Axcelis Announces Multiple New Penetrations and Follow-on Shipments of Purion Power Series Implanters to Silicon Carbide Chipmakers Globally
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Rhea-AI Summary
Axcelis Technologies, Inc. (NASDAQ: ACLS) announced significant shipments of its Purion Power Series™ ion implanter systems to silicon carbide (SiC) power device manufacturers across Asia, Europe, and the U.S. These advanced systems, including the Purion H200™, Purion XE™, and Purion M™, support high-volume production for electric vehicle applications. The company forecasts that power device shipments will account for 35% to 40% of total system shipments in 2022, with further growth anticipated in 2023. CEO Mary Puma noted the rapid growth in the SiC power device market, driven by the shift toward electric vehicles.
Positive
- Significant shipments of Purion Power Series™ ion implanters to SiC chipmakers, indicating strong demand.
- Forecasts power device market will represent 35% to 40% of total system shipments, showing growth potential.
- Strong positioning in the growing electric vehicle market.
Negative
- Forward-looking statements include risks that actual results may differ, raising uncertainty for investors.
Details
News Market Reaction – ACLS
The recorded move for ACLS in the trading session of this news was -3.76%.
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President and CEO
Safe Harbor Statement
This press release contains forward-looking statements under the Private Securities Litigation Reform Act safe harbor provisions. These statements, which include our expectations for shipments to customers, are based on management's current expectations and should be viewed with caution. They are subject to various risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements, many of which are outside the control of the Company, including that customer decisions to place orders or our product shipments may not occur when we expect, that orders may not be converted to revenue in any particular quarter, or at all, whether demand will continue for the semiconductor equipment we produce or, if not, whether we can successfully meet changing market requirements, and whether we will be able to maintain continuity of business relationships with and purchases by major customers. Increased competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and instability caused by changing global economic, political or financial conditions could also cause actual results to differ materially from those in our forward-looking statements. These risks and other risk factors relating to
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