Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance
Applied Materials (NASDAQ: AMAT) introduced three manufacturing systems aimed at improving performance and yield for AI-focused logic and memory chips: the Kinex die-to-wafer hybrid bonding system, the Centura Xtera epitaxy system, and the PROVision 10 eBeam metrology system.
Key product claims: Kinex is the industry’s first integrated die-to-wafer hybrid bonder for complex multi-die packages; Xtera enables void-free GAA source/drain deposition with 50% lower gas usage and >40% improvement in cell-to-cell uniformity; PROVision 10 offers up to 50% higher image resolution and up to 10X faster imaging versus conventional TFE eBeam.
Applied Materials (NASDAQ: AMAT) ha presentato tre sistemi di produzione mirati a migliorare prestazioni e rendimento per chip logici e di memoria con focus sull'IA: il sistema di bonding ibrido die-to-wafer Kinex, il sistema di epitaxy Centura Xtera e il sistema di metrologia eBeam PROVision 10.
Principali claim sui prodotti: Kinex è il primo bonding ibrido die-to-wafer integrato nell'industria per pacchetti multi-die complessi; Xtera consente deposizione source/drain senza vuoti con un consumo di gas inferiore del 50% e una migliora del 40% nell'uniformità cell-to-cell; PROVision 10 offre fino al 50% in più di risoluzione dell'immagine e fino a 10x più veloce imaging rispetto al convenzionale eBeam TFE.
Applied Materials (NASDAQ: AMAT) presentó tres sistemas de fabricación destinados a mejorar el rendimiento y el rendimiento para chips lógicos y de memoria centrados en IA: el sistema de unión híbrida die-to-wafer Kinex, el sistema de epitaxia Centura Xtera y el sistema de metrología eBeam PROVision 10.
Principales afirmaciones de producto: Kinex es el primer soldador híbrido integrado die-to-wafer de la industria para paquetes complejos de múltiples dados; Xtera permite deposición de fuente/drenaje sin huecos con un consumo de gas un 50% menor y una mejora del 40% en la uniformidad celda a celda; PROVision 10 ofrece hasta un 50% más de resolución de imagen y hasta 10x más rápida imagenación frente al eBeam TFE convencional.
Applied Materials (NASDAQ: AMAT)는 인공지능에 초점을 둔 로직 및 메모리 칩의 성능과 수율을 향상시키기 위한 세 가지 제조 시스템을 발표했습니다: 다이-투-웨이퍼 하이브리드 본딩 시스템 Kinex, 에펙시 시스템 Centura Xtera, 그리고 eBeam 메트로로지 시스템 PROVision 10.
주요 제품 주장: Kinex는 복합 다이 패키지를 위한 업계 최초의 다이-투-웨이퍼 통합 하이브리드 본더; Xtera는 공극 없는 소스/드레인 증착을 가능하게 하며 가스 사용량을 50% 감소하고 셀 간 균일성 40% 향상; PROVision 10은 이미지 해상도 최대 50% 증가와 일반 TFE eBeam 대비 최대 10배 빠른 이미징을 제공합니다.
Applied Materials (NASDAQ: AMAT) a présenté trois systèmes de fabrication destinés à améliorer les performances et le rendement pour les puces logiques et mémoire axées sur l'IA: le système d'assemblage hybride die-to-wafer Kinex, le système d'épitaxie Centura Xtera et le système de métrologie eBeam PROVision 10.
Principales affirmations produit: Kinex est le premier bond/d పె die-to-wafer intégré pour les packages multi-dies complexes; Xtera permet une déposition source/drain sans cavité avec une consommation de gaz réduite de 50% et une amélioration de 40% de l'uniformité cellule à cellule; PROVision 10 offre une précision d'image jusqu'à 50% plus élevée et jusqu' à 10x plus rapide que l'imagerie TFE eBeam conventionnelle.
Applied Materials (NASDAQ: AMAT) stellte drei Fertigungssysteme vor, die darauf abzielen, Leistung und Yield für AI-fokussierte Logik- und Speicherkarten-Chips zu verbessern: das Kinex Die-zu-Wafer-Hybridbonding-System, das Centura Xtera Epitaxie-System und das PROVision 10 eBeam-Metrologie-System.
Zentrale Produktaussagen: Kinex ist der branchenweit erste integrierte Die-zu-Wafer-Hybrid-Bonder für komplexe Multi-Die-Packages; Xtera ermöglicht eine verlustfreie GAA-Source/Drain-Deposition mit 50% geringer Gasverbrauch und 40% Verbesserung der Zell-zu-Zell-Uniformität; PROVision 10 bietet bis zu 50% höhere Bildauflösung und bis zu 10x schnellere Bildgebung gegenüber herkömmlichem TFE-eBeam.
Applied Materials (NASDAQ: AMAT) قدمت ثلاث أنظمة تصنيع تهدف إلى تحسين الأداء وزيادة العائد لشرائح المنطق والذاكرة المعتمدة على الذكاء الاصطناعي: نظام الـ bonding الهجين die-to-wafer Kinex، ونظام epitaxy Centura Xtera ونظام القياس eBeam PROVision 10.
الادعاءات الرئيسية للمنتج: Kinex هو أول bondُ هجين متكامل من die إلى wafer في الصناعة حلاً لحزم متعددة الرقاقات المعقدة؛ يتيح Xtera ترسيب مصدر/صرف بدون فراغات مع انخفاض استهلاك الغاز بنسبة 50% و تحسين بنسبة 40% في الاتساق من خلية إلى خلية؛ يوفر PROVision 10 دقة صورة تصل إلى 50% أعلى وبسرعة تصوير حتى 10x أسرع مقارنة بــ TFE eBeam التقليدي.
Applied Materials (NASDAQ: AMAT) 推出三套生产系统，旨在提升面向AI的逻辑与存储芯片的性能与良率：Kinex 晶粒对晶粒混合键合系统、Centura Xtera 外延系统，以及 PROVision 10 eBeam 量测系统。
主要产品亮点：Kinex 是行业内首个集成的 die-to-wafer 混合键合器，适用于复杂多芯片封装；Xtera 能实现无空洞的源/漏沉积，气体消耗降低 50%，单元间一致性提升 40%；PROVision 10 提供最高 50% 更高的成像分辨率，且成像速度比传统 TFE eBeam 快 10 倍。
- Xtera epi achieves 50% lower gas usage versus conventional epi
- Xtera delivers >40% cell-to-cell uniformity improvement
- PROVision 10 increases nanoscale image resolution by up to 50%
- PROVision 10 boosts imaging speed by up to 10X
- Kinex is the industry’s first integrated die-to-wafer hybrid bonding system
- None.
Insights
Applied launched three manufacturing systems that target hybrid bonding, epi for GAA at 2nm+, and sub-nm eBeam metrology.
The Kinex system is described as the industry’s first integrated die-to-wafer hybrid bonder, combining bonding, placement and in-line metrology to reduce interconnect pitch and improve bonding consistency. The Centura Xtera epi tool claims void-free source/drain fills with a >40-percent improvement in cell-to-cell uniformity and 50-percent lower gas usage versus conventional epi, addressing high-aspect-ratio trench fills for GAA devices. The PROVision 10 eBeam metrology adds cold field emission imaging for up to 50-percent better nanoscale resolution and up to 10X imaging speed versus thermal field emission, enabling sub-nanometer, multi-layer measurements relevant to EUV overlay and epi void detection.
Dependencies and cautious points include customer qualification and integration into high-volume flows; the release notes these systems are being used by multiple leading-edge logic, memory and OSAT customers but does not disclose qualification timelines or volumes. Watch product adoption and qualification milestones around
New tools aim to solve specific manufacturing bottlenecks for AI-focused logic, memory and advanced packaging.
The announcement ties three targeted capabilities—integrated hybrid bonding (Kinex), void-free epi for GAA (Xtera), and deep 3D eBeam metrology (PROVision 10)—to clear device-level challenges that the content identifies: hybrid bonding complexity, high-aspect-ratio trench voids, and optical metrology limits. The statement that multiple leading-edge chipmakers and OSAT customers are using these systems signals early commercial engagement rather than hypothetical interest.
Risks remain around scale-up and process qualification; the content does not provide shipment volumes, revenue impact, or qualification schedules. Relevant near-term checkpoints include customer qualification updates and the presentation materials made available on
- Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips
- Xtera™ system enables higher performance Gate-All-Around transistors at 2nm and beyond by depositing void-free, uniform epitaxial layers
- PROVision™ 10 eBeam metrology system improves yield of complex 3D chips by providing sub-nanometer resolution, fast throughput and deep imaging
SANTA CLARA, Calif., Oct. 07, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost.
“As chips become more complex, Applied is focused on driving materials engineering breakthroughs to provide the performance and power-efficiency improvements needed to scale AI,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “We are collaborating earlier and deeper with our customers to co-develop solutions that accelerate chipmaker roadmaps and enable major device inflections in logic, memory and advanced packaging.”
New Kinex™ Bonding System Enables Production of Higher Performance, Lower Power Advanced Logic and Memory Chips
To optimize performance and power efficiency, today’s leading GPUs and high-performance computing (HPC) chips use advanced packaging schemes to combine multiple chiplets into complex systems. Hybrid bonding is an emerging chip-stacking technology that uses direct copper-to-copper bonds, resulting in significant improvements in overall performance, power consumption and cost.
Increasingly complex chip packages create challenges for hybrid bonding in high-volume manufacturing. To accelerate the use of hybrid bonding in advanced logic and memory chips, Applied Materials, in collaboration with BE Semiconductor Industries N.V. (Besi), developed the Kinex™ Bonding system – the industry’s first integrated die-to-wafer hybrid bonder. The system brings together Applied’s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi’s leading die placement, interconnect and assembly solutions.
The Kinex system integrates all the critical hybrid bonding process steps into one system, offering several major advantages compared to non-integrated approaches:
- Better management of complex multi-die packages because of superior die-level tracing
- Smaller interconnect pitches enabled by high-accuracy bonding and clean, controlled environment
- Improved bonding consistency and quality through precise control over the queue time between hybrid bonding process steps
- Faster overlay measurement and drift detection achieved by integrated, in-line metrology
The Kinex system is being used by multiple leading-edge logic, memory and OSAT* customers. An animation of the system can be viewed here.
New Centura™ Xtera™ Epi System Enables Higher Performance GAA Transistors at 2nm and Beyond
Among the most critical features affecting the performance and reliability of today’s state-of-the-art GAA transistors are the source and drain structures, which form the transistor channel. The source and drain are created by precisely depositing materials in deep trenches using an epitaxial (epi) process. Filling the high aspect ratio source/drain trenches of 3D GAA transistors using conventional epi is challenging and can lead to voids and uneven growth which reduces performance and reliability.
To solve this challenge and enable maximum chip performance, Applied Materials developed the Centura™ Xtera™ Epi system. The Xtera system features a unique low-volume chamber architecture which includes integrated pre-clean and etch processes to enable void-free GAA source-drain structures with 50 percent lower gas usage than conventional epi. The system’s innovative deposition-etch process continuously adjusts the trench opening as material grows on the side walls and bottom of the trench, optimizing epi growth across the billions of transistors on a wafer, void free with a greater than 40-percent improvement in cell-to-cell uniformity.
The Xtera system is being adopted by leading logic and memory chipmakers. An animation of the system’s capabilities can be viewed here.
Introducing PROVision™ 10 eBeam Metrology System That Improves Yield of Complex 3D Chips
“The increased use of 3D architectures in logic and memory is creating new metrology challenges that are pushing optical technology to the limits,” said Keith Wells, Group Vice President of Imaging and Process Control at Applied Materials. “Applied is extending its eBeam leadership with breakthroughs in imaging resolution, deep into the 3D architecture at high throughput, giving chipmakers the ability to obtain precise measurements and accelerate yield of complex chip designs.”
The new PROVision™ 10 is a cutting-edge eBeam metrology system purpose-built for advanced logic chips – including GAA transistor and Backside Power Delivery architectures – as well as next-generation DRAM and 3D NAND chips. It is the industry’s first metrology system to feature cold field emission (CFE) technology, which increases nanoscale image resolution by up to 50 percent and imaging speed by up to 10X compared to conventional thermal field emission (TFE) technology. The PROVision 10 system’s sub-nanometer imaging capabilities allow it to see through multiple layers of 3D chips and provide an integrative, multi-layer image. The system enables direct on-device overlay measurements and precise critical dimension (CD) metrology, beyond the limits of traditional optical systems. Its unique capabilities support key process control tasks, such as EUV layer overlay and nanosheet measurement and epi void detection in GAA transistors, making it a critical tool for 2nm and beyond, as well as HBM integration.
The PROVision 10 system is being used by multiple leading logic and memory chipmakers.
A media kit with additional information on the Kinex, Xtera and PROVision 10 systems is available on the Applied Materials website.
The new systems, along with other innovations for making future AI chips, will be discussed at Applied’s SEMICON West 2025 Technology Breakfast. The presentation from the event will be available on the Applied Materials website at: https://ir.appliedmaterials.com on Tuesday, Oct. 7, 2025 at 9:00 a.m. ET / 6:00 a.m. PT.
*OSAT = Outsourced Semiconductor Assembly and Test
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at www.appliedmaterials.com.
Contact:
Ricky Gradwohl (Media) 408.235.4676
Investor Relations (Financial Community) 408.986.7977
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FAQ
What did Applied Materials announce on Oct 7, 2025 about AMAT products for AI chips?
How does the Centura Xtera system improve 2nm GAA transistor manufacturing for AMAT?
What are the claimed benefits of the PROVision 10 eBeam metrology system for AMAT customers?
What makes the Kinex bonding system notable for AMAT (AMAT) customers?
Which chip types did Applied say will benefit from these AMAT systems?
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