Applied Materials Inc. develops materials engineering equipment and process technologies used in semiconductor manufacturing and advanced displays. News about AMAT centers on chipmaking systems for atomic-scale deposition, Gate-All-Around logic, DRAM and high-bandwidth memory, 3D advanced packaging, and process control for AI and high-performance computing devices.
Company updates also cover EPIC Center collaborations with chipmakers and ecosystem partners, commercialization pathways from R&D to high-volume manufacturing, quarterly earnings communications, dividend actions, capital allocation, and investor-conference participation.
Applied Materials (AMAT) expanded its partnership with Besi, which is joining Applied’s EPIC Center as an Innovation Partner for packaging development. Besi engineers will work alongside Applied’s teams, extending a collaboration launched in 2020 beyond hybrid bonding, a method for connecting chips. The companies intend to give mutual customers earlier access to jointly optimized process and assembly solutions.
Expected research programs cover new die-to-wafer hybrid bonding platforms, thermo-compression bonding, additional chip-stacking architectures and photonics-enabled connections. The collaboration targets next-generation three-dimensional chip scaling and logic and memory integration for AI systems. Applied’s Silicon Valley EPIC Center will be operationally ready in 2026; capital spending is expected to scale over time to approximately $5 billion as customer projects commence.
Applied Materials (AMAT) announced that KIOXIA will join its EPIC Center in Silicon Valley as an innovation partner for next-generation memory development. The companies plan to collaborate on memory cells and structures, chip stacking, advanced packaging and materials engineering aimed at increasing memory density and performance for AI applications.
The EPIC Center is expected to be operationally ready in 2026. Applied expects capital spending to scale over time to approximately $5 billion as customer projects commence. The center is designed to shorten the path from early-stage research to full-scale manufacturing; its co-innovation programs are intended to help guide Applied’s R&D investments and increase R&D productivity.
Applied Materials (AMAT) will host an Investor Breakfast Presentation during SEMICON West on Tuesday, Oct. 13, 2026. The event will run from 8:00 a.m. to approximately 10:30 a.m. PT. A live webcast and same-day replay of the presentation will be accessible through the Applied Materials investor relations website.
Applied Materials (AMAT) declared a quarterly cash dividend of $0.53 per share on its common stock, payable on Dec. 10, 2026 to shareholders of record on Nov. 19, 2026.
The company highlights the dividend as a core part of its capital allocation strategy. The current rate reflects a 15% increase from $0.46 announced in March 2026 and marks nine consecutive years of dividend increases. Applied reports its dividend per share has grown at an 18% compound annual rate over the past decade and that over the last 10 fiscal years it has returned nearly 90% of free cash flow via dividends and buybacks. In Q3 fiscal 2026, the company returned $860 million through dividends and repurchases and had about $12.8 billion remaining under its share repurchase authorization.
Applied Materials (NASDAQ: AMAT) announced that Akash Palkhiwala, Chief Financial Officer and Chief Operating Officer of Qualcomm, has been appointed to its board of directors and to the board’s Audit Committee. Applied Materials highlighted his extensive financial, operational and semiconductor industry experience, including serving as Qualcomm’s CFO since 2019 and COO since 2024, with responsibilities spanning finance, global go-to-market teams, semiconductor operations and IT.
Applied Materials (NASDAQ: AMAT) announced that senior executives will speak at two upcoming investor conferences. CFO Brice Hill will join a fireside chat at the Citi 2026 Global TMT Conference on Sept. 8, and CEO Gary Dickerson will appear at the Goldman Sachs Communacopia + Technology Conference on Sept. 9. Live audio webcasts and same-day replays will be accessible via the company’s investor relations website.
Applied Materials (NASDAQ: AMAT) reported record Q3 FY2026 revenue of $9.12 billion, up 25% year over year. GAAP gross margin was 50.3%, operating income $3.08 billion (33.7% margin), and GAAP EPS $3.17, up 43%. Non-GAAP EPS reached a record $3.50, up 41%, with non-GAAP operating margin of 34.0%.
The company generated record operating cash flow of $3.04 billion and non-GAAP free cash flow of $2.33 billion (+14%), returning $860 million via buybacks and dividends. Q4 FY2026 guidance calls for revenue of $10.25 billion ± $0.5 billion and non-GAAP diluted EPS of $4.02 ± $0.20. Semiconductor Systems revenue was $7.04 billion with a 37.7% operating margin; Applied Global Services revenue was $1.78 billion with a 30.1% operating margin. Applied highlighted multiple new DRAM, 3D NAND, and advanced packaging systems, expanded EPIC Center partnerships, a new $500 million Singapore campus, and a joint development agreement for next-generation smart eyewear.
Applied Materials (NASDAQ: AMAT) announced that the University of California, Berkeley will join its Silicon Valley-based EPIC (Equipment and Process Innovation and Commercialization) Center as a research collaborator. UC Berkeley faculty and students will work alongside Applied scientists and engineers on semiconductor materials and process innovations that underpin AI computing.
The EPIC Center provides university researchers access to industry-scale chipmaking tools to speed validation and transfer of ideas into manufacturing. According to Applied Materials, the EPIC Center represents the largest-ever U.S. investment in advanced semiconductor equipment R&D and is on track to become operational in 2026.
Applied Materials (NASDAQ: AMAT) announced it will hold its fiscal third quarter 2026 earnings conference call on Thursday, Aug. 13, 2026, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be webcast live at the company’s investor relations website, with a replay available the same day by 8:00 p.m. ET / 5:00 p.m. PT.
Applied Materials (AMAT) announced a suite of new systems to accelerate DRAM and advanced packaging for AI chips. The portfolio spans epitaxy, CMP, deposition and eBeam to enable high-bandwidth memory (HBM), 3D stacking and chiplet architectures.
Key launches include an enhanced Centura Prime Epi tool with a 20% smaller footprint, new Opta Quad CMP, Nokota VMax 2 ECD and Producer Avila 2 PECVD systems, plus VeritySEM 7AP CD metrology and SEMVision G7AP defect analysis for advanced packaging fabs.