TTM Technologies, Inc. to Exhibit at electronica India 2026 Trade Fair in Bangalore, Showcasing Leading Advanced Interconnect Solutions and Integrated Systems

TTM Technologies will present advanced PCB, RF and interconnect solutions for AI, data centers and next‑generation electronics at electronica India 2026.

Rhea-AI Summary

TTM Technologies (TTMI) will exhibit at the electronica India 2026 trade fair in Bangalore from September 16–18, 2026, at Hall 3, Booth B11.

The company will showcase advanced interconnect solutions and integrated systems, including high-speed PCB technology for AI and hyperscale data centers, advanced interconnect and system integration, and next-generation RF and microwave technologies. TTM highlights its N+M asymmetric PCB technologies, which are designed to optimize signal integrity and power delivery on a single board for AI infrastructure and advanced electronics applications. An expert team will be on site to discuss emerging industry trends and future electronics developments.

Key Terms

rf, signal integrity

2 terms

rf technical

"radio frequency ("RF") components"

rf (commonly written r_f) denotes the risk-free rate — the theoretical return on an investment with no chance of loss, often used as a baseline for valuing other assets. Investors use it like a yardstick: returns above this number compensate for extra risk, so it helps price stocks, bonds and option valuations and guides decisions about whether higher-return opportunities justify their added risk. Think of it as the safe deposit box interest rate against which riskier bets are measured.

signal integrity technical

"optimize signal integrity and power delivery within a single board"

Signal integrity is the ability of an electronic wire, circuit or connector to carry data signals cleanly and reliably without distortion or errors, like keeping a phone call clear despite background noise. For investors, it matters because poor signal integrity leads to malfunctioning or slower products, higher development and warranty costs, and can limit a company’s ability to sell into high‑speed markets such as data centers, telecom and advanced consumer electronics.

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SANTA ANA, Calif., Sept. 15, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) ("TTM"), a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards ("PCB" s) and substrates, will exhibit at the electronica India 2026 trade fair, at Hall 3, Booth B11, from September 16–18, 2026, at the Bangalore International Exhibition Centre, Bangalore, India.

As the electronics industry accelerates toward smarter, faster, and more connected solutions, TTM continues to expand its capabilities and global reach to meet the growing customer demand. TTM will showcase its latest advancements in interconnect and innovative solutions at South Asia's leading electronics trade fair, bringing to market technologies that address the industry's most pressing design challenges, including high-speed PCB technology for AI and hyperscale data centers, advanced interconnect and system integration, and next-generation RF and microwave technologies. Among TTM's latest innovative solutions are its N+M asymmetric PCB technologies, which enable customers to optimize signal integrity and power delivery within a single board, delivering the performance and density that today's AI infrastructure and advanced electronics applications demand.

"Electronica has long been an important platform for TTM to connect with the global electronics community, and we are proud to bring that presence to India again. electronica India represents a tremendous opportunity to engage with the rapidly expanding electronics industry in this market. We look forward to collaborating with industry leaders and demonstrating how our advanced PCB technologies and innovative solutions can empower businesses to stay ahead in a rapidly evolving marketplace," said Laura Woods, Vice President, Corporate Sales & Sales Operations at TTM Technologies.

TTM's expert team will be at the exhibition throughout the event for conversations about emerging trends and future developments shaping the next wave of electronics innovation. To schedule a meeting with TTM at electronica India 2026, please visit: electronica India 2026 | TTM Technologies

About TTM

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including PCBs and substrates. TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com

Contacts:          Winnie Ng Vice President, Corporate Marketing TTM Technologies, Inc. +852 22722287 / +1 714 327 3000 winnie.ng@ttm.com

Sean K.F. Hannan, Vice President, Investor Relations TTM Technologies, Inc. +1 339 466 7737 sean.hannan@ttmtech.com

FAQ

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When and where will TTM Technologies exhibit at electronica India 2026?

TTM Technologies will exhibit at electronica India 2026 from September 16–18, 2026, at the Bangalore International Exhibition Centre in Bangalore, India, located in Hall 3, Booth B11.

What key technologies will TTM highlight at the event?

TTM will feature high-speed PCB technology for AI and hyperscale data centers, advanced interconnect and system integration solutions, next-generation RF and microwave technologies, and its N+M asymmetric PCB technologies designed to improve signal integrity and power delivery on a single board.

How can interested parties schedule a meeting with TTM at the fair?

To schedule a meeting with TTM at electronica India 2026, visitors are directed to use the "electronica India 2026 | TTM Technologies" link provided by the company.