Aehr Test Systems to Participate in 14th Annual NYC Summit

Rhea-AI Summary

Aehr Test Systems (NASDAQ:AEHR) announced that President and CEO Gayn Erickson will participate in the 14th Annual NYC Summit on December 16, 2025 at Mastro's New York.

The company said the presentation will review growth in its wafer-level burn-in business, recent benchmark evaluation requests for AI processors, and rising demand for package-level burn-in systems including Sonoma, Echo, and Tahoe. Topics listed include turnkey solutions for silicon carbide, gallium nitride, silicon photonics, and traction with AI processor testing. Presentation materials will be available on Aehr's investor relations website at www.aehr.com.

News Market Reaction

+10.24%

48 alerts

+10.24% News Effect

+6.8% Peak in 5 hr 27 min

+$70M Valuation Impact

$754M Market Cap

0.7x Rel. Volume

On the day this news was published, AEHR gained 10.24%, reflecting a significant positive market reaction. Argus tracked a peak move of +6.8% during that session. Our momentum scanner triggered 48 alerts that day, indicating elevated trading interest and price volatility. This price movement added approximately $70M to the company's valuation, bringing the market cap to $754M at that time.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

Net revenue: $11.0M GAAP net loss: $(2.1)M Non-GAAP net income: $0.2M +5 more

8 metrics

Net revenue $11.0M Fiscal Q1 2026 vs $13.1M year-ago

GAAP net loss $(2.1)M Fiscal Q1 2026 (−$0.07/share)

Non-GAAP net income $0.2M Fiscal Q1 2026 ($0.01/share)

Bookings $11.4M Fiscal Q1 2026

Backlog $15.5M Fiscal Q1 2026 backlog; effective backlog $17.5M

Cash and equivalents $24.7M End of Fiscal Q1 2026

S-8 registered shares 2,500,000 shares 2023 Equity Incentive Plan

S-8 ESPP shares 300,000 shares Amended 2006 Employee Stock Purchase Plan

Market Reality Check

Price: $26.06 Vol: Volume 522,530 is below t...

normal vol

$26.06 Last Close

Volume Volume 522,530 is below the 20-day average of 709,290 ahead of this conference news. normal

Technical Price 26.43 is trading above the 200-day MA of 17.14, reflecting a pre-existing uptrend.

Peers on Argus

AEHR gained 5.38% while key peers were mixed, with INDI up 2.05%, ICHR up 1.63%,...

AEHR gained 5.38% while key peers were mixed, with INDI up 2.05%, ICHR up 1.63%, UCTT up 1.19%, VECO up 1.10%, and COHU down 1.31%, suggesting a more company-specific move.

Historical Context

5 past events · Latest: Dec 03 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Dec 03	Investor conference	Positive	+10.2%	Planned NYC Summit appearance highlighting growth in AI and burn-in demand.
Nov 12	Product shipment	Positive	+0.3%	Dual-Echo shipment and momentum in package-level and wafer-level burn-in.
Nov 03	Strategic partnership	Positive	+0.0%	Partnership with ISE Labs for wafer-level test and burn-in for HPC/AI.
Oct 06	Earnings results	Neutral	+2.0%	Fiscal Q1 2026 results with AI and data-center demand commentary.
Sep 29	Earnings preview	Neutral	+0.9%	Announcement of upcoming fiscal Q1 2026 earnings release and call.

Pattern Detected

Recent news around AI, data-center demand, and burn-in momentum generally saw positive price reactions, including today's investor conference update.

Recent Company History

Over the last few months, AEHR highlighted growing demand for its wafer-level and package-level burn-in systems, particularly for AI processors and power devices. A fiscal Q1 2026 report showed $11.0M in revenue with a GAAP net loss but solid bookings and backlog. Subsequent news covered a new HPC/AI partnership and shipment momentum in Echo systems. Today’s NYC Summit participation continues this narrative of expanding AI, silicon carbide, and silicon photonics engagement.

Market Pulse Summary

The stock surged +10.2% in the session following this news. A strong positive reaction aligns with t...

Analysis

The stock surged +10.2% in the session following this news. A strong positive reaction aligns with the company’s recent pattern, where AI and data-center test themes often preceded gains of up to 10.24%. The NYC Summit appearance reinforces earlier updates on wafer- and package-level burn-in traction. However, prior filings show ongoing equity compensation activity and insider sales, which can matter for supply dynamics. Investors watching sustainability often track bookings of $11.4M, backlog levels, and execution against AI-related demand.

Key Terms

wafer-level burn-in, package-level burn-in, silicon carbide, gallium nitride, +3 more

7 terms

wafer-level burn-in technical

"continued strength we are seeing in our wafer-level burn-in business"

Wafer-level burn-in is a manufacturing stress test where semiconductor chips are powered and heated while still part of the full wafer to force early-life failures to appear before the chips are cut and packaged. For investors, it matters because performing this test improves product reliability and reduces later recalls or warranty costs, but it also raises manufacturing time and expense; think of it as shaking a batch of products to find weak ones before they reach customers.

package-level burn-in technical

"increasing demand for our package-level burn-in solutions including both"

Package-level burn-in is a manufacturing test where completed electronic packages (chips in their final housings) are powered up and stressed under controlled temperature and voltage to reveal early-life failures that might not show up in short functional tests. Investors care because it helps ensure product reliability and lower return rates; like test-driving a car before sale, more effective burn-in can protect a company’s reputation, reduce warranty costs, and improve production yield and margins.

silicon carbide medical

"including silicon carbide devices in electric vehicles and charging"

Silicon carbide is a hard, durable material made from silicon and carbon, often used in industrial applications like cutting tools and electronics. Its ability to withstand high temperatures and conduct electricity efficiently makes it valuable in manufacturing advanced electronic devices. For investors, companies working with silicon carbide are seen as key players in the growing market for high-performance electronics and energy-efficient technologies.

gallium nitride medical

"gallium nitride for advanced power conversion, and silicon photonics"

Gallium nitride is a durable semiconductor material used to make electronic components that switch faster, handle higher voltages, and waste less energy than older silicon parts. Think of it as a lighter, more efficient motor in an appliance: it lets devices shrink, run cooler and save power, which can lower manufacturing costs, enable new products and boost sales or margins for companies that adopt it—key factors investors watch.

silicon photonics technical

"and silicon photonics for data centers, 5G infrastructure and optical"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

optical input/output (I/O) technical

"5G infrastructure and optical input/output (I/O). We are also seeing"

Optical input/output (I/O) is the use of light—typically through fiber or tiny lasers—to send and receive digital data between chips, devices or systems instead of using electrical wires. For investors it matters because optical I/O can dramatically increase data speed and capacity while lowering power use and heat, similar to upgrading narrow local roads to high‑speed highways that carry much more traffic with less congestion, which can boost performance and reduce operating costs in data centers and networks.

AI processors technical

"benchmark evaluations for their AI processors since our last earnings call"

AI processors are specialized computer chips built to run tasks like language understanding, image recognition and decision-making much faster and more efficiently than general-purpose chips. For investors they matter because demand for these chips drives revenue and profit growth for chipmakers and their suppliers, influences capital spending by tech companies, and can signal which businesses have a competitive edge—similar to owning a factory that makes a tool essential for a new industry.

AI-generated analysis. Not financial advice.

FREMONT, CA / ACCESS Newswire / December 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced that President and CEO Gayn Erickson will be participating in the 14 ^th Annual NYC Summit investor conference being held Tuesday, December 16 ^th at Mastro's New York.

"I'm pleased to once again engage with investors and shareholders to discuss Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "This includes the continued strength we are seeing in our wafer-level burn-in business, with multiple leading companies requesting benchmark evaluations for their AI processors since our last earnings call, and increasing demand for our package-level burn-in solutions including both our ultra-high-power Sonoma systems and our lower-power Echo and Tahoe systems. Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong traction with AI processors in both wafer level and packaged part formats. The growing adoption of wafer level test and packaged part burn-in across these markets is a significant growth driver for Aehr Test Systems."

The presentation material referenced by Aehr Test at the NYC Summit may be accessed on the investor relations page of the Company's website at www.aehr.com.

About the 14 ^th Annual NYC Summit

The NYC Summit is collectively hosted and funded by participating companies and features a "round-robin" format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 15 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

Attendance at the NYC Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is December 10, 2025.

RSVP Contacts for 14th Annual NYC Summit 2025

To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

Laura J. Guerrant-Oiye
Phone: (808) 960-2642
Email: lauraoiye@gmail.com

Claire E. McAdams
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P ^TM families of test and burn-in systems and FOX WaferPak ^TM Aligner, FOX WaferPak Contactor, FOX DiePak ^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.

# # #

SOURCE: Aehr Test Systems

View the original press release on ACCESS Newswire

FAQ

When will Aehr Test Systems (AEHR) present at the 14th Annual NYC Summit?

Aehr's CEO Gayn Erickson will present on December 16, 2025 at Mastro's New York.

What topics will Aehr (AEHR) cover at the December 16, 2025 NYC Summit presentation?

The presentation will cover wafer-level and package-level burn-in, AI processor benchmark requests, and turnkey testing for SiC, GaN, and silicon photonics.

How can investors access Aehr (AEHR) presentation materials from the NYC Summit?

Presentation materials will be posted on Aehr's investor relations page at www.aehr.com.

Does Aehr (AEHR) mention AI processor demand in its NYC Summit announcement?

Yes; the company referenced multiple leading companies requesting benchmark evaluations for AI processors since its last earnings call.

Which Aehr (AEHR) product lines are highlighted for package-level burn-in?

The announcement highlights Sonoma (ultra-high-power) and the lower-power Echo and Tahoe systems for package-level burn-in.