Axcelis Announces Participation in Upcoming Investor Conferences
Rhea-AI Summary
Axcelis Technologies (NASDAQ: ACLS), a key player in ion implantation solutions for the semiconductor industry, announced its participation in several upcoming investor conferences.
August 22nd: 5th Annual Needham Virtual Semiconductor & SemiCap 1x1 Conference.
August 27th: Jefferies Semiconductor, IT Hardware, Communications Software and Infrastructure Summit at the Four Seasons Hotel, Chicago, IL.
August 28th: Evercore ISI 2024 Semiconductor, IT Hardware & Networking Conference at the Omni Chicago.
September 4th: Benchmark 2024 Tech/Media/Telecom Conference at the New York Athletic Club.
September 12th: B. Riley Securities Consumer & TMT Conference at the Sofitel, New York.
Management will be available for one-on-ones and small group meetings at these events.
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News Market Reaction 1 Alert
On the day this news was published, ACLS gained 11.83%, reflecting a significant positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
- The 5th Annual Needham Virtual Semiconductor & SemiCap 1x1 Conference on Thursday, August 22nd.
- The Jefferies Semiconductor, IT Hardware, Communications Software and Infrastructure Summit on Tuesday, August 27th at the Four Seasons Hotel,
Chicago, IL. - The Evercore ISI 2024 Semiconductor, IT Hardware & Networking Conference on Wednesday, August 28th at the Omni Chicago.
- The Benchmark 2024 Tech/Media/Telecom Conference on Wednesday, September 4th at the New York Athletic Club.
- The B. Riley Securities Consumer & TMT Conference on Thursday, September 12th at the Sofitel,
New York .
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
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SOURCE Axcelis Technologies, Inc.