ACM Research Delivered Its First High-Throughput Ultra Lith KrF Track System to a Leading Chinese Logic Wafer Fab Customer
ACM Research (NASDAQ: ACMR) has announced the successful delivery of its first Ultra Lith KrF track system to a leading Chinese logic wafer fab customer in September 2025. The new system expands ACM's lithography product line and features high-throughput performance of over 300 wafers per hour.
The system includes a flexible configuration with 12 spin coaters, 12 developers, and 54 hot plates. It incorporates proprietary backside particle removal unit (BPRV) technology and an integrated wafer-scale outlier inspection (WSOI) unit for real-time process monitoring. The platform builds upon ACM's ArF track platform, which demonstrated successful demo-line process verification in late 2024.
ACM Research (NASDAQ: ACMR) ha annunciato la consegna, avvenuta a settembre 2025, del suo primo sistema Ultra Lith KrF a un importante produttore cinese di wafer logici. Il nuovo impianto amplia la gamma di prodotti litografici di ACM e offre una elevata produttività superiore a 300 wafer all'ora.
La configurazione è flessibile e comprende 12 spin coater, 12 developer e 54 hot plate. Integra la tecnologia proprietaria per la rimozione delle particelle sul retro del wafer (BPRV) e un'unità integrata di ispezione outlier a livello di wafer (WSOI) per il monitoraggio del processo in tempo reale. La piattaforma si basa sulla track ArF di ACM, che ha dimostrato la verifica di processo in demo-line alla fine del 2024.
ACM Research (NASDAQ: ACMR) anunció la entrega exitosa, en septiembre de 2025, de su primer sistema Ultra Lith KrF a un importante cliente chino de fabricación de obleas lógicas. El nuevo equipo amplía la línea de productos de litografía de ACM y proporciona un alto rendimiento de más de 300 obleas por hora.
El sistema ofrece una configuración flexible con 12 spin coaters, 12 developers y 54 hot plates. Incorpora la tecnología propietaria de eliminación de partículas en la parte trasera del wafer (BPRV) y una unidad integrada de inspección de outliers a escala de wafer (WSOI) para el monitorizado del proceso en tiempo real. La plataforma se apoya en la track ArF de ACM, que demostró la verificación de procesos en demo-line a finales de 2024.
ACM Research (NASDAQ: ACMR)는 2025년 9월에 중국의 주요 로직 웨이퍼 팹 고객에게 첫 Ultra Lith KrF 트랙 시스템을 성공적으로 납품했다고 발표했습니다. 이 신규 시스템은 ACM의 리소그래피 제품군을 확장하며 시간당 300장 이상의 고처리량을 제공합니다.
시스템은 12개의 스핀코터, 12개의 현상기, 54개의 핫플레이트로 구성된 유연한 구성으로 제공됩니다. 후면 입자 제거 장치(BPRV) 기술과 실시간 공정 모니터링을 위한 웨이퍼 규모 이상치 검사(WSOI) 유닛을 통합하고 있습니다. 이 플랫폼은 2024년 말 데모 라인에서 공정 검증을 성공적으로 보인 ACM의 ArF 트랙 플랫폼을 기반으로 합니다.
ACM Research (NASDAQ: ACMR) a annoncé la livraison réussie, en septembre 2025, de son premier système Ultra Lith KrF à un client chinois majeur spécialisé dans les wafers logiques. Ce nouveau système étend la gamme lithographique d'ACM et offre un débit élevé de plus de 300 wafers par heure.
La configuration est flexible et comprend 12 spin coaters, 12 developers et 54 hot plates. Elle intègre une technologie propriétaire d'élimination des particules arrière (BPRV) et une unité d'inspection des outliers à l'échelle du wafer (WSOI) pour la surveillance du processus en temps réel. La plateforme s'appuie sur la track ArF d'ACM, qui a démontré la vérification de processus en demo-line fin 2024.
ACM Research (NASDAQ: ACMR) gab bekannt, dass im September 2025 das erste Ultra Lith KrF-Track-System an einen führenden chinesischen Logik-Wafer-Fabrikkunden ausgeliefert wurde. Das neue System erweitert ACMs Lithografie-Portfolio und bietet eine hohe Durchsatzleistung von über 300 Wafers pro Stunde.
Das System verfügt über eine flexible Konfiguration mit 12 Spin-Coatern, 12 Developern und 54 Hotplates. Es integriert die proprietäre Rückseiten-Partikel-Entfernungs-Einheit (BPRV) sowie eine integrierte Wafer-Skalen-Outlier-Inspektionseinheit (WSOI) zur Echtzeit-Prozessüberwachung. Die Plattform baut auf ACMs ArF-Track-Plattform auf, die Ende 2024 eine erfolgreiche Demo-Line-Prozessverifizierung zeigte.
- Expansion into front-end process equipment market with new KrF track system
- High throughput capacity exceeding 300 wafers per hour
- Successful delivery to a leading Chinese logic wafer fab customer
- Integration of proprietary technologies (BPRV and WSOI) for enhanced process control
- None.
Insights
ACM's new KrF track system expands product portfolio into mature-node lithography, strengthening its competitive position in China's semiconductor equipment market.
ACM Research has successfully delivered its first Ultra Lith KrF track system to a leading Chinese logic wafer fab, marking a strategic expansion of its product portfolio into front-end semiconductor manufacturing equipment. This development builds upon ACM's earlier success with its ArF track platform that completed demo verification in late 2024.
The new KrF track system demonstrates impressive technical specifications with throughput exceeding
This product launch strategically positions ACM in the mature-node device market, which continues to represent a significant portion of global semiconductor production. By offering both ArF and KrF track systems, ACM can now provide more comprehensive lithography solutions to its customers, particularly in China where domestic equipment sourcing remains a priority.
The timing is particularly significant as mature nodes continue to see strong demand for applications in IoT, automotive, and industrial sectors. While leading-edge nodes receive more attention, the mature-node market represents substantial volume production with more stable, long-term demand patterns. ACM's expansion into this segment diversifies its revenue streams and strengthens its competitive position against established players in the semiconductor equipment market.
New Ultra Lith KrF Track System Delivers High-Throughput Performance with Proprietary Platform Design, Driving Advanced Process Control for Mature-node Lithography Applications
FREMONT, Calif., Sept. 07, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced the launch of its first Ultra Lith KrF track system, designed to support front-end semiconductor manufacturing. The new system expands ACM’s lithography product line and delivers high-throughput performance, advanced thermal control, and real-time process control and monitoring. The first system was shipped to a leading Chinese logic wafer fab customer in September 2025.
ACM’s Ultra Lith KrF track system builds on the proven architecture and process achievements of ACM’s ArF track platform, which successfully completed demo-line process verification with a leading Chinese customer in late 2024. That system demonstrated sub-angstrom-level coating uniformity, advanced thermal control, and ASML scanner-aligned CD matching—capabilities that provided the foundation for design optimization in the KrF platform.
“The launch of ACM’s Ultra Lith KrF track system expands ACM’s presence in front-end process equipment and reflects our commitment to address a broader range of lithography challenges,” said Dr. David Wang, President and Chief Executive Officer of ACM. “KrF lithography remains essential for mature-node devices, which ACM believes represent a large and growing portion of global semiconductor output. By offering both ArF and KrF track systems, ACM enables seamless fab integration and greater manufacturing flexibility across diverse applications.”
ACM’s Ultra Lith KrF track system features a flexible process module configuration, including 12 spin coaters and 12 developers (12C12D), supported by 54 hot plates capable of low, mid, and high-temperature processing with industry-leading thermal uniformity. The system achieves throughput greater than 300 wafers per hour (WPH) and incorporates ACM’s proprietary backside particle removal unit (BPRV) technology to minimize cross-contamination risk. In addition, the integrated wafer-scale outlier inspection (WSOI) unit enables real-time process variation detection and yield anomaly monitoring, enhancing process stability and production efficiency.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. Ultra Lith and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
Media Contact: | Company Contacts: |
| Alyssa Lundeen | USA |
| Kiterocket | Robert Metter |
| +1 218.398.0776 | +1 503.367.9753 |
| alundeen@kiterocket.com | |
| China | |
| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
| +86 21 50808868 | |
| Korea | |
| David Kim | |
| ACM Research (Korea), Inc. | |
| +82 1041415171 | |
| Taiwan | |
| David Chang | |
| +886 921999884 | |
| Singapore | |
| Adrian Ong | |
| +65 8813-1107 |
FAQ
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