Ansys Inc Stock Price, News & Analysis

IonQ (NYSE: IONQ) and Ansys (Nasdaq: ANSS) have announced a strategic partnership to integrate quantum computing into the $10B computer-aided engineering (CAE) industry. The collaboration aims to accelerate simulation processes, expand design exploration, and reduce product development timelines. Ansys will gain access to quantum infrastructure for testing, while IonQ will utilize Ansys' multiphysics technology to design next-generation quantum computers. The partnership focuses on making quantum simulation accessible to both expert and non-expert users, potentially revolutionizing the CAE market through enhanced computational capabilities.

Ansys (NASDAQ: ANSS) received four TSMC 2024 OIP Partner of the Year awards for excellence in design enablement. The recognition highlights Ansys' achievements in multiphysics analysis solutions for advanced silicon processes and 3D-IC technologies. The awards specifically acknowledge joint development in: multiphysics analysis incorporating mechanical stress analysis, power integrity solutions for N2P and A16 processes, COUPE enablement for multi-die systems, and RF design migration automation. The collaboration between TSMC and Ansys aims to address complex design challenges in AI, HPC, and photonics silicon systems.

ANSYS, Inc. (NASDAQ: ANSS) has announced that it will release its third quarter 2024 earnings on Wednesday, November 6, 2024, after market close. Due to the pending acquisition by Synopsys, Inc., Ansys has suspended quarterly earnings calls and no longer provides quarterly or annual guidance. The earnings press release and 10-Q filing will be available on the investor section of the Ansys website.

The Synopsys acquisition of Ansys, announced on January 15, 2024, is expected to close in the first half of 2025, subject to regulatory approvals and closing conditions. This merger aims to create a leader in silicon to systems design solutions by combining Synopsys' semiconductor electronic design automation with Ansys' simulation and analysis portfolio.

Faraday Technology is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D/3D-ICs, critical for AI, IoT, and 5G applications. Faraday will use Ansys RaptorX™ on-chip electromagnetic modeling solution to optimize interposer and multi-die designs, supporting better memory bandwidth, signal integrity, and performance of end applications.

The addition of RaptorX into Faraday's design flow will increase precision and efficiency in the development process, enabling predictively accurate EM modeling and analysis for advanced 3D-IC products. This will improve design fidelity, enhance performance and reliability, and accelerate time-to-market. Faraday's expanded use of Ansys technology aims to empower customers to explore more robust design options for innovative products.

Ansys (NASDAQ:ANSS) has entered into a multi-year agreement with Liebherr Group to implement an enterprise simulation strategy and model-based engineering approach. This collaboration aims to maximize simulation value through software democratization across Liebherr's sites, driving better product design strategies, reducing overall testing, and speeding up time-to-market.

The partnership extends Liebherr's 35-year engagement with Ansys across its product portfolio, strengthening the digital thread. Ansys simulation enables detailed virtual models describing all physical and functional aspects of Liebherr products, covering various domains including mechanical, fluid dynamics, electronics, and safety analysis. CADFEM Germany GmbH, an Ansys Apex Channel Partner, provides support through training, user support, and consulting services.

This initiative is particularly significant for Liebherr-Aerospace and Transportation SAS, one of Liebherr's largest divisions, which has launched a digital transformation program to implement a model-based enterprise approach and achieve digital continuity across the entire product lifecycle.

Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next-generation multiphysics solutions for advanced semiconductor technologies. The partnership aims to enhance productivity in designing 3D integrated circuits through AI-driven solutions and automation. Key developments include:

1. Integration of Ansys optiSLang and RaptorX for optimized channel design, reducing EM simulations.
2. Collaboration with Synopsys on an AI-assisted RF migration flow.
3. Expansion of RedHawk-SC Electrothermal platform for 3D-IC thermal and stress analysis.
4. Joint support for the latest version of 3Dblox.
5. Development of a comprehensive workflow for TSMC's COUPE (Compact Universal Photonics Engine).
6. Enablement of RedHawk-SC Electrothermal for TSMC's new A16 silicon process.

These advancements aim to improve design productivity, reduce costs, and accelerate time-to-market for semiconductor products in AI, HPC, and high-speed data communication.

Ansys (NASDAQ: ANSS), TSMC, and Microsoft have collaborated to achieve a 10X speed-up in the simulation and analysis of silicon photonic components. This breakthrough was accomplished using Ansys Lumerical FDTD 3D electromagnetic simulation software on Microsoft Azure NC A100v4-series virtual machines powered by NVIDIA GPUs.

The collaboration aims to accelerate the development of Photonic Integrated Circuits (PICs) for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence. By leveraging Azure's cloud infrastructure, the partnership enables seamless deployment, graphical interface access, scaling of distributed simulations, and post-processing for large datasets.

This advancement is important for addressing challenges in combining photonic and electronic circuits, potentially reducing costs and timeline setbacks in chip design. The collaboration demonstrates Ansys's ability to harness cloud infrastructure to deliver powerful, predictively accurate solutions for complex multiphysics silicon designs.

ANSYS (NASDAQ: ANSS) announced its Q2 2024 financial results, reporting revenue of $594.1 million, marking a 20% YoY increase. The company's GAAP diluted EPS was $1.48, while non-GAAP diluted EPS reached $2.50. GAAP and non-GAAP operating profit margins stood at 26.5% and 44.9%, respectively. Operating cash flows were $80.7 million, with unlevered operating cash flows of $90.7 million. The Annual Contract Value (ACV) was $520.5 million, reflecting a 7% growth in reported currency and 9% in constant currency. Deferred revenue and backlog totaled $1,394.0 million.

Comparatively, Q2 2023 saw GAAP and non-GAAP diluted EPS of $0.80 and $1.60, respectively. The Q2 2024 results were buoyed by two multi-year contracts worth $210 million in the automotive and high-tech sectors. On January 15, 2024, ANSYS announced an acquisition agreement with Synopsys, expected to close in H1 2025 subject to regulatory approvals.

Ansys (NASDAQ: ANSS) has released its 2024 R2 software update, focusing on multiphysics innovation across industries and engineering domains. The release introduces two new products: Ansys TwinAI™ for enhancing simulation with AI for digital twins, and Ansys HFSS-IC™ solver for deep electromagnetic analysis of integrated circuits.

Key enhancements include streamlined multiphysics workflows, improved connected workflows across the Ansys portfolio, and AI integrations for various applications. The update also features hardware compatibility improvements, including optimization for GPUs and support for AMD GPUs in Ansys Fluent®.

These advancements aim to accelerate run times, scale capacity, enable digital transformation, and provide hardware flexibility, making Ansys multiphysics simulations more accessible and powerful for customers across industries.