Axcelis Announces the Launch of the Company's New GSD Ovation ES Enabling Best-in-Class High Current Batch Implant Capability for Engineered Substrates
Axcelis Technologies (NASDAQ: ACLS) has launched its new GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates.
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Rhea-AI Summary
Axcelis Technologies (NASDAQ: ACLS) has launched its new GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates. The system represents an evolution of the GSD Ovation Series platform and delivers enhanced capabilities for high current Hydrogen & Helium implant applications, including wafer splitting.
The new system offers superior flexibility and capital efficiency, featuring production-proven wafer handling capability for multiple substrate types including SiC, LiTaO3, and LiNbO3. Notable features include superior beam power, advanced wafer cooling capability, and compatibility with various substrate thicknesses and weights. The system is currently available with factory demo capabilities.
Positive
- Launch of new GSD Ovation ES system expands product portfolio for engineered substrates market
- System offers superior flexibility and handles multiple substrate types
- Built on proven GSD Ovation Series platform technology
- Immediate availability with factory demo capability
Negative
- None.
Details
News Market Reaction – ACLS
On Sep 8, the day this news came out, ACLS closed 1.50% above the previous close.
Data tracked by StockTitan Argus for the Sep 8 session.
AI-generated analysis. How Rhea-AI works. Not financial advice.
Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enables best-in-class high current Hydrogen & Helium implant capability for engineered substrate applications, including wafer splitting. The system is an evolution of the GSD Ovation Series platform, the industry benchmark for batch implanter productivity."
The GSD Ovation ES system delivers superior flexibility and capital efficiency. It provides production-proven wafer handling capability for multiple substrate types, including SiC, LiTaO3, LiNbO3, in a wide range of thickness and weights. It also offers superior beam power and wafer cooling capability. The system is available today with factory demo capability to meet customer application needs.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
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SOURCE Axcelis Technologies, Inc.
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