Axcelis Announces the Launch of the Company's New GSD Ovation ES Enabling Best-in-Class High Current Batch Implant Capability for Engineered Substrates
Axcelis Technologies (NASDAQ: ACLS) has launched its new GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates. The system represents an evolution of the GSD Ovation Series platform and delivers enhanced capabilities for high current Hydrogen & Helium implant applications, including wafer splitting.
The new system offers superior flexibility and capital efficiency, featuring production-proven wafer handling capability for multiple substrate types including SiC, LiTaO3, and LiNbO3. Notable features include superior beam power, advanced wafer cooling capability, and compatibility with various substrate thicknesses and weights. The system is currently available with factory demo capabilities.
Axcelis Technologies (NASDAQ: ACLS) ha presentato il nuovo GSD Ovation™ ES high current ion implanter, progettato specificamente per substrati ingegnerizzati. Il sistema è un’evoluzione della piattaforma GSD Ovation Series e offre capacità potenziate per applicazioni di impianto ad alta corrente con Idrogeno e Elio, inclusa la separazione dei wafer.
Il nuovo impianto garantisce maggiore flessibilità ed efficienza dell’investimento, con una gestione wafer già validata in produzione per molteplici tipi di substrato come SiC, LiTaO3 e LiNbO3. Tra le caratteristiche principali figurano una potenza del fascio superiore, sofisticate capacità di raffreddamento del wafer e compatibilità con diversi spessori e pesi dei substrati. Il sistema è attualmente disponibile con opzioni demo in fabbrica.
Axcelis Technologies (NASDAQ: ACLS) ha lanzado su nuevo GSD Ovation™ ES high current ion implanter, diseñado específicamente para sustratos engineered. El sistema representa una evolución de la plataforma GSD Ovation Series y ofrece capacidades mejoradas para aplicaciones de implantación de Hidrógeno y Helio a alta corriente, incluida la separación de obleas.
El nuevo equipo ofrece mayor flexibilidad y eficiencia de capital, con manejo de obleas probado en producción para múltiples tipos de sustratos como SiC, LiTaO3 y LiNbO3. Entre sus prestaciones destacan mayor potencia de haz, avanzada capacidad de refrigeración de obleas y compatibilidad con distintos espesores y pesos de sustrato. El sistema está disponible actualmente con demostraciones en fábrica.
Axcelis Technologies (NASDAQ: ACLS)는 엔지니어드 기판용으로 특별히 설계된 신형 GSD Ovation™ ES 고전류 이온 임플란터를 출시했습니다. 이 시스템은 GSD Ovation Series 플랫폼의 진화형으로, 웨이퍼 분할을 포함한 고전류 수소 및 헬륨 임플란트 응용에 대한 향상된 성능을 제공합니다.
새 시스템은 우수한 유연성과 자본 효율성을 제공하며, SiC, LiTaO3, LiNbO3 등 다양한 기판 유형에 대해 생산에서 검증된 웨이퍼 처리 기능을 갖추고 있습니다. 주요 특징으로는 향상된 빔 파워, 고급 웨이퍼 냉각 기능, 다양한 두께와 무게의 기판 호환성이 있으며, 현재 공장 데모 옵션으로 제공됩니다.
Axcelis Technologies (NASDAQ: ACLS) a lancé son nouveau GSD Ovation™ ES high current ion implanter, spécialement conçu pour les substrats engineering. Le système représente une évolution de la plateforme GSD Ovation Series et offre des capacités améliorées pour les applications d’implantation haute intensité en Hydrogène et Hélium, y compris le découpage (splitting) des wafers.
Le nouveau système propose une flexibilité supérieure et une efficacité du capital, avec une gestion des wafers éprouvée en production pour plusieurs types de substrats, notamment SiC, LiTaO3 et LiNbO3. Parmi les caractéristiques notables : une puissance de faisceau accrue, des capacités avancées de refroidissement des wafers et la compatibilité avec différentes épaisseurs et masses de substrats. Le système est actuellement disponible avec des démonstrations en usine.
Axcelis Technologies (NASDAQ: ACLS) hat seinen neuen GSD Ovation™ ES high current ion implanter vorgestellt, der speziell für entwickelte Substrate konzipiert ist. Das System stellt eine Weiterentwicklung der GSD Ovation Series Plattform dar und bietet verbesserte Möglichkeiten für Hochstrom-Anwendungen mit Wasserstoff- und Helium-Implantationen, einschließlich Wafer-Splitting.
Das neue System bietet überlegene Flexibilität und Kapital-effizienz und verfügt über eine in der Produktion erprobte Wafer-Handhabung für verschiedene Substrattypen wie SiC, LiTaO3 und LiNbO3. Zu den hervorstechenden Merkmalen gehören höhere Strahlleistung, fortschrittliche Wafer-Kühlung und Kompatibilität mit unterschiedlichen Substratdicken und -gewichten. Das System ist derzeit mit Werksdemonstrationen verfügbar.
- Launch of new GSD Ovation ES system expands product portfolio for engineered substrates market
- System offers superior flexibility and handles multiple substrate types
- Built on proven GSD Ovation Series platform technology
- Immediate availability with factory demo capability
- None.
Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enables best-in-class high current Hydrogen & Helium implant capability for engineered substrate applications, including wafer splitting. The system is an evolution of the GSD Ovation Series platform, the industry benchmark for batch implanter productivity."
The GSD Ovation ES system delivers superior flexibility and capital efficiency. It provides production-proven wafer handling capability for multiple substrate types, including SiC, LiTaO3, LiNbO3, in a wide range of thickness and weights. It also offers superior beam power and wafer cooling capability. The system is available today with factory demo capability to meet customer application needs.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
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SOURCE Axcelis Technologies, Inc.
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