Axcelis Announces the Launch of the Company's New GSD Ovation ES Enabling Best-in-Class High Current Batch Implant Capability for Engineered Substrates

Rhea-AI Summary

Axcelis Technologies (NASDAQ: ACLS) has launched its new GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates. The system represents an evolution of the GSD Ovation Series platform and delivers enhanced capabilities for high current Hydrogen & Helium implant applications, including wafer splitting.

The new system offers superior flexibility and capital efficiency, featuring production-proven wafer handling capability for multiple substrate types including SiC, LiTaO3, and LiNbO3. Notable features include superior beam power, advanced wafer cooling capability, and compatibility with various substrate thicknesses and weights. The system is currently available with factory demo capabilities.

Positive

• Launch of new GSD Ovation ES system expands product portfolio for engineered substrates market
• System offers superior flexibility and handles multiple substrate types
• Built on proven GSD Ovation Series platform technology
• Immediate availability with factory demo capability

Negative

• None.

BEVERLY, Mass., Sept. 8, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates.

Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enables best-in-class high current Hydrogen & Helium implant capability for engineered substrate applications, including wafer splitting. The system is an evolution of the GSD Ovation Series platform, the industry benchmark for batch implanter productivity."

The GSD Ovation ES system delivers superior flexibility and capital efficiency. It provides production-proven wafer handling capability for multiple substrate types, including SiC, LiTaO3, LiNbO3, in a wide range of thickness and weights. It also offers superior beam power and wafer cooling capability. The system is available today with factory demo capability to meet customer application needs.

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Press/Media Relations Contact: 
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com 

Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com 

 

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SOURCE Axcelis Technologies, Inc.

FAQ

What is the new product launched by Axcelis Technologies (NASDAQ: ACLS)?

Axcelis has launched the GSD Ovation™ ES high current ion implanter, specifically designed for engineered substrates with advanced Hydrogen & Helium implant capabilities.

What are the key features of Axcelis GSD Ovation ES system?

The system features superior beam power, advanced wafer cooling capability, and can handle multiple substrate types including SiC, LiTaO3, and LiNbO3 with varying thicknesses and weights.

Which substrate types are compatible with the Axcelis GSD Ovation ES?

The system is compatible with multiple substrate types including SiC, LiTaO3, and LiNbO3, offering production-proven handling capability for various thicknesses and weights.

When will the Axcelis GSD Ovation ES be available to customers?

The system is available immediately with factory demo capability to meet customer application needs.