Amkor Technology to Present at the Goldman Sachs Communacopia + Technology Conference

Amkor will present at the Goldman Sachs Communacopia + Technology Conference, with webcast access and investor meetings available.

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TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the Goldman Sachs Communacopia + Technology Conference on Wednesday, September 9, 2026. Amkor’s presentation will occur at 8:10 am Pacific Time (11:10 am Eastern Time) in San Francisco, CA.

A webcast and replay of the presentation will be made available on the Investor Relations section of Amkor’s website, located at ir.amkor.com. Management will also be available for one-on-one and small group meetings with investors.

About Amkor Technology, Inc.

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260902230347/en/

Investor Relations
Jennifer Jue
Vice President, Investor Relations
480-786-7594
jennifer.jue@amkor.com

Media Relations
Kris Pugsley
Vice President, Marketing Communications
480-786-7499
kris.pugsley@amkor.com

Source: Amkor Technology, Inc.

Key Terms

semiconductor packaging technical

Semiconductor packaging is the process of enclosing a finished computer chip in a protective housing and adding the tiny electrical connections that let the chip plug into a circuit board. Think of it like putting a delicate engine into a case and wiring it so it can be bolted into a car; the choice of package affects how well the chip performs, how much it costs, and how reliably it can be manufactured at scale. Investors watch packaging because it influences product performance, supply constraints, margins and which companies capture value in the chip supply chain.