Asahi Kasei Launches New Series of Sunfort™ Dry Film Photoresist as Material for Back-End Processing of Advanced Semiconductor Packaging Used in AI Servers
Sunfort™ dry film photoresist
Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth under the medium-term management plan “Trailblaze Together,” with an estimated
Interposers serve as a bridge between chips and substrates and are used along with package substrates in advanced semiconductor packages. These components require a large area, high-multilayer structures, and increasingly sophisticated technologies for forming high-density microwiring. In photolithography, liquid resist has long been the mainstream photoresist material for the redistribution layer (RDL) due to its superior resolution. In contrast, dry film photoresist offers advantages for panel-level processing (which involves a larger surface area than conventional wafer-level processing), such as ease of handling and ease of processing on both the top and bottom sides of the substrate. Still, it has not been adopted for RDL formation due to limited resolution performance.
Developed based on Asahi Kasei’s long experience with photosensitive material and new material design, the TA Series enables fine wiring formation in panel-level packages and similar applications. The TA Series also allows patterning with a resist width of 1.0 µm using LDI exposure in the 4 µm pitch design required for RDL formation (see Figures a and b). The resulting fine resist pattern can be plated by a semi-additive process (SAP, a method for forming fine conductive patterns using partial electroplating), followed by resist stripping to form a 3 µm wide plating pattern in a 4 µm pitch design (Figure c).
Sunfort™ dry film photoresist will continue to play a key role in developing panel-level packaging technology as panel sizes grow. The new TA Series allows manufacturers to achieve finer wiring with greater production efficiency, helping to reduce cost and increase yield in advanced semiconductor packaging. Asahi Kasei’s TA Series comes at a pivotal time as demand in AI, automotive, and IoT markets grows.
“The development of the TA Series comes after years of close collaboration with our customers and a deep understanding of their most pressing pain points. Through this development, we address the evolving requirements of semiconductor packaging in AI, automotive, and IoT applications,” said Yu Hasegawa, Managing Executive and Senior General Manager of the Electronics Interconnecting Materials Division at Asahi Kasei. “With growing demand, particularly in
To learn more about Asahi Kasei’s Sunfort™ visit https://www.asahi-kasei.co.jp/sunfort/en/products/ta.html.
About Asahi Kasei
The Asahi Kasei Group contributes to life and living for people worldwide. Since its foundation in 1922 with ammonia and cellulose fiber business, Asahi Kasei has consistently grown through the proactive transformation of its business portfolio to meet the evolving needs of every age. With more than 50,000 employees worldwide, the company contributes to sustainable society by providing solutions to the world’s challenges through its three business sectors of Material, Homes, and Healthcare. For more information, visit www.asahi-kasei.com.
Asahi Kasei is also dedicated to sustainability initiatives and is contributing to reaching a carbon neutral society by 2050. To learn more, visit https://www.asahi-kasei.com/sustainability/.
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North America Contact:
Asahi Kasei America Inc.
Christian OKeefe
christian.okeefe@ak-america.com
Europe Contact:
Asahi Kasei Europe GmbH
Sebastian Schmidt
sebastian.schmidt@asahi-kasei.eu
Source: Asahi Kasei
