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Aehr Receives $23 Million in New Follow-on Orders to Meet Customers' Growing Demand for Wafer Level Test and Burn-in of Silicon Carbide Semiconductor Devices

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Aehr Test Systems (AEHR) secures $23 million in new follow-on orders for its FOX wafer level test and burn-in products. The orders include FOX WaferPak Contactors for current and new device designs, driving additional orders in 2024. The company's unique WaferPak designs cater to specific customer applications, aiding in wafer level stress tests, screening, and burn-in processes. Aehr Test Systems' CEO, Gayn Erickson, highlights the company's industry-leading lead times and capacity to meet customer demands, projecting growth in WaferPak business revenue.
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The recent $23 million order for Aehr Test Systems' FOX wafer level test and burn-in products represents a significant investment by existing customers in semiconductor testing equipment. This order underscores the growing demand for silicon carbide devices, which are increasingly used in high-power and high-temperature applications, such as electric vehicles and industrial power supplies. The inclusion of full wafer Contactors for new device designs indicates an expansion in the application of these devices and potential for further growth in the semiconductor testing market.

The short lead times and increased production capacity cited by Aehr's CEO suggest an efficient supply chain and operational excellence, which are critical in the semiconductor industry where time-to-market is a key competitive advantage. This operational agility may lead to increased market share and higher customer satisfaction, which can translate into repeat business and a stronger revenue stream for the company.

Aehr Test Systems' announcement of new follow-on orders is a positive development for its financial outlook. The $23 million in orders could significantly impact the company's revenue, especially considering that this amount is to be recognized by the end of the fiscal year. The orders for WaferPak Contactors, which are tailored to specific customer applications, indicate a high degree of customer lock-in and a value-added proposition, potentially leading to higher margins.

Investors should note the company’s emphasis on growth in absolute revenue and as a percentage of overall revenue, which suggests management's confidence in the scalability of the WaferPak business. This could be a positive indicator of future profitability and a reason for investors to monitor the company's performance closely in the coming quarters.

The significance of Aehr Test Systems' FOX systems and WaferPaks for the semiconductor industry cannot be overstated. The ability to perform wafer level burn-in and stress tests is crucial for ensuring the reliability of silicon carbide and other advanced materials like gallium nitride. These materials are pivotal in next-generation electronics, including power semiconductors and integrated circuits used in energy-efficient applications.

The proprietary nature of the WaferPak Contactors tailored to customers' unique device designs highlights the company's specialization and innovation in the field. This specialization may provide Aehr with a competitive edge in the semiconductor equipment market, as the need for custom solutions grows alongside the increasing complexity of semiconductor devices.

FREMONT, CA / ACCESSWIRE / February 21, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received new follow-on orders totaling $23 million from existing customers for FOXTM wafer level test and burn-in products to be used for production and engineering qualification needs for wafer level burn-in and screening of their silicon carbide devices. Customer-requested ship dates for these orders range from immediate shipment through the end of Aehr's current fiscal year, which ends May 31, 2024.

The orders include a significant number of FOX WaferPakTM full wafer Contactors for both current design capacity increases as well as new device designs that are expected to drive additional orders in calendar year 2024 and beyond.

FOX WaferPak Contactors are used in conjunction with the company's FOX-NP and FOX-XP wafer level test and burn-in systems to contact 100% of the die on a wafer up to several thousand devices at a time. These proprietary WaferPak designs are specific to a customer's application as well as die layout and unique electrical contact pads. Aehr's FOX systems and WaferPaks are currently being used on wafer sizes ranging from 4", 6", 8" and 12" wafers and can be configured for a wide range of device applications.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are excited to help our customers meet their new design and production capacity needs with our industry-leading lead times and capacity for wafer level stress tests, screening, stabilization, and burn-in.Our proprietary WaferPak Contactors are unique to each end customer's device design and grow with the number of device designs and capacity needed for volume production of those devices. As we have stated in the past, we are able to quickly ship a large quantity of WaferPaks with very short lead times with our increased design resources, optimized supply chain, and manufacturing and test processes. We continue to believe our WaferPak business will grow in absolute revenue and also as a percent of the overall revenue for the company. In addition, we have increased our material availability and manufacturing capacity to shorten lead times on our FOX-NP and FOX-XP test and burn-in systems and automated FOX WaferPak Aligners."

The FOX-XP and FOX-NP systems and proprietary WaferPaks are capable of functional test and burn-in/cycling of silicon carbide and gallium nitride power semiconductors, silicon photonics integrated circuits as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For more information, please visit Aehr Test Systems' website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; bookings forecasted for proprietary WaferPakTM and DiePak consumables; and expectations related to long-term demand for Aehr's productions and the attractiveness of key markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

Aehr Test SystemsMKR Investor Relations Inc.
Vernon RogersTodd Kehrli or Jim Byers
EVP of Sales & MarketingAnalyst/Investor Contact
(510) 623-9400 x215(213) 277-5550
vrogers@aehr.comaehr@mkr-group.com

SOURCE: Aehr Test Systems



View the original press release on accesswire.com

Aehr Test Systems has received new follow-on orders totaling $23 million from existing customers.

FOX WaferPak Contactors are used in conjunction with Aehr Test Systems' FOX-NP and FOX-XP wafer level test and burn-in systems to contact 100% of the die on a wafer up to several thousand devices at a time.

The FOX-XP and FOX-NP systems and proprietary WaferPaks are capable of functional test and burn-in/cycling of silicon carbide and gallium nitride power semiconductors, silicon photonics integrated circuits, optical devices, sensors, memories, microcontrollers, and other leading-edge ICs.

Aehr Test Systems can quickly ship a large quantity of WaferPaks with very short lead times due to increased design resources, optimized supply chain, and manufacturing and test processes.

Gayn Erickson highlights the company's industry-leading lead times, capacity for wafer level stress tests, screening, and burn-in processes, projecting growth in WaferPak business revenue.
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About AEHR

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.