI and compute devices. With up to 80 times more vector memory than other market offerings, it enables testing of today’s most complex AI devices while future-proofing for tomorrow’s innovations. Pattern loads are up to 10 times faster, and a new Persistence Mode delivers near-instant reloads, enabling engineering teams to accelerate debug and characterization while production floors benefit from improved equipment efficiency.

The UltraPin5000-EM delivers excellent signal integrity at 5 Gbps data rates for robust high-bandwidth pattern throughput, while its flexible timing architecture supports independent clock frequencies per pin for seamless adaptation to heterogeneous device requirements. Scan network acceleration compiles per-core results in real time, enabling immediate adaptive test decisions and reducing structural test time without sacrificing coverage. Compatible with the UltraPin2200, the UltraPin5000-EM protects customer's existing investments while scaling to meet new device requirements.

UltraPort-PCIe6

The UltraPort-PCIe6 is the industry's first high-speed I/O protocol ATE solution for PCIe Gen6 interfaces, delivering 64 Gbps (PAM-4) across 32 lanes per instrument. Excellent signal integrity performance, combined with unique per-pin PMU and integrated loopback capability, provides enhanced test coverage, broader diagnostics, and the cleanest signal path to the device, for test solution setups that can be brought up quickly and stay stable in production. A dedicated server-class compute backend scales to 2TB of high-performance memory, executing the largest test data sets at the fastest test times.

The instrument supports both mission-mode testing and high-speed I/O scan, enabling test coverage to shift to earlier insertions to improve Known Good Die confidence, and reduce waste of high-value HBM and advanced packaging assemblies.

UltraVS64-HP

The UltraVS64-HP is Teradyne's most advanced power supply, delivering 1280 amps per instrument, 5120 amps per ganged supply, and total test cell capacity exceeding 15,000 amps. A unique 16V range makes the UltraVS64-HP ready for emerging integrated voltage regulator (IVR) architectures, spanning low-voltage, high-current devices through higher-voltage inputs. This current and voltage headroom lets customers follow advanced packaging roadmaps toward larger, higher-power compute devices - all from a single instrument.

New integrated multi-point sense joins superior dynamic load response to preserve device yields, holding conditions stable as high-current activity shifts across reticle-size die and multi-die packages. Advanced power profiling provides push-button access to deep insights into device behavior during test, critical for characterizing next-generation architectures and for optimizing test programs to measured results. A new, dedicated Intelligent power interface brings elements of system-level power management into the test cell and adds fast hardware-level fault response that guards against thermal runaway, and the costly probe card and socket damage it can cause.

Visit Teradyne at SEMICON Taiwan, meeting room #534, September 2-4, 2026, in Taipei, Taiwan to explore these innovative products and more. For more information about these instruments, visit teradyne.com/ultraflexplus.

About Teradyne

Teradyne (NASDAQ: TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its semiconductor and electronics test solutions span the full AI device supply chain, from wafer to data center, enabling customers to meet the quality and reliability standards the AI era demands. Its advanced robotics business deploys intelligent automation across manufacturing, logistics, and data center operations for customers worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260901202720/en/

For more information:
Amy McAndrews
Investor Relations
Tel 978.370.3945
Investor.relations@teradyne.com

Source: Teradyne, Inc.

Key Terms

pcie gen6 technical

PCIe Gen6 is the sixth generation of the PCI Express standard, the high‑speed internal “highway” that links processors, storage, graphics and networking inside computers and servers. It roughly doubles data transfer rates compared with the previous generation, reducing delay and enabling much heavier workloads; investors care because faster internal connectivity can boost performance for data centers, AI, storage and networking markets and raise demand for supporting chips and components.

pam-4 technical

A lab-made antibody that binds a specific protein often found on certain tumors, especially pancreatic cancer, used both to help detect cancer and to deliver imaging agents or treatments directly to tumor cells. For investors, PAM4 matters because success or failure in tests and trials using this antibody can change how accurately a disease is diagnosed, how targeted a therapy can be, and therefore a company's clinical prospects, regulatory chances, and potential market value.

integrated voltage regulator technical

An integrated voltage regulator is a small electronic component built into or placed very close to a chip that controls and delivers the precise electrical voltage the chip needs to run. Think of it as a smart power faucet that adjusts flow instantly so the device runs efficiently and safely. Investors care because it can improve product performance and battery life, reduce parts and assembly cost, and boost reliability—factors that affect margins, customer appeal, and competitive positioning.

known good die technical

A known good die is a single semiconductor chip that has been tested and confirmed to work correctly; manufacturers keep it as a reliable reference unit for testing, calibration and assembly. For investors, it matters because using known good dies improves product yields, reduces defective shipments and speeds time-to-market—factors that directly affect manufacturing costs, revenue predictability and a company’s reputation.