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Taiwan Semiconductor Manufacturing Company Limited (TSMC) filed a Form 6-K highlighting a new strategic step with Sony Semiconductor Solutions. The two companies signed a non-binding memorandum of understanding to form a joint venture for developing and manufacturing next-generation image sensors.
Under the proposal, Sony would be the majority and controlling shareholder of the JV, which would set up development and production lines in Sony’s new fab in Koshi City, Kumamoto Prefecture. The partnership intends to combine Sony’s image sensor design capabilities with TSMC’s process technology and manufacturing strengths, targeting improved sensor performance and emerging physical AI uses in areas such as automotive and robotics.
Potential JV investments and additional capital spending by Sony in its Nagasaki plant are being discussed, with phased implementation based on market demand and expected support from the Japanese government. The JV’s creation remains subject to a definitive legally binding agreement and customary closing conditions.
Taiwan Semiconductor Manufacturing Company Limited reported strong April 2026 revenue momentum. On a consolidated basis, net revenue for April 2026 was approximately NT$410.73 billion, down 1.1% from March 2026 but up 17.5% from April 2025, showing solid year-on-year growth despite a slight month-on-month dip.
Net revenue for January through April 2026 totaled NT$1,544.83 billion, a 29.9% increase versus the same period in 2025, indicating robust demand early in the year. The company also disclosed intercompany lending limits and balances, guarantees for key subsidiaries, and foreign-exchange derivative positions with both realized losses and unrealized gains.
Taiwan Semiconductor Manufacturing Co. VP Bor-Zen Tien reported open-market purchases of 20 American Depositary Shares (ADS) of TSM on April 28, 2026, at prices of 390.0000 and 386.0000 per ADS.
Following these trades, Tien directly holds 80 ADS, plus 9,051 Common Shares (2330.TW) directly and additional Common Shares held indirectly by an immediate family member and under an Employee Stock Purchase Plan (ESPP) Trust. Each ADS represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported updated holdings and an early redemption of a derivative note. The filing shows indirect ownership of 53 Common Shares by an immediate family member and 101 Common Shares held through an Employee Stock Purchase Plan trust, plus direct holdings of 9,051 Common Shares and 70 American Depositary Shares.
The Equity Linked Notes, with a principal amount of US$20,000 and referencing a basket that includes the company’s American Depositary Shares, were redeemed early for cash on April 24, 2026, before their June 3, 2026 exercisable/expiration date. No open-market share purchases or sales are reported.
Taiwan Semiconductor Manufacturing Company Limited reports routine corporate updates for March 2026, including changes in insider shareholdings and a new unsecured bond issuance. Senior leaders such as Chairman & CEO C.C. Wei increased their TSMC shareholdings; his position rose from 7,917,270 to 8,152,610 shares, an increase of 235,340 shares. Several executive vice presidents and vice presidents also recorded modest share increases.
TSMC issued unsecured corporate bonds under Issuance 115-1 totaling NT$17.2 billion, split into a NT$12.6 billion tranche due March 2031 with a 1.72% coupon and a NT$4.6 billion tranche due March 2036 with a 1.78% coupon. The bonds use bullet repayment with interest payable annually. The company did not cancel any common shares during the month.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) explains how its 2025 results differ under Taiwan-IFRSs and IFRSs issued by the IASB. Under Taiwan-IFRSs, TSMC reported net income attributable to shareholders of NT$1,717,883 million and basic earnings per share of NT$$66.26 in 2025.
For its Form 20-F, prepared under IFRSs issued by the IASB, TSMC reported net income attributable to shareholders of NT$1,697,604 million and basic and diluted earnings per share of NT65.47 in 2025. The company states that the main difference arises from the timing of recognition of R.O.C. tax on unappropriated earnings.
Taiwan Semiconductor Manufacturing Company (TSMC) reported very strong first quarter 2026 results. Revenue reached NT$1,134.10 billion (US$35.90 billion), up 35.1% year-over-year, while net income rose 58.3% to NT$572.48 billion and diluted EPS was NT$22.08.
Profitability was very high, with gross margin of 66.2%, operating margin of 58.1%, and net profit margin of 50.5%. Advanced technologies at 7-nanometer and below generated 74% of wafer revenue, led by 5-nanometer at 36% and 3-nanometer at 25%.
Management expects second quarter 2026 revenue between US$39.0 billion and US$40.2 billion, with gross margin of 65.5%–67.5% and operating margin of 56.5%–58.5%. They also expect 2026 revenue to increase by above 30% in US dollar terms, reflecting continued strong demand for leading-edge process technologies.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) files its annual Form 20‑F describing strong 2025 growth, rising global risks, and major capacity investments. Net revenue reached NT$3,809,054 million, up from NT$2,894,308 million in 2024, led by High Performance Computing and smartphone demand.
High Performance Computing generated NT$2,192,931 million, or 58% of revenue, while smartphones contributed 29%. North America accounted for 75% of net revenue. TSMC’s annual capacity exceeded 17 million 12‑inch equivalent wafers, supported by advanced 3‑nanometer and 2‑nanometer nodes and new fabs in the U.S., Japan and Germany.
The report highlights extensive geopolitical, trade, export‑control, cybersecurity, environmental and supply‑chain risks, as well as customer concentration and utility constraints. Capital expenditures reached NT$1,272,411 million in 2025, with 2026 capex planned at US$52–56 billion focused on 2‑nanometer and 3‑nanometer capacity, specialty technologies and advanced packaging.
Taiwan Semiconductor Manufacturing Co. (TSM) vice president Yoo Chue-San reported a small open-market purchase of common shares through the company’s Employee Stock Purchase Plan. On the transaction date, 65 common shares (2330.TW) were bought at $57.87 per share by the ESPP administrator on the filer’s behalf under predetermined plan terms.
Following this transaction, indirect holdings through the ESPP trust totaled 6,431 shares1,797,614 common shares
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Lipen Yuan reported an open-market purchase of 52 Common Shares (2330.TW) at $57.87 per share. The shares were bought in U.S. dollar terms by the administrator of the company’s Employee Stock Purchase Plan under predetermined terms.
After this transaction, 1,092 shares are held indirectly through the ESPP trust, 3,000 shares are held directly, and 1,650 shares are held indirectly by the spouse, giving a clearer picture of Yuan’s combined economic exposure to TSM common shares.