Advanced Micro Devices reports news on high-performance and AI computing products used across cloud and AI infrastructure, embedded systems, AI PCs and gaming. Recurring updates cover AMD Instinct GPUs, AMD EPYC processors, Ryzen AI processors, networking and software, along with customer and ecosystem collaborations tied to AI infrastructure and full-stack computing platforms.
Company news also includes quarterly financial results, earnings-call materials, annual stockholder meeting notices, product portfolio launches and strategic technology collaborations involving memory, compute infrastructure and AI platforms. These developments reflect AMD’s role as a semiconductor operating company serving data center, PC, gaming, embedded, industrial and automotive markets.
AMD has announced the retirement of President Victor Peng, effective August 30, 2024. Peng, who rejoined AMD in 2022 following the Xilinx acquisition, will continue in an advisory role until his retirement date. Under his leadership, AMD became the industry's #1 provider of FPGA and adaptive computing solutions.
As part of the transition, Vamsi Boppana, Senior VP of the Artificial Intelligence Group, will expand his responsibilities to include the AMD Instinct™ data center AI accelerator business. Salil Raje, Senior VP and GM of the Adaptive and Embedded Computing Group, will continue leading the AMD embedded business. Both Boppana and Raje will report directly to AMD Chair and CEO Dr. Lisa Su.
Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates for hyperscale data center computing. These substrates, produced in SEMCO's Busan technology hub and new Vietnam factory, are designed to enhance the performance and reliability of next-generation data centers.
The semiconductor substrate market is projected to grow at a 7% annual rate, reaching 20 trillion KRW by 2028. SEMCO's 1.9 trillion KRW investment in its FCBGA factory demonstrates its commitment to advancing substrate technology. The collaboration focuses on integrating multiple semiconductor chips (Chiplets) on large substrates, which are ten times larger and have three times more layers than standard computer substrates.
SEMCO's advanced manufacturing processes address challenges like warpage, ensuring high yields during chip mounting. The FCBGA factory's real-time data collection and modeling capabilities enable the development of predictive manufacturing models for signal, power, and mechanical integrity.
AMD (NASDAQ: AMD) has announced that it will release its fiscal second quarter 2024 financial results on Tuesday, July 30, 2024, after the market closes. The company will hold a conference call at 5:00 p.m. EDT / 2:00 p.m. PDT to discuss the results. Investors and interested parties can listen to the webcast of the conference call through the AMD Investor Relations website at ir.amd.com. This announcement provides an opportunity for stakeholders to gain insights into AMD's financial performance and future outlook.
AMD announced its definitive agreement to acquire Silo AI, Europe's largest private AI lab, for $665 million in an all-cash transaction. This acquisition aims to accelerate the development and deployment of AMD-powered AI models and software solutions, enhancing open-source AI software capabilities. The transaction is set to close in the second half of 2024. Silo AI, based in Helsinki, specializes in end-to-end AI solutions for markets like cloud, embedded, and endpoint computing, with clients including Allianz, Philips, Rolls-Royce, and Unilever. The Silo AI team, led by CEO Peter Sarlin, will join AMD's Artificial Intelligence Group under SVP Vamsi Boppana. This move is part of AMD’s strategy to deliver end-to-end AI solutions and strengthen its global AI ecosystem.
AMD has announced a collaboration with Sun Singapore, the top smart parking solutions provider in Singapore, to deploy an AI-based smart parking system. This new system will use AMD Zynq UltraScale+ MPSoC devices, improving vehicle license plate recognition, parking spot vacancy detection, lane jam, accident detection, and parking violations enforcement.
PlanetSpark’s EdgeAI Box X7, powered by AMD's FPGA technology, will assist in delivering low latency and energy-efficient AI inferencing at the edge. The adaptable nature of the FPGA provides a long lifecycle for edge devices, capable of adjusting to evolving AI models and algorithms.
The collaboration aims to replace outdated electronic parking systems with advanced AI-driven solutions to enhance operational efficiency and reporting capabilities for car park operators. The new system promises license plate reading accuracy of 99%.
AMD (NASDAQ: AMD) announced that Ruth Cotter, Senior Vice President of Marketing, Communications, and Human Resources, will present at the UBS Women in Tech Summit. The event is scheduled for June 12, 2024, at 10:30 am PT / 1:30 pm ET. A webcast of the presentation will be available on AMD's Investor Relations website.
AMD announced that Jean Hu, their EVP, CFO, and Treasurer, will present at the Nasdaq London Investor Conference, held in partnership with Jefferies. This event is scheduled for Tuesday, June 11, 2024, at 2:45 pm GMT / 6:45 am PDT. The presentation will be available via webcast on AMD's Investor Relations website.
At Computex 2024, AMD (NASDAQ: AMD) introduced its next-generation
At Computex 2024, AMD (NASDAQ: AMD) introduced an expanded roadmap for its AMD Instinct accelerator family. The new roadmap includes the AMD Instinct MI325X, available in Q4 2024, featuring up to 288GB of HBM3E memory. The subsequent AMD Instinct MI350 series, based on AMD CDNA 4 architecture, will be available in 2025 with a 35x AI inference performance increase over its predecessor. AMD also previewed the MI400 series, expected in 2026, built on the AMD CDNA 'Next' architecture. These updates aim to meet the growing demand for AI compute in data centers. Key partners like Microsoft Azure, Meta, and Dell Technologies are already utilizing AMD's current MI300X accelerators. AMD's ROCm 6 software stack continues to enhance performance for popular AI models, showcasing 1.3x better inference performance and token generation compared to competitors.
At Computex 2024, AMD introduced several advancements in AI and high-performance computing.
The new AMD Instinct MI325X accelerators, featuring 288GB HBM3E memory, will be available in Q4 2024, extending AMD's AI performance leadership. AMD also previewed its 5th Gen EPYC processors, targeting a 2H 2024 release.
AMD revealed the Ryzen AI 300 Series for laptops and the Ryzen 9000 Series for desktops, both promising superior performance for PCs. Microsoft, HP, Lenovo, and Asus showcased new AI-powered products using these processors.
AMD also unveiled the AMD Versal AI Edge Gen 2 devices for edge AI applications, highlighting collaborations with companies like Subaru and Canon.