Sony Group, TSMC set JV for next-gen image sensors

Accepted by SEC EDGAR 08/11/2026 - 06:01 AM EDT Learn about SEC filing dates

Rhea-AI Filing Summary

Sony Group Corporation, through wholly owned subsidiary Sony Semiconductor Solutions, executed a legally binding definitive agreement with TSMC to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Koshi City, Kumamoto Prefecture, Japan. The JV will focus on development and volume manufacturing of next-generation smartphone image sensors using advanced process technology.

The JV is expected to commence volume production in 2029. Sony plans to contribute approximately 465 billion yen in cash and assets via a company split, while TSMC plans cash contributions of approximately 282 billion yen, both in phases based on market demand and other conditions. Sony will be the sole controlling shareholder, and the JV is planned to be a consolidated subsidiary of Sony Group Corporation, with the Representative Director to be appointed by Sony. The partners are also considering additional investments premised on support from the Japanese government. The impact on Sony Group Corporation’s consolidated financial results for the fiscal year ending March 31, 2027 is expected to be immaterial.

Filing Explained

The agreement is legally binding, but the joint venture’s establishment and completion of the transaction still await required regulatory approvals and other customary closing conditions; the planned subsidiary and phased contributions therefore have not yet taken effect.

Key Figures

Sony JV contribution: 465 billion yen TSMC JV contribution: 282 billion yen JV production start: 2029 +1 more

4 metrics

Sony JV contribution 465 billion yen Planned phased capital contribution to the joint venture through cash and asset transfer

TSMC JV contribution 282 billion yen Planned phased cash contribution to the joint venture

JV production start 2029 Expected commencement of volume production of smartphone image sensors

Fiscal year end March 31, 2027 Period for which the partnership’s impact is expected to be immaterial to consolidated results

Key Terms

definitive agreement, consolidated subsidiary, company split, volume production, +1 more

5 terms

definitive agreement regulatory

"announced the execution of a legally binding definitive agreement"

A definitive agreement is a formal, legally binding document that outlines the final terms and conditions of a deal or transaction, such as a sale or partnership. It acts like a detailed contract that confirms all parties have agreed on the key details, making the deal official. For investors, it signals that the agreement is settled and moving toward completion, providing clarity and security about the transaction.

consolidated subsidiary financial

"the JV is planned to operate as a consolidated subsidiary"

A consolidated subsidiary is a company that a parent company controls and therefore includes, line-by-line, in the parent’s consolidated financial statements. Control is usually shown by owning a majority of voting shares or having the power to direct the subsidiary’s activities; the parent combines the subsidiary’s assets, liabilities, income and expenses with its own, eliminates intercompany transactions, and reports any ownership by outside shareholders as a noncontrolling (minority) interest.

company split regulatory

"transfer of its assets* through a company split"

volume production technical

"The JV is expected to commence volume production in 2029"

advanced process technology technical

"utilizing advanced manufacturing process technology"

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What did Sony Group (SONY) announce regarding its partnership with TSMC?

Sony Group, via Sony Semiconductor Solutions, signed a definitive agreement with TSMC to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Japan focused on next-generation smartphone image sensor development and volume manufacturing using advanced process technology.

How much will Sony Group (SONY) and TSMC invest in the new image sensor joint venture?

Sony plans to contribute approximately 465 billion yen to the JV through cash and asset transfer via a company split. TSMC plans phased cash contributions of approximately 282 billion yen, with both contributions tied to market demand and business conditions.

When is the Sony Group (SONY) and TSMC joint venture expected to begin volume production?

The joint venture is expected to commence volume production in 2029. It will serve as a core hub for development and manufacturing of image sensors for smartphones, leveraging Sony’s image sensor expertise and TSMC’s advanced manufacturing process technology.

How will the new joint venture affect Sony Group’s (SONY) financial results?

Sony states that the impact of the partnership, including the JV, on its consolidated financial results for the fiscal year ending March 31, 2027 is expected to be immaterial, indicating no significant near-term earnings effect from this initiative.

What level of control will Sony Group (SONY) have over the new image sensor joint venture?

Sony will be the sole controlling shareholder, and the JV is planned as a consolidated subsidiary of Sony Group Corporation. Sony will appoint the Representative Director and lead core image sensor technology development, product planning, and product design.

Where will the Sony Group (SONY) and TSMC image sensor joint venture be located?

The joint venture, Advanced Vision Semiconductor Manufacturing Corporation, will be established in Koshi City, Kumamoto Prefecture, Japan. Sony’s newly constructed fab in Koshi City, in which it has already invested, will be transferred to the JV through a company split.

AI-generated analysis. How Rhea-AI works. Not financial advice.

Form 6-K: How Foreign Companies Report to the SEC →

See more from StockTitan in Google Search and AI answers. Adds StockTitan as a preferred source · opens Google

Add on Google Not now

SECURITIES AND EXCHANGE COMMISSION

WASHINGTON, D. C. 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER

Pursuant to Rule 13a-16 or 15d-16 of

the Securities Exchange Act of 1934

For the month of August 2026

Commission File Number: 001-06439

SONY GROUP CORPORATION

(Translation of registrant’s name into English)

1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN

(Address of principal executive offices)

The registrant files annual reports under cover of Form 20-F.

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F,

Form 20-F x Form 40-F ¨

SIGNATURE

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	SONY GROUP CORPORATION (Registrant)
	By:	/s/ Lin Tao
		(Signature)
	Lin Tao
	Chief Financial Officer

Date: August 11, 2026

List of Materials

Documents attached hereto:

Sony Semiconductor Solutions Announces Signing of Definitive Agreement with TSMC for Establishment of Joint Venture.

August 11, 2026

Sony Group Corporation

Sony Semiconductor Solutions Announces Signing of Definitive Agreement with TSMC for Establishment of Joint Venture

Based on the memorandum of understanding announced on May 8, 2026, Sony Semiconductor Solutions Corporation (“Sony”), a wholly-owned subsidiary of Sony Group Corporation, and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) have proceeded with discussions regarding a strategic partnership (the “Partnership”) for the development and manufacturing of next-generation image sensors, including the establishment of a joint venture (“JV”). Today, Sony announced that it has signed a legally binding definitive agreement for the establishment of the JV with TSMC. For further details, please refer to the attached press release. As disclosed on May 8, 2026, potential investments by the JV and new capital investments by Sony in its existing plant in Nagasaki, Japan continue to be discussed in a flexible manner on the premise that they would receive support from the Japanese government.

The impact of the Partnership on Sony Group Corporation’s consolidated financial results for the fiscal year ending March 31, 2027 is expected to be immaterial.

 

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture

for Next-Generation Image Sensors

Atsugi, Japan and HSINCHU, Taiwan, R.O.C., August 11, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan. The JV will serve as a core hub for the development and manufacturing activities required for the volume production of image sensors for smartphones utilizing advanced manufacturing process technology. The JV is expected to commence volume production in 2029.

Sony will be the sole controlling shareholder and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation. The Representative Director of the JV is planned to be appointed by Sony.

Pursuant to the definitive agreement, Sony plans to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets^* through a company split. TSMC plans to make cash contributions of approximately 282 billion yen. These capital contributions are expected to be made in phases based on market demand and other relevant business conditions. In addition to these capital contributions by Sony and TSMC, investments required to realize the production capacity planned by the JV are being considered on the premise that they would receive support from the Japanese government.

Under the strategic partnership, Sony intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design. The JV plans to leverage TSMC’s advanced process technology and manufacturing expertise to drive development and manufacturing activities required for the volume production. Through this collaboration, the companies intend to accelerate the commercialization of image sensor products driven by customer needs while advancing technological innovation and strengthening manufacturing capacity.

The establishment of the JV and completion of the transaction are subject to the receipt of required regulatory approvals and the satisfaction of other customary closing conditions.

All other aspects of the partnership remain unchanged from the announcement by Sony and TSMC titled “Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026.

* Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture, Japan, in which Sony has already invested.

About Sony Semiconductor Solutions

Sony Semiconductor Solutions Corporation is a wholly owned subsidiary of Sony Group Corporation and operates a semiconductor device business centered on image sensors. As a leading company in image sensors, it develops imaging technologies that provide convenience and enjoyment to individuals, and through advances in sensing technologies, expands the visual and recognition capabilities of people and machines, contributing to the creation of new value in society and industry.
For more information, please visit: https://www.sony-semicon.com/en/.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 305 distinct process technologies, and manufactured 12,682 products for 534 customers in 2025 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.