ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Rhea-AI Summary

ACM Research (NASDAQ: ACMR) received multiple advanced packaging equipment orders from leading global customers, with several wafer-level systems and a panel-level vacuum cleaning tool scheduled for delivery in Q1 2026 and additional wafer-level systems later in 2026. Orders span wafer-level and panel-level platforms, including ACM’s patent-pending Ultra C vac-p panel-level vacuum cleaning system supporting 310×310 mm to 600×600 mm panels.

The wins expand ACM’s global customer base and product adoption across advanced packaging workflows for AI, HPC and data center applications.

Positive

• Multiple wafer-level system orders with Q1 2026 deliveries
• Panel-level Ultra C vac-p order scheduled for Q1 2026
• Additional wafer-level orders delivering later in 2026
• Platform supports 310×310 mm to 600×600 mm panel formats

Negative

• None.

News Market Reaction – ACMR

-16.69%

32 alerts

-16.69% News Effect

-12.7% Trough in 3 hr 29 min

-$890M Valuation Impact

$4.44B Market Cap

1.0x Rel. Volume

On the day this news was published, ACMR declined 16.69%, reflecting a significant negative market reaction. Argus tracked a trough of -12.7% from its starting point during tracking. Our momentum scanner triggered 32 alerts that day, indicating elevated trading interest and price volatility. This price movement removed approximately $890M from the company's valuation, bringing the market cap to $4.44B at that time.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

Panel format: 310 × 310 mm Panel format: 510 × 515 mm Panel format: 600 × 600 mm

3 metrics

Panel format 310 × 310 mm Supported panel size for Ultra C vac-p platform

Panel format 510 × 515 mm Supported panel size for Ultra C vac-p platform

Panel format 600 × 600 mm Largest supported panel size for Ultra C vac-p platform

Market Reality Check

Price: $51.48 Vol: Volume 1,302,761 is below...

normal vol

$51.48 Last Close

Volume Volume 1,302,761 is below the 20-day average of 1,522,076 (relative volume 0.86). normal

Technical Price at $68.47 is above the $36.24 200-day MA and within $3.18 of the 52-week high $71.65.

Peers on Argus

ACMR was up 1.05% while peers showed mixed moves: PLAB up 10.87%, KLIC up 0.75%,...

3 Up 1 Down

ACMR was up 1.05% while peers showed mixed moves: PLAB up 10.87%, KLIC up 0.75%, DQ, VECO, and UCTT down, and momentum peers showed both up and down moves. This points to a stock-specific reaction rather than a broad sector move.

Historical Context

5 past events · Latest: Feb 09 (Neutral)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Feb 09	Earnings call timing	Neutral	+0.5%	Announced date and webcast details for Q4 and FY25 results release.
Jan 22	Revenue outlook update	Positive	-3.3%	Updated 2025 revenue range and provided initial 2026 outlook with growth drivers.
Dec 29	Guidance timing update	Neutral	+0.6%	Set date to release 2025 preliminary revenue range and 2026 outlook.
Dec 01	Investor conference	Neutral	-1.3%	Announced participation as host at the 14th Annual NYC Summit conference.
Nov 19	Tool delivery	Positive	+2.4%	Delivered first Ultra Lith BK tool with advanced UV curing and uniformity specs.

Pattern Detected

Recent news has typically produced modest single-digit moves, with one notable divergence where a positive revenue outlook coincided with a negative price reaction.

Recent Company History

Over the last few months, ACMR has issued several updates, including revenue outlook revisions on Jan 22, 2026 and multiple investor event notices. A tool delivery announcement on Nov 19, 2025 led to a positive move of 2.37%, showing investors respond to concrete product wins. Today’s advanced packaging orders extend that product and customer adoption narrative, building on earlier disclosures about growth expectations for 2025 and 2026 and ongoing engagement with global customers.

Market Pulse Summary

The stock dropped -16.7% in the session following this news. A negative reaction despite commerciall...

Analysis

The stock dropped -16.7% in the session following this news. A negative reaction despite commercially meaningful orders would fit ACMR’s history of occasional divergences, such as the revenue outlook update that saw a -3.33% move. Even with shares trading above the $36.24 200-day MA and close to the $71.65 52-week high, investors have previously discounted good news when broader concerns arose. Order timing, cyclicality in semiconductor capex, or prior expectations around AI and HPC exposure could all have amplified downside moves.

Key Terms

wafer-level, panel-level, advanced packaging, osat, +4 more

8 terms

wafer-level technical

"multiple wafer-level advanced packaging systems from a leading global OSAT customer"

Wafer-level describes manufacturing steps performed on a whole round silicon slice (the wafer) before it is cut into individual chips, similar to frosting and testing a cookie sheet before breaking it into single cookies. Doing work at the wafer level can lower per-chip cost, shrink final package size, speed production and improve quality, so it matters to investors because it can boost margins, supply efficiency and the competitiveness of semiconductor products.

panel-level technical

"A panel-level advanced packaging vacuum cleaning tool from a leading global"

"Panel-level" describes data or analysis that considers an entire group of related items, such as multiple companies, regions, or time periods, all examined together. It provides a broad view of trends and patterns across the whole set, rather than focusing on individual parts. For investors, this approach helps identify overall market or sector directions, making it easier to see the bigger picture.

advanced packaging technical

"a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications"

Advanced packaging describes modern methods for arranging, connecting and enclosing semiconductor chips so they work together more efficiently in a smaller space—think of stacking and wiring tiny electronic building blocks instead of leaving them as separate items on a circuit board. It matters to investors because these techniques can boost product speed, reduce power use, shrink device size and lower manufacturing costs, all of which influence a maker’s competitiveness, profit margins and market share.

osat technical

"from a leading global OSAT customer based in Singapore"

OSAT stands for outsourced semiconductor assembly and test — specialist companies that take finished silicon wafers and perform the “finishing” work: cutting, packaging and testing chips so they can be used in devices. Investors watch OSATs because their sales and profit margins track overall demand for chips and the health of the electronics supply chain; they act like toll booths that reveal upstream chip production trends, customer concentration risks, and bottlenecks that can affect many tech companies.

vacuum cleaning system technical

"Ultra C vac-p panel-level vacuum cleaning system, designed to address the stringent"

A vacuum cleaning system is a product or combination of products that removes dust, dirt and debris from floors and surfaces by generating suction and trapping particles in a filter or container—think of it as a mechanical broom and trash bin in one. Investors care because its design, reliability, energy use, and ongoing needs (filters, parts, service) affect production costs, pricing power, repeat sales and brand loyalty, all of which influence revenue and profitability.

fan-out panel-level packaging (foplp) technical

"requirements of advanced fan-out panel-level packaging (FOPLP) and fine-pitch interconnects"

Fan-out panel-level packaging (FOPLP) is a modern semiconductor assembly method that places multiple bare chips on a large flat panel and redistributes their electrical connections across the panel before cutting it into finished packages. Think of it like arranging many small items on a big sheet so you can connect and finish them all at once, which can reduce cost, improve thermal and electrical performance, and allow thinner, more feature-rich packages. Investors care because FOPLP can lower manufacturing cost, increase production capacity, and enable higher-performance, smaller devices that may boost sales, margins, and competitive positioning in chip-driven markets.

2.5d technical

"support yield and reliability in complex 2.5D and 3D integration environments"

2.5D refers to a semiconductor packaging approach where multiple small chips are placed side‑by‑side on a shared thin platform (an interposer) rather than stacked directly on top of each other. For investors, it matters because this design can boost performance and power efficiency like arranging components on a compact circuit board, often reducing development risk and cost compared with fully stacked (3D) chips and enabling faster time to market for higher‑performance products.

3d integration technical

"support yield and reliability in complex 2.5D and 3D integration environments"

3D integration is a way of building computer chips by stacking multiple layers of circuitry on top of each other and connecting them with tiny vertical links, like turning a single-story house into a compact, multi-story apartment. For investors, it matters because stacking can boost speed, reduce power use, and pack more capability into a smaller footprint, which can lead to better-performing products, lower production costs per function, and new market opportunities for chip makers.

AI-generated analysis. Not financial advice.

-Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has received multiple advanced packaging equipment orders from leading global semiconductor and technology customers.

This includes orders for:

• Multiple wafer-level advanced packaging systems from a leading global OSAT customer based in Singapore, with deliveries scheduled for the first quarter of 2026;
• A panel-level advanced packaging vacuum cleaning tool from a leading global semiconductor packaging manufacturer based outside mainland China, also scheduled for delivery in the first quarter of 2026; and
• Multiple wafer-level advanced packaging systems from a leading North America-based technology customer, with deliveries scheduled for later this year.
  

These recent customer wins represent a meaningful step forward in ACM’s continued expansion of its advanced packaging platform and global customer base, reflecting growing industry recognition of ACM’s differentiated technology portfolio across both wafer-level and panel-level applications.

“These global orders reinforce our leadership in wafer-level advanced packaging equipment while demonstrating the extension of our differentiated technologies into panel-level applications,” said Dr. David Wang, President and Chief Executive Officer of ACM. “We remain committed to continued innovation to meet customers’ increasingly demanding process and yield requirements, supported by a comprehensive product portfolio and global service infrastructure.”

As semiconductor device complexity continues to increase, the industry is accelerating investment in scalable, high-performance manufacturing solutions to support artificial intelligence (AI), high-performance computing (HPC), and data center applications. Panel-level packaging is gaining strategic traction in these segments due to its scalability and cost efficiency.

ACM’s wafer-level advanced packaging system orders include coating, developing, wet etching, stripping, cleaning and electroplating solutions for use in advanced packaging workflows, demonstrating continued international adoption of ACM’s process technologies across critical manufacturing steps.

The panel-level order is for ACM’s patent-pending Ultra C vac-p panel-level vacuum cleaning system, designed to address the stringent process requirements of advanced fan-out panel-level packaging (FOPLP) and fine-pitch interconnects. Leveraging vacuum-enhanced chemistry delivery, the system improves residue removal efficiency and process uniformity to support yield and reliability in complex 2.5D and 3D integration environments. The platform supports multiple panel formats, including 310 × 310 mm, 510 × 515 mm and 600 × 600 mm, enabling scalable manufacturing for next-generation device architectures.

Forward-Looking Statements

Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.

© ACM Research, Inc. Ultra C and the ACM Research logo are a trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.

Media Contact:	Company Contacts:
Alyssa Lundeen	USA
Kiterocket	Robert Metter
+1 218.398.0776	+1 503.367.9753
alundeen@bodewellgroup.com
	China
IR Contacts:	Xi Wang
The Blueshirt Group	ACM Research (Shanghai), Inc.
Steven C. Pelayo, CFA	+86 21 50808868
+1 (360) 808-5154
steven@blueshirtgroup.co	Korea
	ACM Research (Korea), Inc.
Gary Dvorchak, CFA	+82 70-41006699
+86 (138) 1079-1480
gary@blueshirtgroup.co	Taiwan
	David Chang
	+886 921999884
	Singapore
	Adrian Ong
	+65 8813-1107

FAQ

What orders did ACM Research (ACMR) announce on February 26, 2026?

ACM announced multiple wafer-level system orders and a panel-level vacuum cleaning tool order. According to the company, deliveries are scheduled in Q1 2026 and later in 2026, across global OSAT, panel packaging, and North America customers.

When will ACMR deliver the wafer-level advanced packaging systems?

Deliveries for certain wafer-level systems are scheduled in Q1 2026, with others later in 2026. According to the company, orders include coating, etching, cleaning and electroplating solutions for advanced packaging workflows.

What is ACM's Ultra C vac-p panel-level system ordered by customers?

The Ultra C vac-p is a patent-pending panel-level vacuum cleaning system designed for FOPLP and fine-pitch interconnects. According to the company, it uses vacuum-enhanced chemistry delivery to improve residue removal and process uniformity.

Which panel sizes does ACMR's platform support for panel-level packaging?

ACM's platform supports multiple panel formats including 310×310 mm, 510×515 mm and 600×600 mm. According to the company, this enables scalable manufacturing for next-generation device architectures in 2.5D and 3D integration.

How do these ACMR orders affect the company's advanced packaging presence?

The orders broaden ACM's wafer-level and panel-level market presence with global customers. According to the company, these wins reflect growing adoption of its differentiated process technologies across advanced packaging workflows.