[6-K] SAIHEAT Ltd Current Report (Foreign Issuer)
SAIHEAT Limited reported that it has secured a patent titled “Waste Heat Recovery System and Method.” This patent relates to recovering waste heat from chip cooling processes, an area the company describes as part of its waste heat recovery and green development efforts. The move is framed as supporting both environmentally focused operations and an upgrade of the company’s research and development through technological innovation.
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FAQ
What did SAIHEAT Limited (SAIH) announce in its November 2025 Form 6-K?
SAIHEAT Limited announced that it has secured a patent titled “Waste Heat Recovery System and Method,” related to chip cooling waste heat recovery and green development.
What is the focus of SAIHEAT Limited’s new patent?
The patent focuses on a “Waste Heat Recovery System and Method” aimed at recovering waste heat in the chip cooling field.
How does this patent relate to SAIHEAT Limited’s green development goals?
The patent is described as deepening the company’s role in chip cooling waste heat recovery and empowering its green development efforts through technological innovation.
How is SAIHEAT Limited linking this patent to its R&D strategy?
The company presents the patent as helping to empower an upgrade of its research and development activities through technological innovation.
When was the SAIHEAT Limited Form 6-K regarding the patent signed?
The Form 6-K was signed on November 17, 2025 by Chief Executive Officer Jianwei Li.
Who signed SAIHEAT Limited’s November 2025 Form 6-K?
The report was signed by Jianwei Li, the Chief Executive Officer of SAIHEAT Limited.