Axcelis Announces Participation in Advanced Semiconductor Manufacturing Conference (ASMC)

Rhea-AI Summary

Axcelis Technologies (NASDAQ: ACLS) announced its sponsorship and participation in the Advanced Semiconductor Manufacturing Conference (ASMC) scheduled for May 5-8, 2025, in Albany, New York. The company will present research on particle control for low-energy boron implantation in Session 5: Contamination Free Manufacturing.

Dr. Phillip Geissbuhler, Staff Scientist at Axcelis, will present findings from a collaborative study with SK Hynix on May 6, 2025. The presentation focuses on new hardware implementation that reduces particle contamination during low-energy boron implants by increasing ion beam angles to enhance self-sputtering of films. This innovation significantly reduces film buildup on surfaces near implanted wafers, addressing a critical yield-impacting issue in semiconductor manufacturing.

Positive

• Technical collaboration with major chip manufacturer SK Hynix demonstrates strong industry partnerships
• Innovation in particle control technology addresses critical yield-improvement needs in semiconductor manufacturing

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• None.

BEVERLY, Mass., April 24, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will be a sponsor for the Advanced Semiconductor Manufacturing Conference (ASMC) on May 5-8, 2025, at the Hilton Albany, in Albany, New York. This event brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies.

Axcelis will present in Session 5: Contamination Free Manufacturing:
May 6, 2025, 3:40 p.m. - 4:00 p.m.
Particle Control for Low-Energy Boron Implantation
Presented by Dr. Phillip Geissbuhler, Staff Scientist, Axcelis Technologies
Coauthors: David Burtner, David Free, Kevin Wenzel, Luke Kim, Dae Yun Kim, BuMin Son (Axcelis Technologies), HunKyu Cha, SangHyun Na (SK Hynix)

Abstract: We present a case study describing how particles added to wafers during dedicated low-energy boron (LEB) implants can be reduced by the implementation of new hardware to reduce the buildup of boron films on beamline components. The new hardware increases the ion beam angle of incidence on beamline component surfaces to enhance self-sputtering of films and significantly reduces the film growth rate on surfaces near the wafer being implanted. This is important because film growth can lead to delamination which is a particle source. Particle adders can reduce device yields.

President and CEO Russell Low, said, "We're pleased to be a part of ASMC 2025 and especially excited about presenting our work on contamination control, which is the result of a technical collaboration with a leading device maker. Axcelis has deep technical expertise in this area, and we look forward to sharing our findings and recommendations to chipmakers that ensure pristine processes to deliver optimized device performance and yield."

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Press/Media Relations Contact: 
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com

Axcelis Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com

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SOURCE Axcelis Technologies, Inc.

FAQ

What technology breakthrough will Axcelis (ACLS) present at ASMC 2025?

Axcelis will present new hardware technology that reduces particle contamination during low-energy boron implants by enhancing self-sputtering of films, improving semiconductor manufacturing yields.

When and where is Axcelis (ACLS) presenting at ASMC 2025?

Axcelis is presenting on May 6, 2025, from 3:40-4:00 PM at the Hilton Albany in New York during Session 5: Contamination Free Manufacturing.

Who are the key collaborators in Axcelis (ACLS) particle control research?

The research is a collaboration between Axcelis Technologies team led by Dr. Phillip Geissbuhler and SK Hynix team members HunKyu Cha and SangHyun Na.

How does Axcelis (ACLS) new hardware improve semiconductor manufacturing?

The hardware increases ion beam angle of incidence on beamline components, reducing boron film buildup and preventing delamination that can cause particle contamination and reduce device yields.