Amkor Technology Inc. reports developments tied to its outsourced semiconductor assembly and test business, including quarterly results, dividends, investor presentations and capital-structure actions. The company provides semiconductor packaging and test services for semiconductor companies, foundries and electronics OEMs, with offerings that include advanced packaging, wafer-level processing, system-in-package solutions, flip chip, fine pitch bumping, power modules and wirebond packaging.
Recurring AMKR news also covers financing activity such as convertible senior notes, secondary common-stock offerings, shareholder voting matters and updates on the company’s Nasdaq-listed common stock. Operating updates commonly reference end markets such as smartphones, data centers, artificial intelligence, automobiles and wearables.
Amkor Technology (AMKR) reported third-quarter 2026 net income of $191 million, with higher margins and earnings than a year earlier. Sales were $1.991 billion, versus $1.987 billion in Q3 2025 and $1.898 billion in Q2 2026. Diluted earnings rose to $0.76 from $0.51 a year earlier, while gross margin reached 18.3%, versus 14.3%. Operating income increased to $225 million from $159 million.
Amkor expects Q4 sales of $1.9 billion to $2.0 billion, gross margin of 18.0% to 19.0%, and net income of $160 million to $185 million, or $0.65 to $0.75 per diluted share. Full-year capital expenditures were updated to approximately $2.5 billion. Cash and short-term investments totaled $2.4 billion at September 30, against $2.5 billion in debt. Nine-month operating cash flow rose to $868.345 million from $451.126 million a year earlier.
Amkor Technology (AMKR) announced a $1.3 billion agreement with NVIDIA supporting further expansion of semiconductor packaging capacity in South Korea.
The commitment brings the companies’ multi-year agreements in Arizona and South Korea to $3 billion, building on their recent Arizona collaboration. Amkor said the prepayments align its manufacturing capacity with NVIDIA’s long-term growth plans and support increasing demand for advanced packaging used in AI and accelerated computing platforms.
NVIDIA said the collaboration helps it scale production of current and next-generation platforms while strengthening its global supply chain. Amkor will also exhibit its packaging and test capabilities at NVIDIA GTC Washington, D.C. from November 30 to December 3.
Amkor Technology (AMKR) will release its third-quarter 2026 financial results after the close of trading on October 26, 2026.
Management will discuss the results on a conference call and webcast at 5 p.m. ET that day. The webcast and accompanying slides will be available at ir.amkor.com, with an archived replay available after the call.
Amkor Technology (AMKR) announced phase 2 of its Arizona advanced packaging and test campus, increasing the project’s planned investment to approximately $12 billion.
Strong customer commitments have already exceeded the 33,000 square meters of cleanroom capacity planned for phase 1, so phase 2 is expected to add a further 60,000 square meters, bringing total cleanroom space on the campus to about 93,000 square meters. The campus, which includes wafer bump, probe, assembly and test capabilities, is designed as a multi-phase project to support long-term U.S. demand for advanced semiconductor packaging and test services.
Amkor expects phase 1 and phase 2 together to support more than 3,500 Arizona-based employees. The company describes the Arizona site as the first OSAT production facility in the U.S. capable of high-volume advanced packaging, offering customers a domestic turnkey manufacturing platform.
Construction of phase 2 is anticipated to start in late 2027, with completion expected by the end of 2029. The 170-acre campus allows room for additional expansion if customer demand requires it.
Amkor Technology (AMKR) will participate in the Goldman Sachs Communacopia + Technology Conference on Wednesday, September 9, 2026. The company’s presentation is scheduled for 8:10 am Pacific Time (11:10 am Eastern Time) in San Francisco, California, with a live webcast and replay available on its investor relations website.
Amkor Technology (Nasdaq: AMKR) announced that its Board of Directors has approved a quarterly cash dividend of $0.08352 per share on its common stock. The dividend is scheduled to be paid on September 22, 2026 to shareholders who are on record as of the close of business on September 2, 2026.
Amkor Technology (Nasdaq: AMKR) reported record Q2 2026 results, with net sales of $1.90 billion, up 26% year-on-year. Gross profit was $319 million with a 16.8% gross margin, operating income was $200 million (10.5% margin), and net income attributable to Amkor reached $174 million, or $0.70 diluted EPS. EBITDA was $400 million.
At June 30, 2026, Amkor held $2.5 billion in cash and short-term investments and had $2.5 billion in total debt. The company paid a quarterly dividend of $0.08352 per share. For Q3 2026, Amkor guides net sales of $1.95–$2.05 billion, gross margin of 18.5%–19.5%, and net income of $180–$205 million ($0.72–$0.82 diluted EPS). Full-year 2026 capital expenditures are projected at $2.5–$3.0 billion.
Amkor Technology (Nasdaq: AMKR) announced a $1.5 billion multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. NVIDIA will provide a prepayment to support expansion of Amkor’s U.S. advanced packaging capacity.
According to Amkor, the partners will align long-term roadmaps around high-density interconnects and heterogeneous integration, expanding full turnkey advanced packaging and test capabilities in the United States. The agreement supports Amkor’s capacity growth in Arizona while complementing its existing Asian footprint to create a more geographically diverse and resilient global supply chain for AI infrastructure.
Amkor Technology (Nasdaq: AMKR) will release its Q2 2026 financial results after market close on Monday, July 27, 2026. Management will host a conference call and live webcast at 5:00 p.m. Eastern Time the same day, with replay available on the Investor Relations website.
Taiwan Semiconductor Manufacturing Company (NYSE:TSM) and Amkor Technology (Nasdaq:AMKR) signed a 10-year partnership to expand advanced semiconductor packaging and testing in Arizona.
The agreement aims to grow regional capacity, speed time-to-market, and strengthen a more integrated, resilient U.S. semiconductor supply chain.