Axcelis Announces Multiple Shipments of Purion H200 SiC Power Series Implanters to Leading Power Device Chipmakers in Europe and Asia
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President and CEO Dr. Russell Low commented, "The power device market continues to grow rapidly and is a key driver of our growth globally. We are pleased to continue to support our customers' fab capacity expansion with our market leading Purion Power Series ion implanters."
Executive Vice President of Marketing and Applications Dr. Greg Redinbo stated, "Device fabrication in this segment requires high implant capital intensity for processes that require higher energy implants and higher dose implants. The Purion H200 SiC provides chipmakers with these capabilities, allowing them to optimize their fab productivity and power device performance."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
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Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
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SOURCE Axcelis Technologies, Inc.