Applied Matls Inc Stock Price, News & Analysis

Applied Materials (AMAT) has scheduled its fiscal second quarter 2025 earnings conference call for Thursday, May 15, 2025, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be accessible via live webcast through the company's investor relations website. A replay of the earnings call will be made available on the same day starting at 8:00 p.m. ET / 5:00 p.m. PT.

Applied Materials (AMAT) announced upcoming management participation in two major investor conferences. CEO Gary Dickerson will join a fireside chat at the Bernstein Strategic Decisions Conference on May 29, 2025, at 7:00 a.m. PT. Additionally, CFO Brice Hill will participate in the BofA Securities Global Technology Conference on June 4, 2025, at 10:40 a.m. PT.

Both sessions will be accessible via live audio webcast on Applied Materials' investor relations website, with replays available on the same day.

Applied Materials (AMAT) reported strong Q2 FY2025 results with revenue reaching $7.10 billion, up 7% year-over-year. The company achieved record GAAP EPS of $2.63 (up 28%) and non-GAAP EPS of $2.39 (up 14%). AMAT's performance was driven by AI computing demands and strong positioning in key technology segments. The company generated $1.57 billion in operating cash flow and returned $2.00 billion to shareholders through buybacks ($1.67B) and dividends ($325M). Gross margin improved to 49.1% GAAP and 49.2% non-GAAP. For Q3 FY2025, AMAT expects revenue of approximately $7.2 billion ±$500M with non-GAAP EPS projected at $2.35 ±$0.20. The Semiconductor Systems segment remained strong with revenue of $5.26 billion, while Applied Global Services contributed $1.57 billion.

Applied Materials (AMAT) has acquired 9% of BE Semiconductor Industries (Besi) common stock through market-based transactions, strengthening their ongoing collaboration in hybrid bonding technology. The companies have been working together since 2020 and recently extended their agreement to develop the industry's first fully integrated equipment solution for die-based hybrid bonding.

The strategic investment highlights AMAT's commitment to advancing hybrid bonding technology, which is becoming important for advanced semiconductor packaging. This technology enables direct copper-to-copper bonds between chips, resulting in improved performance, reduced power consumption, and lower costs - particularly important for advanced logic and memory chips used in AI applications.

The co-developed integrated hybrid bonding system combines Applied's front-end wafer and chip processing expertise with Besi's die placement, interconnect, and assembly solutions. AMAT stated it won't seek board representation or purchase additional Besi shares.

Applied Materials (AMAT) has announced two significant shareholder-friendly moves: a 15% increase in quarterly cash dividend to $0.46 per share, and a new $10 billion share repurchase authorization. The dividend will be payable on June 12, 2025, to shareholders of record as of May 22, 2025.

This marks the company's eighth consecutive year of dividend increases. The new buyback program supplements the existing authorization, which had approximately $7.6 billion remaining at the end of Q1 fiscal 2025. According to CFO Brice Hill, the company has distributed nearly 90% of free cash flow to shareholders over the past 10 fiscal years.

Applied Materials (AMAT) has announced its participation in the upcoming Cantor Fitzgerald Global Technology Conference. Brice Hill, Senior Vice President and CFO, will engage in a fireside chat session scheduled for March 12 at 5:00 a.m. PT / 8:00 a.m. ET.

Investors and interested parties can access a live audio webcast of the session through Applied Materials' investor relations website. A replay of the presentation will be made available on the same day through the company's website at ir.appliedmaterials.com.

Applied Materials has introduced the SEMVision H20, a new defect review system designed to enhance semiconductor manufacturing. The system combines advanced electron beam (eBeam) technology with AI image recognition to analyze nanoscale defects in leading-edge chips.

The system features second-generation cold field emission (CFE) technology, delivering up to 50% increased nanoscale image resolution and 10X faster imaging compared to conventional thermal field emission. The H20 can process results up to 3X faster than current techniques.

Key innovations include sub-nanometer resolution for identifying buried defects and deep learning AI capabilities that automatically distinguish true defects from false alarms. The system is particularly important for complex 3D architecture in 2nm node logic chips and higher-density memory manufacturing. Leading logic and memory chipmakers have already adopted the technology for emerging nodes.

Applied Materials (AMAT) reported strong Q1 FY2025 results with revenue reaching $7.17 billion, up 7% year-over-year. The company achieved GAAP gross margin of 48.8% and non-GAAP gross margin of 48.9%. GAAP EPS decreased 40% to $1.45, while non-GAAP EPS increased 12% to $2.38.

The company generated $925 million in cash from operations and returned $1.64 billion to shareholders through $1.32 billion in share repurchases and $326 million in dividends. For Q2 FY2025, Applied Materials expects revenue of approximately $7.1 billion (±$400M) with non-GAAP EPS projected at $2.30 (±$0.18).

The company recorded a $644 million income tax expense due to new tax incentive agreements in Singapore, impacting EPS by $0.79 per diluted share.

Applied Materials has announced its annual Supplier Excellence Awards, recognizing outstanding contributions to the company's operations in 2024. The awards acknowledge exceptional performance in key areas including quality, service, sustainability, lead time, delivery, cost, and responsiveness.

A total of 13 companies received awards across different categories. Nine companies were recognized for Best in Class Performance, while individual awards were given for Excellence in Aftermarket Support, New Product Support, Sustainability, and Quality. Dr. Paul Chhabra, Group Vice President of Global Supply Chain, emphasized the importance of supplier collaboration in advancing semiconductor technology to meet the demands of AI and IoT developments.