Welcome to our dedicated page for Ansys news (Ticker: ANSS), a resource for investors and traders seeking the latest updates and insights on Ansys stock.
Ansys Inc. (NASDAQ: ANSS) delivers cutting-edge engineering simulation solutions powering innovation across aerospace, automotive, and semiconductor industries. This dedicated news hub provides investors and engineering professionals with essential updates on the company's strategic developments.
Track critical announcements including quarterly earnings, product launches for multiphysics simulation tools, and partnerships advancing digital twin technologies. Access verified information about Ansys' R&D initiatives in computational fluid dynamics (CFD) and cloud-based simulation platforms that shape industry standards.
Our curated collection features official press releases alongside analysis of major acquisitions and leadership updates. Stay informed about innovations in electric vehicle simulation systems and semiconductor design validation tools that demonstrate Ansys' technical leadership.
Bookmark this page for real-time updates on ANSYS's market-moving developments and in-depth coverage of how its simulation software enables next-generation engineering breakthroughs worldwide.
Ansys (NASDAQ: ANSS) announced that its power integrity solutions, RedHawk-SC™ and Totem™, have been certified by Samsung Foundry for the new SF2Z 2nm gate-all-around manufacturing technology. This innovative technology shifts the power distribution network to the backside of the chip, optimizing space, reducing costs, and enhancing performance. The certification enables early adopters to design advanced semiconductor products for applications like high-performance computing, AI, smartphones, data centers, and graphics processors. The RedHawk-SC platform offers accurate signoff verification for electromigration and voltage drop, while Totem focuses on analog and mixed-signal designs, ultimately reducing project risk and improving chip reliability.
Ansys (NASDAQ: ANSS) has joined the Intel Foundry Accelerator United States Military, Aerospace, and Government (USMAG) Alliance to develop secure design methodologies and workflows for national security applications.
This collaboration enhances Ansys' Redhawk-SC platform with advanced thermal management capabilities for Intel's 18A silicon process, featuring PowerVia technology. Ansys' thermal solver technology aims to improve performance and reliability, catering to high-performance computing, AI, and graphics processor chips. Additionally, both companies are working on signoff verification for thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB).
John Lee, VP at Ansys, emphasized that this collaboration addresses multiphysics challenges and stringent thermal, power, and reliability requirements for military and aerospace applications. Intel Foundry's Suk Lee welcomed Ansys as a valuable partner for providing robust design and simulation capabilities to the USMAG community.
Ansys unveiled ConceptEV™, a cloud-native SaaS solution aimed at optimizing electric vehicle (EV) powertrain development. ConceptEV enables collaborative design and simultaneous optimization of key EV components such as the battery, inverter, motor, and transmission. The tool allows engineers to make early design decisions that enhance EV driving range, reduce battery charge times, and lower development costs. With a model-based approach, ConceptEV links component designs to system-level requirements, facilitating rapid analysis, reducing errors, saving time and costs, and fostering innovation. Ansys aims to empower design engineering teams to create more efficient, cost-effective, and durable EV powertrains.
Ansys (NASDAQ: ANSS) has adopted NVIDIA Omniverse APIs to enhance 3D multiphysics visualization for 3D integrated circuit (3D-IC) designs. This integration aims to improve semiconductor design by providing real-time insights into electromagnetic and thermal effects.
The new capabilities will benefit applications in 5G/6G, IoT, AI/ML, cloud computing, and autonomous vehicles. Ansys' tools, including HFSS, Icepak, and RedHawk-SC, will now offer real-time 3D visualization, allowing designers to optimize chip performance and reliability.
Additionally, RedHawk-SC is now accelerated by NVIDIA Grace CPU Superchips for enhanced multiphysics designs. Visit Ansys at DAC in San Francisco from June 23-27 to see a demonstration.
Ansys (NASDAQ: ANSS) has announced the launch of Ansys Access on Microsoft Azure, available from May 30, 2024. This collaboration enables customers to deploy pre-configured Ansys applications for high-performance computing (HPC) on the Azure platform. Customers can use their Azure subscriptions with existing Ansys licenses, providing a scalable, secure, and cost-effective solution for running simulations in the cloud. The new solution addresses challenges like on-premises workload validation and VM configuration, offering pre-tested applications and a user-friendly setup. This partnership aims to reduce deployment costs, enhance productivity, and accelerate product innovation across industries such as automotive and semiconductors.
Ansys (NASDAQ: ANSS) announced that its stockholders approved the proposed acquisition by Synopsys (NASDAQ: SNPS) in a special meeting held on May 22, 2024. The merger agreement stipulates that Ansys stockholders will receive $197.00 in cash and 0.3450 shares of Synopsys common stock per Ansys share, valuing the deal at approximately $35 billion based on Synopsys' closing price as of December 21, 2023. Approximately 98.7% of the shares voted were in favor, representing 83.8% of Ansys' total outstanding shares. The transaction is expected to close in the first half of 2025, pending regulatory approvals and other conditions.
Ansys and Schrödinger are collaborating to accelerate materials discovery and optimize product development through an integrated computational materials engineering (ICME) approach. This collaboration will empower Ansys customers to make critical decisions earlier in the design process, leading to more optimized materials, components, and manufacturing workflows.
ANSYS, Inc. reported Q1 2024 revenue of $466.6 million, down 8% from Q1 2023. GAAP diluted EPS was $0.40, non-GAAP EPS was $1.39. ACV was $407.4 million. Deferred revenue and backlog stood at $1,369.5 million. The company expects double-digit growth in ACV and revenue for FY 2024. An agreement with Synopsys, Inc. for acquisition is pending.
Ansys has announced the certification of its power integrity platforms for TSMC's latest silicon technologies, enabling faster, lower power designs. The certification covers Ansys RedHawk-SC and Ansys Totem for N2 technology and Ansys RaptorX for N5 technology. Ansys has also collaborated with TSMC on an AI-enabled analysis optimization flow. This partnership aims to empower customers with advanced multiphysics simulations and analyses for designing innovative chips.