Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026
Aehr Test Systems (NASDAQ: AEHR) announced its participation in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference at the Four Seasons Hotel in Chicago on August 24-25, 2026.
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Rhea-AI Summary
Aehr Test Systems (NASDAQ: AEHR) announced its participation in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference at the Four Seasons Hotel in Chicago on August 24-25, 2026. President and CEO Gayn Erickson and CFO Chris Siu will host investor meetings on Tuesday, August 25.
Aehr plans to discuss its test and burn-in solutions for AI processors, silicon carbide power devices, gallium nitride, and silicon photonics used in data centers, automotive, industrial, and communications markets. The company highlights growing adoption of wafer-level and package-level test and burn-in as a potential growth driver.
Details
Market move: AEHR -4.00% in the Aug 21 session. Semiconductor conference participation
On Aug 21, the day this news came out, AEHR closed 4.00% below the previous close. Argus tracked a trough of -11.1% from its starting point during tracking. Our momentum scanner recorded 24 alerts for this stock that day.
Data tracked by StockTitan Argus for the Aug 21 session.
Key Figures
- Conference dates
- August 24-25, 2026
- Jefferies semiconductor, IT hardware and communications technology conference
- Conference meeting date
- August 25, 2026
- Management investor meetings
- Wafer size
- 300 mm
- Maximum wafer size for the FOX WaferPak Contactor
- Parallel devices
- Up to 1024 devices
- Testing in parallel per FOX DiePak
- DiePaks tested simultaneously
- Up to nine DiePaks
- FOX-NP and FOX-XP systems
- Installed systems
- Thousands of systems
- Installed worldwide
- Sensor formats
- 2D and 3D
- Sensors testable by FOX-XP and FOX-NP systems
Historical Context
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Conference participation notice was followed by a 4.59% 24-hour share-price decline.
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AI processor follow-on order was followed by a 10.17% 24-hour gain.
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Silicon photonics production order was followed by a 19.82% 24-hour gain.
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Quarterly results and backlog update were followed by a 21.91% 24-hour gain.
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Silicon carbide order announcement was followed by a 21.91% 24-hour gain.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
burn-in technical
silicon photonics technical
wafer-level technical
package-level technical
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FREMONT, CA / ACCESS Newswire / August 21, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the Jefferies semiconductor, IT Hardware & Communications Technology Conference taking place August 24-25, 2026, at the Four Seasons Hotel in Chicago. President and CEO Gayn Erickson and CFO Chris Siu will be hosting meetings with investors throughout the day on Tuesday, August 25.
"We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."
For additional information or to schedule a meeting with Aehr management, please contact your Jefferies representative or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.
Aehr Test Systems | PondelWilkinson, Inc. |
Chris Siu | Todd Kehrli or Jim Byers |
Chief Financial Officer | Analyst/Investor Contact |
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SOURCE: Aehr Test Systems
View the original press release on ACCESS Newswire
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