Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1x1 Conference on August 19

Rhea-AI Summary

Aehr Test Systems (NASDAQ:AEHR) will participate in the 7th Annual Needham Virtual Semiconductor and SemiCap 1x1 Conference on Wednesday, August 19, 2026. President and CEO Gayn Erickson and CFO Chris Siu plan to hold virtual 1x1 meetings with investors throughout the day.

According to Aehr, discussions are expected to cover its test and burn-in solutions for AI processors, silicon photonics, data center, automotive, industrial and power devices, including its FOX family of wafer-level and package-level systems and high-power package-level solutions for AI accelerators and GPUs.

Market Context

Recent insider data recorded Net Selling, with 43,000 shares sold and no shares bought. That platfor...

Analysis

Recent insider data recorded Net Selling, with 43,000 shares sold and no shares bought. That platform context adds a governance-related risk lens to the conference notice; the active S-3ASR shelf remained available, while no deal or financial update was announced.

Key Figures

Conference edition: 7th Annual Conference date: August 19, 2026 Wafer contact size: 300mm +3 more

6 metrics

Conference edition 7th Annual Needham Virtual Semiconductor and SemiCap 1x1 Conference

Conference date August 19, 2026 Scheduled virtual investor meetings

Wafer contact size 300mm FOX WaferPak Contactor capability

Parallel devices 1024 devices Maximum per FOX DiePak Carrier

DiePaks nine DiePaks Maximum simultaneous use on FOX-NP and FOX-XP systems

Installed systems thousands of systems Installed worldwide

Historical Context

5 past events · Latest: Aug 12 (Positive)

Pattern 5 events

Date	Event	Sentiment	24h Move	Catalyst
Aug 12	AI order	Positive	+10.2%	Follow-on $22 million order for AI processor wafer-level burn-in systems
Aug 04	Photonics order	Positive	+19.8%	Follow-on production order supporting silicon photonics manufacturing capacity expansion
Jul 14	Earnings report	Positive	+21.9%	Record bookings, effective backlog, and projected fiscal 2027 revenue
Jul 14	Silicon carbide orders	Positive	+21.9%	More than $8 million in wafer-level burn-in orders for EV programs
Jul 09	Photonics order	Positive	+12.3%	Follow-on FOX-XP order for automated silicon photonics wafer-level burn-in

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

Recent company-news events were followed by positive 24-hour price reactions across all five selected events.

Key Terms

burn-in, silicon photonics, wafer-level, optical input/output (I/O)

4 terms

burn-in technical

"test and burn-in solutions for semiconductor devices"

Burn-in is a manufacturing test where new devices or components are operated under stress for a set period to surface early failures before products ship. Investors care because effective burn-in reduces returns, warranty costs and reputation risk, and signals production quality; like driving a new car on a rough road to reveal hidden defects before selling it to customers.

silicon photonics technical

"applications including artificial intelligence (AI), silicon photonics"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

wafer-level technical

"strong traction with AI processors in both wafer-level"

Wafer-level describes manufacturing steps performed on a whole round silicon slice (the wafer) before it is cut into individual chips, similar to frosting and testing a cookie sheet before breaking it into single cookies. Doing work at the wafer level can lower per-chip cost, shrink final package size, speed production and improve quality, so it matters to investors because it can boost margins, supply efficiency and the competitiveness of semiconductor products.

optical input/output (I/O) technical

"5G infrastructure and optical input/output (I/O)"

Optical input/output (I/O) is the use of light—typically through fiber or tiny lasers—to send and receive digital data between chips, devices or systems instead of using electrical wires. For investors it matters because optical I/O can dramatically increase data speed and capacity while lowering power use and heat, similar to upgrading narrow local roads to high‑speed highways that carry much more traffic with less congestion, which can boost performance and reduce operating costs in data centers and networks.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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FREMONT, CA / ACCESS Newswire / August 13, 2026 / Aehr Test Systems (NASDAQ:AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the 7^th Annual Needham Virtual Semiconductor and SemiCap 1x1 Conference on Wednesday, August 19, 2026. Aehr Test President and CEO Gayn Erickson and CFO Chris Siu will be hosting virtual meetings with investors throughout the day.

"We look forward to discussing with investors and shareholders Aehr's expanding role in enabling the next generation of semiconductor devices across a wide range of markets," said Mr. Erickson. "Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon photonics for data centers, 5G infrastructure and optical input/output (I/O), silicon carbide devices in electric vehicles and charging infrastructure, and gallium nitride for advanced power conversion. We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems."

For additional information, or to schedule a meeting with Aehr management, please contact your Needham representative, or Aehr's investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr's products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.

Contacts:
Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

PondelWilkinson, Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
tkehrli@pondel.com
jbyers@pondel.com

SOURCE: Aehr Test Systems

View the original press release on ACCESS Newswire

FAQ

What is Aehr Test Systems (NASDAQ:AEHR) announcing about the Needham Virtual Semiconductor and SemiCap 1x1 Conference on August 19, 2026?

Aehr Test Systems will participate in the 7th Annual Needham Virtual Semiconductor and SemiCap 1x1 Conference on August 19, 2026. According to Aehr, President and CEO Gayn Erickson and CFO Chris Siu will host virtual meetings with investors throughout the day.

Who from Aehr Test Systems (AEHR) will meet investors at the August 19, 2026 Needham virtual conference?

Aehr Test Systems will be represented by President and CEO Gayn Erickson and CFO Chris Siu at the conference. According to Aehr, they will conduct virtual 1x1 meetings with investors and shareholders during the event.

What topics may Aehr Test Systems (AEHR) discuss with investors at the Needham Semiconductor and SemiCap 1x1 Conference 2026?

Aehr expects to discuss its role in test and burn-in solutions for AI, silicon photonics, data centers, automotive, and industrial semiconductors. According to Aehr, conversations may cover its FOX family systems and high-power reliability solutions for AI accelerators and GPUs.

How can investors schedule a 1x1 meeting with Aehr Test Systems (NASDAQ:AEHR) at the August 19, 2026 Needham virtual conference?

Investors can arrange meetings through their Needham representative or by contacting Aehr’s investor relations firm PondelWilkinson. According to Aehr, inquiries can be sent to jbyers@pondel.com to coordinate conference meeting requests.

What semiconductor markets does Aehr Test Systems (AEHR) serve, as highlighted in the August 13, 2026 conference announcement?

Aehr serves markets including AI processors, silicon photonics, data and telecom infrastructure, electric vehicles, charging infrastructure, and power conversion. According to Aehr, its FOX systems support wafer-level, singulated die, and package-level test and burn-in for a wide range of semiconductor devices.

What products from Aehr Test Systems (AEHR) are mentioned in connection with its investor outreach around the Needham 2026 conference?

The announcement references Aehr’s FOX-PTM family, FOX-XP, FOX-NP, FOX-CP systems, WaferPak Contactor, WaferPak Aligner, and DiePak Carrier. According to Aehr, it also highlights the ultra-high-power Sonoma family for AI accelerators, GPUs, and high-performance computing processors.