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Applied Materials Inc. develops materials engineering equipment and process technologies used in semiconductor manufacturing and advanced displays. News about AMAT centers on chipmaking systems for atomic-scale deposition, Gate-All-Around logic, DRAM and high-bandwidth memory, 3D advanced packaging, and process control for AI and high-performance computing devices.
Company updates also cover EPIC Center collaborations with chipmakers and ecosystem partners, commercialization pathways from R&D to high-volume manufacturing, quarterly earnings communications, dividend actions, capital allocation, and investor-conference participation.
Applied Materials (NASDAQ: AMAT) reported record Q2 FY2026 revenue of $7.91 billion, up 11% year over year, with GAAP gross margin of 49.9% and operating margin of 31.9%.
GAAP EPS reached a record $3.51 and non-GAAP EPS $2.86. The company announced new EPIC Center partnerships, an agreement to acquire ASMPT’s NEXX business, raised its quarterly dividend 15% to $0.53 per share, and guided Q3 FY2026 revenue to $8.95 billion ± $0.5 billion with non-GAAP EPS of $3.36 ± $0.20.
Applied Materials (NASDAQ: AMAT) announced that Arizona State University, Rensselaer Polytechnic Institute and Stanford University are joining its Silicon Valley-based EPIC Center as inaugural research partners.
The EPIC (Equipment and Process Innovation and Commercialization) Center, described as the largest-ever U.S. investment in advanced semiconductor equipment R&D, aims to speed lab-to-fab innovation for energy-efficient AI chips. University teams will work with Applied’s scientists on advanced materials, novel processes, devices and chip architectures, gaining access to industry-scale tools and manufacturing-relevant environments. The facility is scheduled to become operational in 2026 and is intended to help develop future semiconductor talent.
Applied Materials (NASDAQ:AMAT) and TSMC formed a new innovation partnership at Applied’s EPIC Center in Silicon Valley to develop materials, equipment and process technologies for next-generation AI-focused semiconductors.
The collaboration targets advanced logic scaling, 3D transistor and interconnect structures, yield and variability improvements, supported by a planned EPIC Center capital spend scaling to about $5 billion.
Applied Materials (NYSE:AMAT) announced management participation in upcoming investor conferences with live audio webcasts and same-day replays.
Sessions: Tim Deane at J.P. Morgan on May 20, 2026 (5:00 a.m. PT / 8:00 a.m. ET); Gary Dickerson at Bernstein on May 28, 2026 (6:00 a.m. PT / 9:00 a.m. ET); Brice Hill at BofA on June 2, 2026 (8:40 a.m. PT / 11:40 a.m. ET). Webcasts at https://ir.appliedmaterials.com.
Applied Materials (NYSE: AMAT) has agreed to acquire ASMPT’s NEXX business to broaden its panel‑level advanced packaging portfolio. The deal adds NEXX’s large‑area electrochemical deposition (ECD) tools and team, targeting panel form factors up to ~510x515 mm to support larger AI accelerator packages.
The transaction is expected to close within several months, is subject to customary closing conditions, requires no regulatory approvals, and will integrate the NEXX team into Applied’s Semiconductor Products Group in Billerica, Massachusetts.
Applied Materials (NYSE:AMAT) will report fiscal Q2 2026 results and host an earnings conference call on May 14, 2026 at 4:30 p.m. ET / 1:30 p.m. PT.
The call will be webcast live at the company investor site and a replay will be available the same day beginning at 8:00 p.m. ET / 5:00 p.m. PT.
Applied Materials (NASDAQ: AMAT) announced Advantest will join its EPIC platform as an innovation partner, co-locating a new Advantest Innovation Center on Applied’s Silicon Valley R&D campus to link front-end manufacturing and back-end test workflows.
The partnership aims to accelerate commercialization of next-generation semiconductors and 3D advanced packaging; Applied’s EPIC Center is on track to become operational in 2026.
Applied Materials (NASDAQ: AMAT) on April 8, 2026 introduced two deposition systems — Precision Selective Nitride PECVD and Trillium ALD — aimed at enabling angstrom-level materials control for Gate-All-Around (GAA) logic at 2nm and beyond.
These systems target STI preservation, lower parasitic capacitance and atomic-scale metal gate stacks to improve transistor performance, power and manufacturability for AI compute chips.
Applied Materials (NASDAQ: AMAT) announced a 15% increase in its quarterly cash dividend, raising the payout from $0.46 to $0.53 per share, payable June 11, 2026 to shareholders of record on May 21, 2026.
This is the ninth consecutive annual increase; the company says the dividend per share has more than doubled since four years ago and reflects an 18% compound annual growth rate over the past decade. Over ten fiscal years, Applied says it has returned nearly 90% of free cash flow to shareholders via dividends and share repurchases.
Applied Materials (NYSE: AMAT) and SK hynix announced a long-term R&D collaboration to accelerate next-generation DRAM and HBM innovations at Applied’s new EPIC Center in Silicon Valley.
The agreement makes SK hynix a founding partner, establishes co-innovation programs in materials, process integration and 3D advanced packaging, and ties to Applied’s $5 billion EPIC Center investment.