Amkor Technology Inc. reports developments tied to its outsourced semiconductor assembly and test business, including quarterly results, dividends, investor presentations and capital-structure actions. The company provides semiconductor packaging and test services for semiconductor companies, foundries and electronics OEMs, with offerings that include advanced packaging, wafer-level processing, system-in-package solutions, flip chip, fine pitch bumping, power modules and wirebond packaging.
Recurring AMKR news also covers financing activity such as convertible senior notes, secondary common-stock offerings, shareholder voting matters and updates on the company’s Nasdaq-listed common stock. Operating updates commonly reference end markets such as smartphones, data centers, artificial intelligence, automobiles and wearables.
Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.
The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.
Amkor Technology, Inc. (Nasdaq: AMKR) announced that founder James Kim will retire as Executive Chairman effective October 31, 2024, after more than 56 years of service. Susan Y. Kim, currently Executive Vice Chairman, will become Chairman of the Board. James Kim will be recognized as Chairman Emeritus upon retirement.
Founded in 1968, Amkor is a leading provider of semiconductor packaging and test services. The company is well-positioned for growth with strong technology leadership in advanced packaging, a diversified global footprint, and partnerships with lead customers. CEO Giel Rutten expressed confidence in the company's future under the new leadership structure.
Amkor Technology (Nasdaq: AMKR), a leading semiconductor packaging and test services provider, has announced a quarterly cash dividend of $0.07875 per share on its common stock. The dividend is set to be paid on September 23, 2024, to stockholders of record as of the close of business on September 3, 2024. This announcement demonstrates Amkor's commitment to returning value to its shareholders and reflects the company's financial stability in the competitive semiconductor industry.
Amkor Technology (Nasdaq: AMKR) reported its Q2 2024 financial results, with net sales of $1.46 billion, up 7% sequentially. The company's gross profit was $212 million, with operating income of $82 million and net income of $67 million. Earnings per diluted share reached $0.27, while EBITDA stood at $247 million. The growth was primarily driven by Advanced packaging for premium tier smartphones and AI solutions. However, soft demand in Automotive & Industrial and Consumer markets partially offset the gains. Amkor's outlook for Q3 2024 projects net sales between $1.785 billion and $1.885 billion, with a gross margin of 14.0% to 16.0%. The company expects net income between $105 million and $140 million for Q3 2024.
Amkor Technology, Inc. (Nasdaq: AMKR) has signed a non-binding preliminary memorandum of terms with the US Department of Commerce for proposed funding under the CHIPS and Science Act. The agreement includes up to $400 million in direct funding and access to $200 million in loans for Amkor's planned $2 billion advanced packaging and test facility in Peoria, Arizona.
The facility, set to be the largest outsourced advanced packaging and test facility in the US, will create approximately 2,000 jobs and feature over 500,000 square feet of clean room space. Amkor plans to leverage the Department of the Treasury's Investment Tax Credit, expected to be up to 25% of qualified capital expenditures. The project aims to strengthen the domestic semiconductor supply chain and is scheduled to begin production within three years.
Infineon Technologies AG and Amkor Technology, Inc. have signed a Memorandum of Understanding to promote decarbonization and sustainability across their supply chain. This partnership aims to:
- Engage with common suppliers to develop effective decarbonization strategies
- Identify areas for improvement in emissions reduction
- Support suppliers in setting science-based targets
- Provide guidance and track progress for continuous improvement
The collaboration expands on their existing Outsourced Semiconductor Assembly and Test (OSAT) relationship and aligns with both companies' sustainability goals. Infineon aims to become CO2-neutral for scope 1 and 2 by 2030, while Amkor targets net-zero emissions by 2050.
Amkor Technology (Nasdaq: AMKR), a foremost provider of semiconductor packaging and test services, will release its Q2 2024 financial results after market close on July 29, 2024. The company will hold a conference call and webcast at 5:00 p.m. ET the same day to discuss the results. Investors can access the live audio webcast and slide presentation via Amkor's Investor Relations website. A replay of the call will be available afterward. Additionally, the live call can be accessed by dialing 1-877-407-4019 or 1-201-689-8337.
Amkor Technology (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has received approval from the Science Based Targets initiative (SBTi) for its ambitious net-zero greenhouse gas (GHG) emissions targets.
Amkor commits to achieving net-zero GHG emissions across its value chain by 2050. By 2033, the company aims to reduce absolute Scope 1 and 2 emissions by 55% from a 2022 baseline. Additionally, 80% of its suppliers by emissions will have science-based targets by 2028. Long-term goals include a 90% reduction in Scope 1 and 2 emissions and a 97% reduction in Scope 3 emissions per million USD value added by 2050.
Giel Rutten, Amkor’s CEO, emphasized the importance of these targets in aligning with global climate goals and addressing the increasing energy use in the semiconductor industry. The company plans to increase renewable energy use and prioritize decarbonization across its value chain, with regular progress reports to ensure transparency.
Amkor Technology (Nasdaq: AMKR), a leader in semiconductor packaging and test services, will participate in the Goldman Sachs Global Semiconductor Conference on May 29, 2024.
The presentation will occur at 12:50 pm Eastern Time at the Goldman Sachs Conference Center in New York, NY.
A live and replay webcast will be available on the Investor Relations section of Amkor's website. Management will also engage in one-on-one and small group meetings with investors.
Amkor Technology (Nasdaq: AMKR) has declared a quarterly cash dividend of $0.07875 per share on its common stock.
The dividend will be distributed on June 24, 2024, to shareholders who are on record as of June 4, 2024.
Amkor Technology is a leading provider of semiconductor packaging and test services.