Welcome to our dedicated page for Applied Matls news (Ticker: AMAT), a resource for investors and traders seeking the latest updates and insights on Applied Matls stock.
Applied Materials, Inc. (NASDAQ: AMAT) generates a steady flow of news that reflects its role in semiconductor and advanced display manufacturing, AI infrastructure and capital markets activity. Company updates frequently highlight how its materials engineering solutions support advanced logic, DRAM, high-bandwidth memory and complex 3D chip architectures that underpin AI computing.
Investors following AMAT news can expect regular earnings announcements, where the company reports quarterly and annual results, segment performance for Semiconductor Systems, Applied Global Services and display-related activities, and management’s commentary on technology inflections, demand trends and regulatory impacts. These releases often include non-GAAP reconciliations and business outlook ranges for upcoming quarters.
Applied Materials also issues news about product and technology introductions. Recent examples include the Kinex die-to-wafer hybrid bonding system, the Centura Xtera epitaxy system for Gate-All-Around transistors at advanced nodes, and the PROVision 10 eBeam metrology system for complex 3D chips. Such announcements provide insight into how the company is addressing challenges in hybrid bonding, epitaxial growth and nanoscale metrology for next-generation devices.
Another recurring theme in AMAT news is strategic collaboration and ecosystem development. The company has announced a partnership with GlobalFoundries to establish a waveguide fabrication facility in Singapore for AI-driven photonics and augmented reality applications. It has also described its role in U.S. semiconductor manufacturing initiatives, including supplying American-made equipment from its Austin facility and investing in a new advanced manufacturing site in Arizona.
News items additionally cover capital allocation and financing, such as cash dividend declarations, share repurchase activity, new credit agreements and public offerings of senior unsecured notes. Conference participation and investor event webcasts are also regularly announced. This news page aggregates these developments so readers can review AMAT’s operational, technological and financial updates in one place.
Applied Materials announced that Dan Durn, Senior Vice President and CFO, will participate in a fireside chat at the virtual Morgan Stanley Technology, Media and Telecom Conference on March 2, 2021, starting at 10:15 a.m. PT / 1:15 p.m. ET.
A live audio webcast will be available on the Applied Materials website, with a replay to be accessible on the same day. Applied Materials, listed under Nasdaq: AMAT, is a leader in materials engineering solutions used in chip and advanced display production.
Applied Materials, a leader in materials engineering solutions, will host a webcast on Feb. 18, 2021, at 4:30 p.m. ET to discuss its first quarter fiscal 2021 financial results. The live event will be available on the company's website, with a replay starting later that same day at 8:00 p.m. ET. As a key player in chip and advanced display production, Applied Materials continues to innovate, impacting technology globally.
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Applied Materials has appointed Rani Borkar to its Board of Directors, effective December 14. Borkar, with extensive experience in semiconductor design and cloud computing, is currently a Corporate Vice President at Microsoft. Her previous roles include significant positions at IBM and Intel, where she led various teams in processor and System-on-a-Chip development. Tom Iannotti, Chairman of the Board, expressed confidence in her ability to contribute to growth and shareholder value as Applied seeks to expand its ecosystem engagements.
Think Silicon announced the shipping of its updated NEMA pico XS and pico XL Multi-Core GPU IP-Series, designed for ultra-low power embedded systems. This innovative series offers features such as multicore configurations and video overlay functionality, catering to the demand for high-performance graphics in compact devices. With the lowest CPU utilization in the industry and power consumption under 1mW, the NEMA pico XS is optimized for devices with limited resources. The NEMA pico XL is available in three configurations, supports various applications including wearables and IoT devices, and introduces new extensions for enhanced graphics and video functionality.
Applied Materials has announced a quarterly cash dividend of $0.22 per share for its common stock. The payment will be made on March 18, 2021, to shareholders on record as of February 25, 2021. The company is recognized as a leader in materials engineering solutions crucial for chip production and advanced displays.
Applied Materials announced participation in virtual investor conferences featuring CEO Gary Dickerson and CFO Dan Durn. Dickerson will engage in a fireside chat at the Credit Suisse Technology Conference on Dec. 1 at 9:10 a.m. PT. Durn is set to participate in multiple events, including the Nasdaq Virtual Investor Conference on Dec. 2 at 8:30 a.m. PT and the Wells Fargo TMT Summit at 11:40 a.m. PT. A second session for Durn will occur at the Barclays Conference on Dec. 10 at 8:00 a.m. PT. Live webcasts and replays will be available on the Applied Materials website.
Applied Materials reported a record quarterly revenue of $4.69 billion for Q4 FY2020, a 25% increase year over year. The company also achieved a GAAP EPS of $1.23, up 64%, and a non-GAAP EPS of $1.25, up 56%. For the full year, revenues reached $17.20 billion, with GAAP EPS at $3.92, a 37% rise from FY2019. The company generated $3.80 billion in cash from operations and returned $250 million to shareholders. Looking ahead, Applied expects Q1 FY2021 revenues to be around $4.95 billion.
Applied Materials will host a webcast on November 12, 2020, at 4:30 p.m. ET to discuss its fourth quarter and fiscal 2020 financial results. Investors and the public can access the live webcast through the company's website. A replay will be available later that evening. Applied Materials is recognized as a leader in materials engineering solutions for chip and display production, enabling technological advancements.
Applied Materials and Besi have launched a joint development program to create the industry’s first comprehensive solution for die-based hybrid bonding. This technology enhances chip-to-chip interconnects, crucial for applications in AI, 5G, and high-performance computing. As the semiconductor industry transitions from traditional scaling, this collaboration aims to improve performance, power efficiency, and reduce costs. The Center of Excellence will be established in Singapore, where the companies will optimize equipment solutions to accelerate the adoption of hybrid bonding.
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