Welcome to our dedicated page for Ansys news (Ticker: ANSS), a resource for investors and traders seeking the latest updates and insights on Ansys stock.
Ansys Inc. (NASDAQ: ANSS) delivers cutting-edge engineering simulation solutions powering innovation across aerospace, automotive, and semiconductor industries. This dedicated news hub provides investors and engineering professionals with essential updates on the company's strategic developments.
Track critical announcements including quarterly earnings, product launches for multiphysics simulation tools, and partnerships advancing digital twin technologies. Access verified information about Ansys' R&D initiatives in computational fluid dynamics (CFD) and cloud-based simulation platforms that shape industry standards.
Our curated collection features official press releases alongside analysis of major acquisitions and leadership updates. Stay informed about innovations in electric vehicle simulation systems and semiconductor design validation tools that demonstrate Ansys' technical leadership.
Bookmark this page for real-time updates on ANSYS's market-moving developments and in-depth coverage of how its simulation software enables next-generation engineering breakthroughs worldwide.
Ansys (NASDAQ: ANSS), TSMC, and Microsoft have collaborated to achieve a 10X speed-up in the simulation and analysis of silicon photonic components. This breakthrough was accomplished using Ansys Lumerical FDTD 3D electromagnetic simulation software on Microsoft Azure NC A100v4-series virtual machines powered by NVIDIA GPUs.
The collaboration aims to accelerate the development of Photonic Integrated Circuits (PICs) for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence. By leveraging Azure's cloud infrastructure, the partnership enables seamless deployment, graphical interface access, scaling of distributed simulations, and post-processing for large datasets.
This advancement is important for addressing challenges in combining photonic and electronic circuits, potentially reducing costs and timeline setbacks in chip design. The collaboration demonstrates Ansys's ability to harness cloud infrastructure to deliver powerful, predictively accurate solutions for complex multiphysics silicon designs.
ANSYS (NASDAQ: ANSS) announced its Q2 2024 financial results, reporting revenue of $594.1 million, marking a 20% YoY increase. The company's GAAP diluted EPS was $1.48, while non-GAAP diluted EPS reached $2.50. GAAP and non-GAAP operating profit margins stood at 26.5% and 44.9%, respectively. Operating cash flows were $80.7 million, with unlevered operating cash flows of $90.7 million. The Annual Contract Value (ACV) was $520.5 million, reflecting a 7% growth in reported currency and 9% in constant currency. Deferred revenue and backlog totaled $1,394.0 million.
Comparatively, Q2 2023 saw GAAP and non-GAAP diluted EPS of $0.80 and $1.60, respectively. The Q2 2024 results were buoyed by two multi-year contracts worth $210 million in the automotive and high-tech sectors. On January 15, 2024, ANSYS announced an acquisition agreement with Synopsys, expected to close in H1 2025 subject to regulatory approvals.
Ansys (NASDAQ: ANSS) has released its 2024 R2 software update, focusing on multiphysics innovation across industries and engineering domains. The release introduces two new products: Ansys TwinAI™ for enhancing simulation with AI for digital twins, and Ansys HFSS-IC™ solver for deep electromagnetic analysis of integrated circuits.
Key enhancements include streamlined multiphysics workflows, improved connected workflows across the Ansys portfolio, and AI integrations for various applications. The update also features hardware compatibility improvements, including optimization for GPUs and support for AMD GPUs in Ansys Fluent®.
These advancements aim to accelerate run times, scale capacity, enable digital transformation, and provide hardware flexibility, making Ansys multiphysics simulations more accessible and powerful for customers across industries.
Ansys (NASDAQ: ANSS) has announced it will release its second quarter 2024 earnings on July 31, 2024, after market close. Due to the pending acquisition by Synopsys, Ansys has suspended quarterly earnings calls and guidance. The earnings press release and 10-Q filing will be available on the company's investor website. The Synopsys-Ansys merger, announced on January 15, 2024, is expected to close in the first half of 2025, subject to regulatory approvals. This acquisition aims to combine Synopsys' semiconductor electronic design automation with Ansys' simulation portfolio, creating a leader in silicon to systems design solutions.
Ansys (NASDAQ: ANSS) is collaborating with Supermicro and NVIDIA to deliver turnkey hardware for accelerated multiphysics simulation. This partnership enables solving larger, more complex models up to 1,600x faster, reducing time-to-market and enhancing design exploration across various industries. Testing revealed significant speed-ups for Ansys solutions:
- Ansys optiSLang AI+: 1,600x
- Ansys Fluent: 24x
- Ansys Mechanical: 6x
- Ansys HFSS: 11x
- Ansys Perceive EM: 53x
- Ansys Rocky: 17x
- Ansys LS-DYNA: 4x
The collaboration optimizes hardware configurations, integrating CPUs, GPUs, and other components to enhance simulation efficiency and reduce energy consumption.
Ansys (NASDAQ: ANSS) announced that its System Tool Kit (STK) is now available in AWS Marketplace, specifically for the AWS GovCloud (US) Region.
This move caters to U.S. customers, enabling them to easily procure and manage necessary software without the burden of on-premises resources.
Ansys STK allows engineers to model complex systems within a realistic 3D simulation, incorporating high-resolution terrain, imagery, and radio frequency environments.
This integration ensures that customers in the aerospace and defense sectors can streamline their processes, test new technologies, and comply with stringent government standards for security and compliance.
Kevin Flood, VP of Digital Mission Engineering at Ansys, emphasized that this collaboration will enhance scalability and collaboration among distributed teams.
For more information, visit Ansys' website.
Ansys (NASDAQ: ANSS), a leader in engineering simulation software, announced the listing of Ansys STK™ in AWS Marketplace for the US Intelligence Community (ICMP) on July 9, 2024. ICMP is a curated catalog by Amazon Web Services to facilitate the discovery, purchase, and deployment of software for government customers.
Ansys STK™ empowers users to model, analyze, and simulate high-fidelity aerospace and defense systems within operational environments. This inclusion aims to ease resource access issues faced by distributed teams, enhancing project efficiency and compliance. With high-resolution terrain, imagery, and radio frequency simulations, STK enables comprehensive system behavior and mission performance analysis.
Kevin Flood, VP of digital mission engineering at Ansys, highlighted the seamless accessibility of STK through ICMP, enhancing resource sharing and approval navigation.
Ansys (NASDAQ: ANSS) announced that its power integrity solutions, RedHawk-SC™ and Totem™, have been certified by Samsung Foundry for the new SF2Z 2nm gate-all-around manufacturing technology. This innovative technology shifts the power distribution network to the backside of the chip, optimizing space, reducing costs, and enhancing performance. The certification enables early adopters to design advanced semiconductor products for applications like high-performance computing, AI, smartphones, data centers, and graphics processors. The RedHawk-SC platform offers accurate signoff verification for electromigration and voltage drop, while Totem focuses on analog and mixed-signal designs, ultimately reducing project risk and improving chip reliability.
Ansys (NASDAQ: ANSS) has joined the Intel Foundry Accelerator United States Military, Aerospace, and Government (USMAG) Alliance to develop secure design methodologies and workflows for national security applications.
This collaboration enhances Ansys' Redhawk-SC platform with advanced thermal management capabilities for Intel's 18A silicon process, featuring PowerVia technology. Ansys' thermal solver technology aims to improve performance and reliability, catering to high-performance computing, AI, and graphics processor chips. Additionally, both companies are working on signoff verification for thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB).
John Lee, VP at Ansys, emphasized that this collaboration addresses multiphysics challenges and stringent thermal, power, and reliability requirements for military and aerospace applications. Intel Foundry's Suk Lee welcomed Ansys as a valuable partner for providing robust design and simulation capabilities to the USMAG community.
Ansys unveiled ConceptEV™, a cloud-native SaaS solution aimed at optimizing electric vehicle (EV) powertrain development. ConceptEV enables collaborative design and simultaneous optimization of key EV components such as the battery, inverter, motor, and transmission. The tool allows engineers to make early design decisions that enhance EV driving range, reduce battery charge times, and lower development costs. With a model-based approach, ConceptEV links component designs to system-level requirements, facilitating rapid analysis, reducing errors, saving time and costs, and fostering innovation. Ansys aims to empower design engineering teams to create more efficient, cost-effective, and durable EV powertrains.