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Qtrex Quantum Ltd. received a commercial purchase order from a leading international government-owned company for customized proprietary Shielded RF Monolithic components used in advanced RF and electromagnetic systems that support quantum computing infrastructure. The order followed extensive testing and qualification of sample components provided by the company.
The components will be manufactured in-house using Qtrex Quantum’s proprietary Additively Manufactured Electronics technology, with production already underway and delivery expected within days. The company presents this direct supply of application-specific components as a strategic blueprint for the broader quantum ecosystem and notes that the customer has identified potential needs for additional quantities, broader deployment and a follow-on program, subject to future purchase orders, program requirements and approvals.
Inspira Technologies OXY B.H.N. Ltd investor Joe Ronen Hayon reports beneficial ownership of 28,500 ordinary shares, representing 0.1% of the company’s ordinary share class. This percentage is based on 55,406,688 ordinary shares outstanding.
Hayon holds sole voting power and sole dispositive power over all 28,500 shares, with no shared voting or dispositive authority. The position is reported as ownership of 5 percent or less of Inspira Technologies’ ordinary shares.
QTREX Quantum Ltd. reported a new controlled-conductivity cryogenic microwave interconnect architecture aimed at reducing heat conduction while maintaining signal performance in superconducting quantum computing systems. The design treats electrical conductivity as an engineering parameter for both signal transmission and thermal behavior in ultra-low-temperature environments.
The Company has filed a U.S. provisional patent application for this technology, which leverages the Wiedemann–Franz Law and QTREX’s vertically integrated AME-based manufacturing process to tailor material properties from chemistry through final component. QTREX notes strong industry interest, with an existing collaborator expected to begin technical evaluation of the architecture as early as next week, and reminds readers that these statements are forward-looking and subject to risks.
Qtrex Quantum Ltd. announced a major technical milestone in quantum processor interfaces. The company has produced a cryogenic chip carrier using its proprietary single-build Additively Manufactured Electronics (AME) process, based on a design from a large U.S.-based quantum computing technology company.
This carrier extends QTREX’s AME platform into the processor-interface layer, aiming to handle dense signal routing, shielding and low thermal load in cryogenic environments. QTREX plans to move into customer-specific carrier designs tailored to individual processor architectures and to present its sample in private meetings around Quantum.Tech World 2026 in Boston.
Qtrex Quantum Ltd. reports that Nasdaq has confirmed the company has regained compliance with its listing standards for both minimum bid price and market value of listed securities. For the 11 consecutive business days from May 26 through June 9, 2026, the closing bid price of its ordinary shares was at or above $1.00 per share, and its market value of listed securities was $35,000,000 or greater, closing both deficiency matters. The report is also incorporated by reference into the company’s existing Form F-3 and Form S-8 registration statements.
QTREX Quantum Ltd. reported that the Israel Innovation Authority has awarded it an approximately $1 million government grant. The funding will support development of a purpose-built RF dielectric material designed for high-density, low-loss signal routing in superconducting quantum computing systems.
The material is being engineered as a native layer within QTREX’s quantum connectivity architecture, so the dielectric, conductor and 3D geometry can be optimized together. The company positions this as addressing a key bottleneck in scaling superconducting quantum computers, where more qubits require more RF lines, tighter packaging and lower thermal impact.