New portfolios from TI push the limits of power design further, help engineers achieve industry-leading power density

Rhea-AI Summary

Texas Instruments (TXN) introduces new 100V GaN power stages and 1.5W isolated DC/DC modules to increase power efficiency and reduce solution size. The products offer over 40% size reduction, 50% lower switching losses, and 8 times higher power density for automotive and industrial applications.

Electrical Engineer

The introduction of 100V GaN power stages with enhanced thermal management represents a significant advancement in power electronics. GaN technology has been gaining traction due to its ability to operate at higher switching frequencies compared to traditional silicon-based solutions. This leads to smaller, more efficient power supplies, which is critical in applications where space is at a premium, such as in data centers or compact industrial systems.

From an engineering perspective, the ability to reduce solution size by over 40% while simultaneously cutting switching losses in half is a testament to the efficiency of GaN technology. The thermally enhanced package is particularly noteworthy, as it addresses one of the primary challenges associated with high-density power devices: thermal management. Effective heat removal is crucial to maintain reliability and performance over time. The dual-side cooling approach can potentially lead to longer device lifespans and reduced need for additional cooling infrastructure, which is a cost-saving benefit.

Environmental Specialist

TI's advancements in power stage technology have broader implications for energy consumption and environmental impact. Higher efficiency in power conversion leads to lower energy wastage, which is crucial for applications like solar inverters where maximizing the power output from renewable sources is essential. The claim of achieving 98% or higher system efficiency could significantly reduce the carbon footprint of power-intensive industries, such as data centers, which are increasingly scrutinized for their environmental impact.

Furthermore, the reduction in the physical size of power supplies contributes to resource efficiency and waste reduction, aligning with sustainable design principles. By enabling the same solar panel to store and produce more power, these devices can contribute to the scalability of renewable energy infrastructure, which is a critical factor in the global transition to sustainable energy sources.

Market Research Analyst

The release of these new power conversion devices by Texas Instruments is poised to have a substantial impact on the competitive landscape of the power electronics market. The reported power density of over 1.5kW/in3 is a notable industry benchmark that could set new expectations for future product developments. As industries continue to demand more power-efficient and compact solutions, TI's innovation may capture significant market share, especially in the automotive and industrial sectors that are rapidly evolving with the advent of electric vehicles and smart manufacturing.

Moreover, the timing of this release, coinciding with a major industry conference, demonstrates strategic marketing acumen. It allows TI to showcase its technological leadership and could translate into strong business relationships and sales momentum. The potential cost savings and performance improvements offered by these devices may drive adoption and could be a catalyst for stock market interest in TI, as investors typically look favorably on companies that are at the forefront of significant technological shifts.

News highlights:

• 100V GaN power stages with thermally enhanced package technology reduce solution size by over 40% and increase power efficiency with 50% lower switching losses.
• The industry's smallest 1.5W isolated DC/DC modules deliver over eight times higher power density for automotive and industrial applications.

DALLAS, Feb. 20, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing the highest power density at a lower cost. TI's new 100V integrated gallium nitride (GaN) power stages feature thermally enhanced dual-side cooled package technology to simplify thermal designs and achieve the highest power density in mid-voltage applications at more than 1.5kW/in³. TI's new 1.5W isolated DC/DC modules with integrated transformers are the industry's smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by over 89%. Devices from both portfolios will be on display at this year's Applied Power Electronics Conference (APEC), Feb. 25-29 in Long Beach, California.

For more information, see TI.com/LMG2100 and TI.com/UCC33420-Q1.

"For power-supply designers, delivering more power in limited spaces will always be a critical design challenge," said Kannan Soundarapandian, general manager of High Voltage Power at TI. "Take data centers, for example – if engineers can design power-dense server power-supply solutions, data centers can operate more efficiently to meet growing processing needs while also minimizing their environmental footprint. We're excited to continue to push the limits of power management by offering innovations that help engineers deliver the highest power density, efficiency and thermal performance."

Increase power density and efficiency with 100V integrated GaN power stages
With TI's new 100V GaN power stages, LMG2100R044 and LMG3100R017, designers can reduce power-supply solution size for mid-voltage applications by more than 40% and achieve industry-leading power density of over 1.5kW/in³, enabled by GaN technology's higher switching frequencies. The new portfolio also reduces switching power losses by 50% compared to silicon-based solutions, while achieving 98% or higher system efficiency given the lower output capacitance and lower gate-drive losses. In a solar inverter system, for example, higher density and efficiency enables the same panel to store and produce more power while decreasing the size of the overall microinverter system.

A key enabler of the thermal performance in the 100V GaN portfolio is TI's thermally enhanced dual-side cooled package. This technology enables more efficient heat removal from both sides of the device and offers improved thermal resistance compared to competing integrated GaN devices.

To learn more about the benefits of TI's 100V GaN power stages for mid-voltage applications, read the technical article, "4 mid-voltage applications where GaN will transform electronic designs."

Shrink bias power supplies by more than 89%
With over eight times higher power density than discrete solutions and three times higher power density than competing modules, TI's new 1.5W isolated DC/DC modules deliver the highest output power and isolation capability (3kV) for automotive and industrial systems in a 4mm-by-5mm very thin small outline no-lead (VSON) package. With TI's UCC33420-Q1 and UCC33420, designers can also easily meet stringent electromagnetic interference (EMI) requirements, such as Comité International Spécial des Perturbations Radioélectriques (CISPR) 32 and 25, with fewer components and a simple filter design.

The new modules use TI's next-generation integrated transformer technology, which eliminates the need for an external transformer in a bias supply design. The technology allows engineers to shrink solution size by more than 89% and reduce height by up to 75%, while cutting bill of materials by half compared to discrete solutions.

With the first automotive-qualified solution in this small package, designers can now reduce the footprint, weight and height of their bias supply solution for electric vehicle systems such as battery management systems. For space-constrained industrial power delivery in data centers, the new module enables designers to minimize printed circuit board area.

To learn more about the benefits of TI's 1.5W isolated DC/DC modules, read the technical article, "How a new isolated DC/DC module can help solve power-density challenges."

Pushing the limits of power at APEC 2024
These new devices are the latest ways TI is pushing power further and making innovation possible for engineers everywhere. At APEC 2024, TI will showcase the latest automotive and industrial designs for 48V automotive power; the first USB Power Delivery Extended Power Range full charging solution on the market; an 800V, 300kW silicon carbide-based traction inverter; high-efficiency power for server motherboards; and more.

• Saturday, Feb. 24-Thursday, Feb. 29: Visit TI in the Long Beach Convention & Entertainment Center, Booth No. 1145. See TI.com/APEC for more information.
• Wednesday, Feb. 28 at 12 p.m. Pacific time: TI General Manager of Industrial Power Design Services Robert Taylor will present an industry session, "To Power Density and Beyond: Breaking Through Barriers to Achieve the Highest Power Density." He will discuss innovations in packaging, integration and system-level techniques that are making greater power density possible.
• Throughout APEC: TI power experts will lead 20 industry and technical sessions to address power-management design challenges. The full schedule of TI experts' industry and technical sessions is available at TI.com/APEC.

Available today on TI.com

• Production quantities of the LMG2100R044 and LMG3100R017 100V GaN power stages are available for purchase now on TI.com.
• Preproduction quantities of the UCC33420 and UCC33420-Q1 1.5W isolated DC/DC modules are available for purchase now on TI.com. Other versions of these devices with lower input voltages, output voltages and power ratings are expected to be available in second quarter of 2024.
• Multiple payment and shipping options are available.

About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today, as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It's what we do and have been doing for decades. Learn more at TI.com.

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SOURCE Texas Instruments

FAQ

What new products did Texas Instruments introduce?

Texas Instruments introduced new 100V GaN power stages and 1.5W isolated DC/DC modules.

What benefits do the new products offer?

The new products offer over 40% size reduction, 50% lower switching losses, and 8 times higher power density for automotive and industrial applications.

Where can devices from both portfolios be seen?

Devices from both portfolios will be on display at the Applied Power Electronics Conference (APEC) in Long Beach, California.

Who is the general manager of High Voltage Power at TI?

Kannan Soundarapandian is the general manager of High Voltage Power at TI.

What technology enables thermal performance in the 100V GaN portfolio?

TI's thermally enhanced dual-side cooled package technology enables improved thermal performance in the 100V GaN portfolio.