SECURITIES
AND EXCHANGE COMMISSION
WASHINGTON,
D. C. 20549
FORM 6-K
REPORT
OF FOREIGN PRIVATE ISSUER
Pursuant
to Rule 13a-16 or 15d-16 of
the
Securities Exchange Act of 1934
For
the month of August 2026
Commission
File Number: 001-06439
SONY
GROUP CORPORATION
(Translation
of registrant’s name into English)
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
(Address
of principal executive offices)
The
registrant files annual reports under cover of Form 20-F.
Indicate
by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F,
SIGNATURE
Pursuant
to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by
the undersigned, thereunto duly authorized.
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SONY
GROUP CORPORATION
(Registrant) |
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|
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By: |
/s/
Lin Tao |
| |
|
(Signature) |
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Lin Tao |
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Chief Financial Officer |
Date: August
11, 2026
List
of Materials
Documents attached
hereto:
Sony Semiconductor Solutions Announces Signing of Definitive Agreement with TSMC for Establishment of Joint Venture.
August 11, 2026
Sony Group Corporation
Sony Semiconductor Solutions Announces Signing
of Definitive Agreement with TSMC for Establishment of Joint Venture
Based on the memorandum of understanding announced
on May 8, 2026, Sony Semiconductor Solutions Corporation (“Sony”), a wholly-owned subsidiary of Sony Group Corporation,
and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) have proceeded with discussions regarding a strategic partnership
(the “Partnership”) for the development and manufacturing of next-generation image sensors, including the establishment of
a joint venture (“JV”). Today, Sony announced that it has signed a legally binding definitive agreement for the establishment
of the JV with TSMC. For further details, please refer to the attached press release. As disclosed on May 8, 2026, potential investments
by the JV and new capital investments by Sony in its existing plant in Nagasaki, Japan continue to be discussed in a flexible manner on
the premise that they would receive support from the Japanese government.
The impact of the Partnership on Sony Group Corporation’s
consolidated financial results for the fiscal year ending March 31, 2027 is expected to be immaterial.
Sony Semiconductor Solutions and TSMC Agreed
to Establish Joint Venture
for Next-Generation Image Sensors
Atsugi, Japan and HSINCHU, Taiwan,
R.O.C., August 11, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor
Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding
definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture
(“JV”) in Koshi City, Kumamoto Prefecture, Japan. The JV will serve as a core hub for the development and manufacturing
activities required for the volume production of image sensors for smartphones utilizing advanced manufacturing process technology.
The JV is expected to commence volume production in 2029.
Sony will be the sole controlling shareholder
and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation. The Representative Director of the JV is planned
to be appointed by Sony.
Pursuant to the definitive agreement, Sony plans
to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets*
through a company split. TSMC plans to make cash contributions of approximately 282 billion yen. These capital contributions are expected
to be made in phases based on market demand and other relevant business conditions. In addition to these capital contributions by Sony
and TSMC, investments required to realize the production capacity planned by the JV are being considered on the premise that they would
receive support from the Japanese government.
Under the strategic partnership, Sony
intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design. The
JV plans to leverage TSMC’s advanced process technology and manufacturing expertise to drive development and manufacturing activities
required for the volume production. Through this collaboration, the companies intend to accelerate the commercialization of image sensor
products driven by customer needs while advancing technological innovation and strengthening manufacturing capacity.
The establishment of the JV and completion
of the transaction are subject to the receipt of required regulatory approvals and the satisfaction of other customary closing conditions.
All other aspects of the partnership remain unchanged from the announcement by Sony and TSMC titled “Sony Semiconductor Solutions
and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026.
* Sony’s newly constructed fab in Koshi
City, Kumamoto Prefecture, Japan, in which Sony has already invested.
About Sony Semiconductor Solutions
Sony Semiconductor Solutions Corporation is a
wholly owned subsidiary of Sony Group Corporation and operates a semiconductor device business centered on image sensors. As a leading
company in image sensors, it develops imaging technologies that provide convenience and enjoyment to individuals, and through advances
in sensing technologies, expands the visual and recognition capabilities of people and machines, contributing to the creation of new
value in society and industry.
For more information, please visit: https://www.sony-semicon.com/en/.
About TSMC
TSMC pioneered the pure-play foundry business
model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports
a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America,
TSMC serves as a committed corporate citizen around the world.
TSMC deployed 305 distinct process technologies,
and manufactured 12,682 products for 534 customers in 2025 by providing the broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.