TSMC approves up to $500M each for OpenAI, Anthropic
The board approved no more than US$500 million for an investment company and investments not to exceed US$500 million each in Anthropic and OpenAI.
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Form Type
6-K
Rhea-AI Filing Summary
Taiwan Semiconductor Manufacturing Company Limited (TSM) approved its 2026 third-quarter business report and financial statements, reporting consolidated revenue of NT$1,494.24 billion, net income of NT$763.06 billion and diluted EPS of NT$29.43. The board approved a NT$9.0 per-share cash dividend; the common-shareholder record date is March 17, 2027, the ex-dividend date is March 11, 2027, and payment is scheduled for April 8, 2027. For ADSs, the ex-dividend and record date is March 11, 2027.
The board approved approximately US$40,926.70 million in capital appropriations, mainly for advanced technology and packaging capacity, fab construction and facility systems, and 2027 R&D, sustaining capital expenditures and capitalized leased assets. It also approved an investment of no more than US$500 million to establish an investment company for strategic investments in the semiconductor industry and related ecosystem.
Separate approvals authorize investments of not to exceed US$500 million in Anthropic common shares at its per-share initial public offering price and not to exceed US$500 million in OpenAI preferred stock.
Key Figures
Third-quarter consolidated revenue: NT$1,494.24 billion
Third-quarter net income: NT$763.06 billion
Diluted earnings per share: NT$29.43
+5 more
8 metrics
Third-quarter consolidated revenue
NT$1,494.24 billion
Third quarter of 2026
Third-quarter net income
NT$763.06 billion
Third quarter of 2026
Diluted earnings per share
NT$29.43
Third quarter of 2026
Cash dividend
NT$9.0 per share
Third quarter of 2026
Capital appropriations
Approximately US$40,926.70 million
Approved for capacity, facilities and 2027 capital investments
Investment to establish an investment company
No more than US$500 million
Strategic investments in the semiconductor industry and related ecosystem
Anthropic common shares investment
Not to exceed US$500 million
At Anthropic’s per-share initial public offering price
OpenAI preferred stock investment
Not to exceed US$500 million
Board-approved investment
Key Terms
capital appropriations, advanced packaging, pure-play foundry, American Depositary Shares (ADSs)
4 terms
capital appropriations financial
"approved capital appropriations of approximately US$40,926.70 million"
advanced packaging technical
"Installation and upgrade of advanced packaging"
Advanced packaging describes modern methods for arranging, connecting and enclosing semiconductor chips so they work together more efficiently in a smaller space—think of stacking and wiring tiny electronic building blocks instead of leaving them as separate items on a circuit board. It matters to investors because these techniques can boost product speed, reduce power use, shrink device size and lower manufacturing costs, all of which influence a maker’s competitiveness, profit margins and market share.
pure-play foundry technical
"pioneered the pure-play foundry business model"
FAQ
AI-generated questions and answers. How Rhea-AI works. Not financial advice.
What dividend did TSMC approve for the third quarter of 2026?
TSMC approved a NT$9.0 per-share cash dividend, payable April 8, 2027. The common-shareholder record date is March 17, 2027, and the ex-dividend date is March 11, 2027; for ADSs, both the ex-dividend and record date are March 11, 2027.
How much did TSMC approve for capital appropriations?
The board approved approximately US$40,926.70 million in capital appropriations, mainly for capacity installation and upgrades, fab construction and facility systems, and 2027 R&D, sustaining capital expenditures and capitalized leased assets.
What investments did TSMC approve in Anthropic and OpenAI?
The board approved an investment in Anthropic common shares not to exceed US$500 million, at Anthropic’s per-share initial public offering price, and an investment in OpenAI preferred stock not to exceed US$500 million.
AI-generated analysis. How Rhea-AI works. Not financial advice.
1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of November 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F x Form 40-F o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1): o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7): o
| SIGNATURES | |||||||||||||||||||||||
| Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. | |||||||||||||||||||||||
| Taiwan Semiconductor Manufacturing Company Limited | ||||||||||||||
| Date: November 10, 2026 | By | /s/ Wendell Huang | ||||||||||||
| Wendell Huang | ||||||||||||||
| Senior Vice President and Chief Financial Officer | ||||||||||||||
TSMC Board of Directors Meeting Resolutions
HSINCHU, Taiwan, R.O.C., Nov. 10, 2026 – The TSMC (TWSE: 2330, NYSE: TSM) Board of Directors today held a meeting, which passed the following resolutions:
1.Approved the 2026 third quarter Business Report and Financial Statements. Third quarter consolidated revenue was NT$1,494.24 billion and net income was NT$763.06 billion, with diluted earnings per share of NT$29.43.
2.Approved the distribution of a NT$9.0 per share cash dividend for the third quarter of 2026, and set March 17, 2027 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be March 11, 2027. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (March 13 through March 17, 2027) for registration transfer, and the dividend will be paid on April 8, 2027. The ex-dividend date and the record date for entitlement to participate in this cash dividend distribution for TSMC American Depositary Shares (ADSs) will be March 11, 2027.
3.To meet long-term capacity plans based on market demand forecasts and TSMC’s technology development roadmap, the Board approved capital appropriations of approximately US$40,926.70 million for purposes mainly including: (1) Installation and upgrade of advanced technology capacity; (2) Installation and upgrade of advanced packaging, mature and/or specialty technology capacity; (3) Fab construction, and installation of fab facility systems; (4) 2027 R&D capital investments, sustaining capital expenditures, and capitalized leased assets.
4.Approved the investment of no more than US$500 million in the establishment of an investment company for the purpose of making strategic investments in the semiconductor industry and related ecosystem.
5.Approved the investments in (1) Anthropic, PBC at its per share initial public offering price in an amount not to exceed US$500 million to acquire Anthropic’s common shares; and (2) OpenAI Group PBC in an amount not to exceed US$500 million to acquire OpenAI’s preferred stock.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.
With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 305 distinct process technologies, and manufactured 12,682 products for 534 customers in 2025 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
# # #
| TSMC Spokesperson: | Media Contacts: | |||||||||||||
| Wendell Huang Senior Vice President and CFO | Nina Kao Head of Public Relations Tel: 886-3-5636688 ext.7125036 Mobile: 886-988-239-163 E-Mail: press@tsmc.com | Baker Li Public Relations Tel: 886-3-5636688 ext.7125037 Mobile: 886-988-932-757 E-Mail: press@tsmc.com | ||||||||||||
Taiwan Semiconductor Manufacturing Company Limited
This is to report the major financials for the nine months ended September 30, 2026 approved by the TSMC Board of Directors. All figures were prepared in accordance with TIFRS on a consolidated basis. | ||||||||
(In NT$ thousands, except for EPS) | ||
Comprehensive Income Statements Items (for the nine months ended September 30, 2026) | |||||
| Net sales | 3,898,726,974 | ||||
| Gross profit | 2,603,984,766 | ||||
| Income from operations | 2,302,013,957 | ||||
| Income before tax | 2,461,268,543 | ||||
| Net income | 2,042,923,054 | ||||
| Net income attributable to shareholders of the parent | 2,042,106,112 | ||||
| Basic EPS (NT$) | 78.75 | ||||
Balance Sheets Items (as of September 30, 2026) | |||||
| Total assets | 10,052,887,514 | ||||
| Total liabilities | 3,009,660,084 | ||||
| Equity attributable to shareholders of the parent | 6,997,901,424 | ||||