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ACM Research Delivered Its First High-Throughput Ultra Lith KrF Track System to a Leading Chinese Logic Wafer Fab Customer

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ACM Research (NASDAQ: ACMR) has announced the successful delivery of its first Ultra Lith KrF track system to a leading Chinese logic wafer fab customer in September 2025. The new system expands ACM's lithography product line and features high-throughput performance of over 300 wafers per hour.

The system includes a flexible configuration with 12 spin coaters, 12 developers, and 54 hot plates. It incorporates proprietary backside particle removal unit (BPRV) technology and an integrated wafer-scale outlier inspection (WSOI) unit for real-time process monitoring. The platform builds upon ACM's ArF track platform, which demonstrated successful demo-line process verification in late 2024.

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Positive

  • Expansion into front-end process equipment market with new KrF track system
  • High throughput capacity exceeding 300 wafers per hour
  • Successful delivery to a leading Chinese logic wafer fab customer
  • Integration of proprietary technologies (BPRV and WSOI) for enhanced process control

Negative

  • None.

News Market Reaction 1 Alert

-1.61% News Effect

On the day this news was published, ACMR declined 1.61%, reflecting a mild negative market reaction.

Data tracked by StockTitan Argus on the day of publication.

New Ultra Lith KrF Track System Delivers High-Throughput Performance with Proprietary Platform Design, Driving Advanced Process Control for Mature-node Lithography Applications

FREMONT, Calif., Sept. 07, 2025 (GLOBE NEWSWIRE) --  ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced the launch of its first Ultra Lith KrF track system, designed to support front-end semiconductor manufacturing. The new system expands ACM’s lithography product line and delivers high-throughput performance, advanced thermal control, and real-time process control and monitoring. The first system was shipped to a leading Chinese logic wafer fab customer in September 2025.

ACM’s Ultra Lith KrF track system builds on the proven architecture and process achievements of ACM’s ArF track platform, which successfully completed demo-line process verification with a leading Chinese customer in late 2024. That system demonstrated sub-angstrom-level coating uniformity, advanced thermal control, and ASML scanner-aligned CD matching—capabilities that provided the foundation for design optimization in the KrF platform.

“The launch of ACM’s Ultra Lith KrF track system expands ACM’s presence in front-end process equipment and reflects our commitment to address a broader range of lithography challenges,” said Dr. David Wang, President and Chief Executive Officer of ACM. “KrF lithography remains essential for mature-node devices, which ACM believes represent a large and growing portion of global semiconductor output. By offering both ArF and KrF track systems, ACM enables seamless fab integration and greater manufacturing flexibility across diverse applications.”

ACM’s Ultra Lith KrF track system features a flexible process module configuration, including 12 spin coaters and 12 developers (12C12D), supported by 54 hot plates capable of low, mid, and high-temperature processing with industry-leading thermal uniformity. The system achieves throughput greater than 300 wafers per hour (WPH) and incorporates ACM’s proprietary backside particle removal unit (BPRV) technology to minimize cross-contamination risk. In addition, the integrated wafer-scale outlier inspection (WSOI) unit enables real-time process variation detection and yield anomaly monitoring, enhancing process stability and production efficiency.

Forward-Looking Statements

Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.

© ACM Research, Inc. Ultra Lith and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.






Media Contact:



Company Contacts:
Alyssa LundeenUSA
KiterocketRobert Metter
+1 218.398.0776+1 503.367.9753
alundeen@kiterocket.com 
 China
 Xi Wang
 ACM Research (Shanghai), Inc.
 +86 21 50808868
  
 Korea
 David Kim
 ACM Research (Korea), Inc.
 +82 1041415171
  
 Taiwan
 David Chang
 +886 921999884
  
 Singapore
 Adrian Ong
 +65 8813-1107

FAQ

What is the throughput capacity of ACM Research's new Ultra Lith KrF track system?

The system achieves a throughput of more than 300 wafers per hour (WPH) with its 12C12D configuration.

When did ACMR deliver its first Ultra Lith KrF track system?

ACM Research delivered its first Ultra Lith KrF track system to a leading Chinese logic wafer fab customer in September 2025.

What are the key features of ACMR's Ultra Lith KrF track system?

The system features 12 spin coaters, 12 developers, 54 hot plates, proprietary BPRV technology for particle removal, and WSOI unit for real-time process monitoring.

How does the new KrF track system build on ACM Research's previous technology?

The system builds on ACM's ArF track platform, which demonstrated sub-angstrom-level coating uniformity and advanced thermal control in late 2024 demo-line verification.

What market segment is ACMR targeting with the Ultra Lith KrF track system?

The system targets the mature-node device market, which ACM believes represents a large and growing portion of global semiconductor output.
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Semiconductor Equipment & Materials
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