Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry

Rhea-AI Summary

Veeco (NASDAQ: VECO) announced multiple orders for its WaferStorm, WaferEtch and AP300 wet processing and lithography systems from a leading specialist foundry to support advanced packaging and silicon photonics.

Deliveries are scheduled to begin in Q1 2026. Systems will target applications across AI, automotive, aerospace and defense, and communications, and include processes such as Cu pillars, flip-chip bumping, FOWLP and high-density fan-out packaging.

Insights

Equipment & Semiconductor Process Strategist

Veeco won multiple equipment orders from a leading foundry to supply wet‑processing and lithography tools for advanced packaging and silicon photonics.

These orders involve Veeco platforms WaferStorm, WaferEtch and AP300 and target advanced packaging and silicon photonics lines that serve end markets such as AI, automotive, aerospace and defense, and communications. The tools deliver cleaning, etch and lithography functions used directly in interconnect formation, Cu pillar and flip‑chip bump processes, and fan‑out wafer‑level packaging workflows.

Execution depends on timely delivery and tool performance; scheduled deliveries begin in Q1 2026. Integration risks include process qualification at the foundry and yield improvement claims that must prove out in production. The announcement provides no financial terms or order size, so revenue timing and magnitude remain unspecified.

Watch for three concrete signals over the next quarters: (1) shipment confirmations and installation reports starting in Q1 2026, (2) customer process qualification milestones or yield improvement data tied to the WaferStorm and WaferEtch platforms, and (3) any subsequent disclosures that quantify order value or booking impact in upcoming reporting cycles.

PLAINVIEW, N.Y., Oct. 28, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO), a global leader in semiconductor process equipment, today announced it has received multiple orders for its advanced wet processing and lithography systems from a leading specialist foundry. The systems will be deployed for advanced packaging and silicon photonics applications, supporting critical end markets including AI, automotive, aerospace and defense, and communications. Scheduled deliveries for the most recent orders will start in the first quarter of 2026.

“These new orders build on our legacy of collaboration with leading customers to deliver enabling technologies that drive innovation and meet the evolving demands of the semiconductor industry,” said Adrian Devasahayam, Senior Vice President, Product Line Management at Veeco. “These orders underscore Veeco’s position as a trusted partner for enabling next-generation device manufacturing in high-growth markets such as artificial intelligence, high-performance computing and silicon photonics. We remain committed to investing in new technologies and expanding our market reach through strategic partnerships and customer-driven innovation.”

Veeco’s WaferStorm^®, WaferEtch^® and AP300™ platforms were selected for their best-in-class process performance, unique capabilities, and low cost of ownership. Veeco’s WaferStorm^® solvent cleaning systems set the industry standard for yield improvement, while WaferEtch^® systems enable precise interconnect and device definition, for improved performance. The company’s lithography systems support next-generation advanced packaging processes, including copper (Cu) pillars for 2.5/3D packaging, flip-chip bumping, fan-out wafer-level packaging (FOWLP), and high-density fan-out packaging.

About Veeco

Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, metal organic chemical vapor deposition (MOCVD), single wafer etch & clean and lithography technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.

To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2024, and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.

Veeco Contacts:

Investor Relations: Alex Delacroix | (516) 528-1020 | adelacroix@veeco.com
Media: Brenden Wright | (410) 984-2610 | bwright@veeco.com

FAQ

What did Veeco (VECO) announce on October 28, 2025?

Veeco announced multiple orders for its WaferStorm, WaferEtch and AP300 systems to support advanced packaging and silicon photonics.

When will Veeco begin deliveries for the new VECO orders?

Scheduled deliveries for the recent orders will start in Q1 2026.

Which Veeco systems were selected by the foundry in the VECO order?

The foundry selected Veeco’s WaferStorm solvent cleaning, WaferEtch and AP300 lithography platforms.

What applications will VECO systems support at the foundry?

Systems will be used for advanced packaging (Cu pillars, flip-chip bumping, FOWLP, high-density fan-out) and silicon photonics.

Which end markets does Veeco say the VECO orders address?

The company cited end markets including AI, automotive, aerospace and defense, and communications.

How did Veeco describe the reason the foundry selected its platforms?

Veeco said its platforms were chosen for process performance, unique capabilities, and low cost of ownership.