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Vishay Intertechnology Gen 3 650 V and 1200 V SiC Schottky Diodes Increase Efficiency While Enhancing Electrical Insulation

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Vishay Intertechnology (NYSE:VSH) has unveiled three new Gen 3 silicon carbide (SiC) Schottky diodes in the SlimSMA HV package. The new lineup includes the 1A VS-3C01EJ12-M3 and 2A VS-3C02EJ07-M3/VS-3C02EJ12-M3 models, featuring 650V and 1200V options.

The diodes boast a minimum creepage distance of 3.2mm and maintain low capacitive charge down to 7.2 nC regardless of temperature. Key features include a low profile of 0.95mm, high operating temperature of +175°C, and reduced forward voltage drop to 1.30V. These components are designed for applications in server power supplies, energy systems, industrial drives, and X-ray generators.

Samples and production quantities are available now with 14-week lead times. The devices are RoHS-compliant, halogen-free, and meet JESD 201 class 2 whisker test requirements.

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Positive

  • Enhanced efficiency through low capacitive charge and temperature-invariant switching behavior
  • Improved electrical isolation with 3.2mm creepage distance and high CTI ≥ 600
  • Compact design with 0.95mm profile compared to 2.3mm for competing packages
  • Immediate availability with defined 14-week lead times

Negative

  • None.

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Offered in the Compact SlimSMA HV (DO-221AC) Package, 1 A and 2 A Devices Offer Low Capacitive Charge and High Minimum Creepage Distance of 3.2 mm

MALVERN, Pa., July 09, 2025 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced three new Gen 3 650 V and 1200 V silicon carbide (SiC) Schottky diodes in the compact, low profile SlimSMA HV (DO-221AC) package. Featuring a merged PIN Schottky (MPS) design and minimum creepage distance of 3.2 mm, the 1 A VS-3C01EJ12-M3 and 2 A VS-3C02EJ07-M3 and VS-3C02EJ12-M3 combine low capacitive charge with temperature-invariant switching behavior to increase efficiency in high speed, hard-switching power designs.

For high voltage applications, the high creepage distance of the Vishay Semiconductors devices released today provides improved electrical isolation, while their SlimSMA HV package features a molding compound with a high CTI ≥ 600 to ensure excellent electrical insulation. For space-constrained designs, the diodes offer a low profile of 0.95 mm compared to 2.3 mm for competing SMA and SMB packages with a similar footprint.

Unlike silicon diodes, the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 maintain a low capacitive charge down to 7.2 nC irrespective of temperature, resulting in faster switching speeds, reduced power losses, and improved efficiency for high frequency applications. In addition, the devices have virtually no recovery tail, which further improves efficiency, while their MPS structure delivers a reduced forward voltage drop down to 1.30 V.

With a high operating temperature of +175 °C, typical applications for the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 will include bootstrap, anti-parallel, and PFC diodes for DC/DC and AC/DC converters in server power supplies; energy generation and storage systems; industrial drives and tools; and X-ray generators. For easy paralleling in these applications, the devices offer a positive temperature coefficient.

RoHS-compliant and halogen-free, the diodes feature a Moisture Sensitivity Level of 1 in accordance with J-STD-020 and meet the JESD 201 class 2 whisker test.

Device Specification Table:

Part #VS-3C01EJ12-M3VS-3C02EJ07-M3VS-3C02EJ12-M3
IF (A)122
VR (V)12006501200
VF at IF (V)1.351.301.35
IR at VR at 175 C (μA)4.52.05.0
QC (nC)7.57.213
ConfigurationSlimSMA HV (DO-221AC)
PackageSingle
 

Samples and production quantities of the new SiC diodes are available now, with lead times of 14 weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

Link to product photo:
https://www.flickr.com/photos/vishay/albums/72177720327323868

Links to datasheets:
http://www.vishay.com/ppg?97284 (VS-3C01EJ12-M3)
http://www.vishay.com/ppg?97287 (VS-3C02EJ07-M3)
http://www.vishay.com/ppg?97286 (VS-3C02EJ12-M3)

For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com


FAQ

What are the key specifications of Vishay's new Gen 3 SiC Schottky diodes?

The new diodes include 1A and 2A models with 650V and 1200V options, featuring low capacitive charge down to 7.2 nC, operating temperature of +175°C, and minimum creepage distance of 3.2mm.

What applications are VSH's new SiC Schottky diodes designed for?

The diodes are designed for DC/DC and AC/DC converters in server power supplies, energy generation and storage systems, industrial drives and tools, and X-ray generators.

What are the advantages of Vishay's new SlimSMA HV package?

The SlimSMA HV package offers a low profile of 0.95mm (vs 2.3mm for competitors), improved electrical isolation with 3.2mm creepage distance, and high CTI ≥ 600 for excellent electrical insulation.

When will Vishay's new SiC Schottky diodes be available?

The diodes are available now for both samples and production quantities, with lead times of 14 weeks.