Applied Matls Inc Stock Price, News & Analysis

Applied Materials has introduced the PROVision® 3E system, a groundbreaking eBeam metrology solution designed for advanced chip manufacturing. This system offers nanometer resolution, high speed, and through-layer imaging, enabling accurate measurements vital for complex chip designs.

With 30 installations at leading foundry-logic, DRAM, and NAND customers, the PROVision 3E system resolves critical measurement issues associated with feature shrinking and 3D designs. This innovation supports enhanced performance, power, and time-to-market efficiencies for semiconductor manufacturers.

Applied Materials has appointed Bob Halliday as interim CFO following the departure of Dan Durn to become CFO at Adobe. Halliday, a former CFO at Applied Materials, will serve until a permanent successor is found. Durn has credited his tenure with significant contributions to the company, highlighting strong financial results and shareholder returns. Notably, the company’s guidance for the fourth quarter of fiscal 2021 remains unchanged, despite uncertainties in the market due to factors like demand fluctuations and the ongoing COVID-19 pandemic.

Applied Materials, Inc. has launched advanced software modeling for die-to-wafer hybrid bonding at its Advanced Packaging Development Center, enhancing customer time to market. The company entered a joint development agreement with EV Group for wafer-to-wafer bonding solutions, and acquired Tango Systems to enable larger, high-quality substrates. These innovations support heterogeneous integration, improving power, performance, area, cost, and time to market (PPACt™). Applied's extensive portfolio and collaborations aim to accelerate semiconductor technology roadmaps.

Applied Materials has introduced advanced solutions to facilitate the transition of silicon carbide (SiC) chipmakers from 150mm to 200mm wafer production, effectively doubling die output. The company's new 200mm CMP system enhances chip performance and yield by significantly reducing surface roughness. Additionally, Applied's hot implant technology optimizes ion implantation, resulting in a 40X reduction in resistivity. These innovations aim to meet the rising demand for efficient SiC power semiconductors essential in electric vehicle powertrains.

Applied Materials has declared a quarterly cash dividend of $0.24 per share, scheduled for payment on December 16, 2021, to shareholders of record as of November 26, 2021. This dividend aligns with the company's capital allocation strategy, which returned $1.72 billion or 111% of free cash flow to shareholders during the third quarter of fiscal 2021. Additionally, the company has approximately $6.5 billion remaining in its share buyback authorization.

Applied Materials reported record quarterly revenue of $6.20 billion, a significant 41% increase year-over-year. The company achieved a GAAP operating margin of 32.5% and a non-GAAP operating margin of 32.7%, marking substantial year-over-year improvements. GAAP earnings per share (EPS) reached $1.87, up 105%, while non-GAAP EPS was $1.90, reflecting a 79% increase. The third quarter concluded with cash from operations totaling $1.69 billion and $1.72 billion returned to shareholders through share repurchases and dividends.

Applied Materials, Inc. announced that Dan Durn, Senior Vice President and CFO, will participate in several upcoming virtual investor conferences. The events include:

• Needham SemiCap and EDA Conference on Aug. 24 at 9:45 a.m. PT / 12:45 p.m. ET.
• Deutsche Bank Technology Conference on Sept. 10 at 9:45 a.m. PT / 12:45 p.m. ET.
• Citi Global Technology Conference on Sept. 15 at 10:00 a.m. PT / 1:00 p.m. ET.
• J.P. Morgan U.S. All Stars Conference on Sept. 21 at 9:00 a.m. PT / 12:00 p.m. ET.

A live webcast will be available on the company's website.

Applied Materials will host a webcast to discuss its third quarter of fiscal 2021 financial results on August 19, 2021, at 4:30 p.m. ET. The live session can be accessed on the company's website, with a replay available later the same day starting at 8:00 p.m. ET. As a leader in materials engineering solutions, Applied Materials supports the production of new chips and advanced displays globally, driving innovation and transformation in the industry.

Applied Materials has introduced the Endura® Copper Barrier Seed IMS™ system, a breakthrough for wiring advanced logic chips, enabling scaling to the 3nm node. This solution combines seven process technologies under vacuum, reducing electrical resistance at the via contact interface by up to 50%. The new materials engineering approach enhances chip performance and power efficiency, addressing the challenges of smaller interconnects that traditionally increase resistance. Leading foundry-logic customers are already utilizing this system to facilitate advanced chip design and improve battery life.