Sony Group (NYSE: SONY) and TSMC plan JV for next-gen image sensors
Rhea-AI Filing Summary
Sony Group Corporation, via its wholly owned unit Sony Semiconductor Solutions, has signed a non-binding memorandum of understanding with TSMC to pursue a strategic partnership for next-generation image sensors. The parties intend to create a joint venture in Sony’s new fab in Koshi City, Kumamoto, with Sony as majority and controlling shareholder.
The prospective JV would combine Sony’s sensor design capabilities with TSMC’s process technology and manufacturing, and is expected to support applications such as automotive and robotics in the physical AI field. Planned JV investments, together with new capital investment by Sony in its Nagasaki plant, are envisioned in phases based on market demand and potential support from the Japanese government. The impact on Sony Group’s consolidated financial results is still being evaluated and will depend on definitive agreements, which remain subject to customary conditions.
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Insights
Sony and TSMC outline a non-binding JV plan for advanced image sensors; financial impact awaits definitive terms.
The content describes a memorandum of understanding between Sony Semiconductor Solutions and TSMC to form a joint venture for next-generation image sensor development and manufacturing. Sony would hold majority and controlling ownership, using its new Kumamoto fab, while TSMC contributes process technology and manufacturing expertise.
Investments by the JV, and additional Sony capital spending in Nagasaki, are contemplated in phased deployments tied to market demand and potential Japanese government support. The parties highlight opportunities in physical AI applications, including automotive and robotics, but the agreement is explicitly non-binding and subject to definitive contracts and customary closing conditions.
The text states that the impact on Sony Group Corporation’s consolidated financial results is under evaluation and will depend on final terms. Subsequent disclosures are expected only if additional developments become material, so the current information is primarily strategic and preliminary rather than immediately financial.
Key Figures
Key Terms
non-binding memorandum of understanding regulatory
strategic partnership financial
joint venture financial
physical AI applications technical
customary closing conditions regulatory
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D. C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
For the month of May 2026
Commission File Number: 001-06439
SONY GROUP CORPORATION
(Translation of registrant’s name into English)
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
(Address of principal executive offices)
The registrant files annual reports under cover of Form 20-F.
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F,
| Form 20-F x | Form 40-F ¨ |
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
SONY GROUP CORPORATION (Registrant) | ||
| By: | /s/ Lin Tao | |
| (Signature) | ||
| Lin Tao | ||
| Chief Financial Officer | ||
Date: May 8, 2026
List of Materials
Documents attached hereto:
Sony Semiconductor Solutions Announces Preliminary Agreement with TSMC for Strategic Partnership for Next-Generation Image Sensors
May 8, 2026
Sony Group Corporation
Sony Semiconductor Solutions Announces Preliminary Agreement with TSMC for Strategic Partnership for Next-Generation Image Sensors
Sony Semiconductor Solutions Corporation, a wholly-owned subsidiary of Sony Group Corporation, today announced that it has signed a non-binding memorandum of understanding with Taiwan Semiconductor Manufacturing Company Limited to form a strategic partnership (the “Partnership”) for the development and manufacturing of next-generation image sensors. For further details, please refer to the attached press release.
The impact of the Partnership on Sony Group Corporation’s consolidated financial results will depend on the terms of the definitive agreements expected to be executed following discussions between both parties, and is currently being evaluated. Sony Group Corporation will disclose any additional material developments in a timely manner.
End of document
Sony Semiconductor Solutions and TSMC
Enter Preliminary Agreement for
Next-Generation Image Sensor Strategic Partnership
Atsugi, Japan, May 8, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the signing of a non-binding memorandum of understanding (“MOU”) to form a strategic partnership for the development and manufacturing of next-generation image sensors.
Under the proposed partnership, Sony and TSMC intend to establish a joint venture (“JV”), with Sony being the majority and controlling shareholder, to set up development and production lines in Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture. Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.
With the MOU signed, Sony and TSMC are discussing potential investments by the JV. These investments, along with new capital investment by Sony in its existing plant in Nagasaki, are being considered on the premise that they would be implemented in phases based on market demand, and that they would receive support from the Japanese government.
This partnership also seeks to explore and address emerging opportunities in physical AI applications, such as automotive and robotics, paving the way for future innovations and expanded technological advancements. The establishment of the JV remains subject to the execution of a definitive legally binding agreement regarding the partnership and the satisfaction of customary closing conditions.
“Building on the trust cultivated through our long-standing collaboration with TSMC, I am delighted that we have reached an agreement to advance our partnership to a new stage,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation. “This JV is a significant initiative that brings together the strengths of both companies and aims to drive further advancement in technology and business within the next-generation image sensor field. Building on this JV, Sony intends to further strengthen its business operations with a focus on creating high added value. Rooted in the Sony Spirit that has guided us since our founding, we intend to continue to take on the challenge of creating new markets through unprecedented ideas and distinctive technologies.”
“Sony has been our long-time partner in the CMOS image sensor business. We are excited to elevate our collaboration to the next level, which represents a key step forward in driving future sensing technology in the AI era,” said TSMC Senior Vice President and Deputy Co-COO, Dr. Kevin Zhang. “This partnership underscores our shared commitment and mutual vision of leveraging cutting-edge technologies and innovative solutions to deliver leading sensing technology and products. We look forward to working closely together to achieve impactful results and create lasting value for all stakeholders.”
About Sony Semiconductor Solutions
Sony Semiconductor Solutions Corporation is a wholly owned subsidiary of Sony Group Corporation and operates a semiconductor device business centered on image sensors. As a leading company in image sensors, it develops imaging technologies that provide convenience and enjoyment to individuals, and through advances in sensing technologies, expands the visual and recognition capabilities of people and machines, contributing to the creation of new value in society and industry. For more information, please visit: https://www.sony-semicon.com/en/.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 305 distinct process technologies, and manufactured 12,682 products for 534 customers in 2025 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.