ACM Research Expands Ultra C Tahoe into a Wet Processing Platform
Rhea-AI Summary
ACM Research (NASDAQ: ACMR) announced the expansion of its Ultra C Tahoe into a multi-process wet processing platform for advanced logic and memory manufacturing. The platform combines batch and single-wafer processes in one architecture to support advanced wet etch, cleaning and drying applications.
The expanded Ultra C Tahoe adds monitor wafer reclaim and bench N2 bubbling for etch processes including silicon nitride, polysilicon, tungsten and silicon-germanium. According to ACM Research, it is adopted by multiple leading chipmakers, achieves fewer than 6 particles at 26 nm, reduces sulfuric acid use by up to 75%, and is already running Tahoe Recycle in volume production.
Positive
- Multi-process platform now integrates etch, cleaning, drying and reclaim on one tool
- Tahoe Recycle monitor wafer reclaim already in volume production at customer fabs
- Contamination performance under 6 particles at 26 nm; metal below 1 × 10⁹ atoms/cm²
- Chemical reduction sulfuric acid use cut by up to 75%, lowering costs and waste
Negative
- None.
News Explained
The expanded Ultra C Tahoe consolidates multiple processing steps previously handled by separate tools into one hybrid platform, reducing wafer transfers and cycle time.
Market reaction after wet processing platform expansion: ACMR +11.93%
Following this news, ACMR has gained 11.93%, reflecting a significant positive market reaction. Our momentum scanner has triggered 2 alerts so far, indicating moderate trading interest and price volatility. The stock is currently trading at $88.40.
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Key Figures
Historical Context
| Date | Event | Sentiment | 24h Move | Catalyst |
|---|---|---|---|---|
| Jul 15 | earnings scheduling | Neutral | -8.6% | Q2 2026 results release scheduled before the U.S. market open |
| May 07 | Q1 earnings report | Positive | +6.9% | Reported Q1 revenue and shipments growth while reiterating full-year guidance |
| Apr 27 | PECVD system shipment | Positive | -5.1% | First PECVD SiCN system shipped for site validation at a leading manufacturer |
| Apr 27 | preliminary revenue update | Positive | -5.1% | Preliminary Q1 revenue and shipments announced with 2026 outlook reaffirmed |
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
ACMR's recent positive product and preliminary-results announcements were followed by declines, while reported Q1 results aligned with a gain.
Key Terms
monitor wafer reclaim technical
surface metal contamination technical
silicon nitride recess etching technical
cross-contamination technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
Adds Advanced Wet Etch and Monitor Wafer Reclaim Applications for Logic and Memory Manufacturing
FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced that it has expanded its Ultra C Tahoe system into a multi-process wet processing platform with new process applications that support a broader range of advanced wet processing applications for logic and memory device manufacturing. The expanded platform has been adopted by multiple leading semiconductor manufacturers, demonstrating its production readiness, versatility and scalability for advanced semiconductor manufacturing.
Leveraging ACM's proprietary hybrid wet processing technology, the Ultra C Tahoe platform integrates batch and single wafer processes into a common architecture, enabling multiple advanced wet processes to be performed on a single platform. The platform fully leverages the advantages of batch cleaning, supporting longer process times and reducing chemical consumption, while also delivering the key benefits of single-wafer cleaning, including high particle removal efficiency, significantly reduced cross-contamination between wafers, and precise process time control. Recycle monitor wafer reclaim processing capabilities were recently added to the Ultra C Tahoe platform for advanced process node. The Ultra C Tahoe system leverages the hybrid architecture to consolidate multiple processing steps previously performed on separate tools into a single hybrid platform. This reduces wafer transfers between tools and shortens cycle time, while delivering improved particle removal performance and higher throughput.
“As semiconductor manufacturing becomes more complex, customers need solutions that improve productivity while remaining flexible enough to support evolving process requirements,” said Dr. David Wang, President and Chief Executive Officer of ACM. “Expanding Tahoe into a multi-process platform demonstrates the versatility of our hybrid architecture and its scalability for advanced semiconductor manufacturing. ACM will continue to drive world-class process performance and integrating environmental benefits into product development to help make advanced semiconductor manufacturing more efficient and sustainable.”
New Applications and key Benefits of the Ultra C Tahoe Platform:
- Expanded Process Capabilities: The addition of bench nitrogen (N2) bubbling technology expands the platform to support a growing portfolio of advanced wet processing applications, including uniform silicon nitride recess etching, polysilicon etching and etch-back, tungsten recess processing, and silicon-germanium recess etching. Together with ACM's proprietary SAPS, TEBO, SMT technologies, as well as hot IPA drying, the expanded platform provides integrated etching, advanced cleaning, and drying capabilities while minimizing damage to patterned structures.
- More Efficient Monitor Wafer Reclaim: Monitor wafer is used to track tool conditions and process stability. Tahoe Recycle monitor wafer reclaim process supports film and residue removal, cleaning, and drying. It consolidates these steps into a single hybrid platform, reducing wafer transfers between tools and shortening cycle time. The process also provides enhanced film-removal capability for double-side-coated and thick-film wafers, improving reclaimed-wafer cleanliness and overall process efficiency. The Tahoe Recycle application is now running in volume production at customer facilities.
- Enhanced Particle and Contamination Control: The Ultra C Tahoe platform has achieved an average particle count of fewer than 6 particles at 26 nm, with surface metal contamination below 1 × 10⁹ atoms/cm².
- Environmental and Cost Benefits: The Ultra C Tahoe platform can reduce sulfuric acid consumption by up to
75% , helping lower high-volume manufacturing costs, reduce related chemical waste and support customers’ sustainability and ESG goals.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. Ultra C, SAPS, TEBO and the ACM Research logo, are trademarks of ACM Research, Inc. For convenience, the trademark appears in this press release without ™ symbol, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
| Media Contact: | Company Contacts: |
| Alyssa Lundeen | USA |
| Bodewell Group | Robert Metter |
| +1 218.398.0776 | +1 503.367.9753 |
| alundeen@bodewellgroup.com | |
| China | |
| Xi Wang | |
| IR Contacts: | ACM Research (Shanghai), Inc. |
| The Blueshirt Group | +86 21 50808868 |
| Steven C. Pelayo, CFA | |
| +1 (360) 808-5154 | Korea |
| steven@blueshirtgroup.co | ACM Research (Korea), Inc. |
| +82 70-41006699 | |
| Gary Dvorchak, CFA | |
| +86 (138) 1079-1480 | Taiwan |
| gary@blueshirtgroup.co | David Chang |
| +886 921999884 | |
| Singapore | |
| Adrian Ong | |
| +65 8813-1107 |
