Samsung Electro-Mechanics Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing
Rhea-AI Summary
Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates for hyperscale data center computing. These substrates, produced in SEMCO's Busan technology hub and new Vietnam factory, are designed to enhance the performance and reliability of next-generation data centers.
The semiconductor substrate market is projected to grow at a 7% annual rate, reaching 20 trillion KRW by 2028. SEMCO's 1.9 trillion KRW investment in its FCBGA factory demonstrates its commitment to advancing substrate technology. The collaboration focuses on integrating multiple semiconductor chips (Chiplets) on large substrates, which are ten times larger and have three times more layers than standard computer substrates.
SEMCO's advanced manufacturing processes address challenges like warpage, ensuring high yields during chip mounting. The FCBGA factory's real-time data collection and modeling capabilities enable the development of predictive manufacturing models for signal, power, and mechanical integrity.
Positive
- Collaboration with AMD for high-performance substrates in data centers
- Projected 7% annual growth in semiconductor substrate market
- 1.9 trillion KRW investment in FCBGA factory
- Advanced manufacturing processes to ensure high yields
- Real-time data collection and modeling capabilities for predictive manufacturing
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, AMD gained 2.83%, reflecting a moderate positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology
Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about
SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.
SEMCO's FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling SEMCO to develop predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components, meeting the forward-looking needs of next-generation data centers.
"We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions," said Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics. "Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems." "At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers," says Scott Aylor, Corporate VP of Global Operation Manufacturing Strategy at AMD. "Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products."
About Samsung Electro-Mechanics
For over 50 years, Samsung Electro-Mechanics (SEMCO) has been a leading developer and manufacturer of a wide range of mechanical and high-tech electronic components. Founded in 1973, SEMCO has grown into a world-class company, supplying essential electronic parts to industries worldwide. Our product portfolio includes chip parts, communication modules and substrates, and optical components, addressing the challenges of next-generation designs. Our employees are dedicated to innovating and producing high-quality components that enhance modern technology and everyday life. Learn more at Samsung Electro-Mechanics.
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SOURCE Samsung Electro-Mechanics
FAQ
What is the collaboration between Samsung Electro-Mechanics and AMD for?
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