Alpha and Omega Semiconductor Introduces Innovatively Designed, Space-Saving Half-Bridge MOSFET for DC-DC Applications

Rhea-AI Summary

Alpha and Omega Semiconductor (AOSL) has launched the AONG36322 XSPairFET, a compact, space-saving half-bridge MOSFET designed for DC-DC applications. This new MOSFET package integrates two 30V MOSFETs in an asymmetric DFN3.5x5 configuration, providing a 60% reduction in footprint compared to the existing DFN5x6 package. This innovation enhances PCB layout efficiency, making it ideal for compact applications such as point-of-load computing, USB hubs, and power banks.

The AONG36322's latest bottom-source packaging technology features maximum on-resistance of 4.5 mOhms and 1.3 mOhms for high-side and low-side MOSFETs, respectively. It also offers improved thermal dissipation and reduced parasitic inductance, minimizing switch node ringing. The product is available immediately with a lead time of 16 weeks and is priced at $0.915 for 1,000-piece quantities.

Positive

• 60% reduction in PCB footprint compared to existing solutions.
• Improved power density and efficiency for DC-DC Buck applications.
• Enhanced thermal dissipation due to innovative packaging.
• Reduced parasitic inductance minimizes switch node ringing.
• Ideal for compact applications including point-of-load computing, USB hubs, and power banks.
• Immediate availability with a 16-week lead time.

Negative

• New product introduction lacks immediate financial impact data.
• Potential supply chain bottlenecks with a lead time of 16 weeks.
• No significant pricing advantage with a $0.915 unit price for 1,000-piece quantities.

Tech Expert

The introduction of the AONG36322 XSPairFET by Alpha and Omega Semiconductor brings significant advancements in DC-DC Buck applications, which are important for power management in compact electronic devices. This product combines two MOSFETs in a half-bridge configuration within a smaller footprint, leading to a 60% reduction in PCB space. This is beneficial because modern electronics often demand smaller, more efficient power solutions.

The technical specifications, such as the low on-resistance (4.5 mOhms and 1.3 mOhms for high-side and low-side MOSFETs respectively) and improved thermal dissipation, suggest enhanced performance and reliability. Lower parasitic inductance and reduced switch node ringing will lead to more stable and efficient power conversion. This innovation addresses a critical need in point-of-load computing, USB hubs and power banks.

In summary, this product potentially positions AOS as a leader in the power management sector, catering to the growing demand for compact and efficient solutions.

Market Research Analyst

From a market perspective, the AONG36322 XSPairFET introduces a competitive edge for Alpha and Omega Semiconductor in the power management IC sector. The press release emphasizes space savings and efficiency, which are key selling points in an industry where miniaturization and power efficiency are paramount. The ability to deliver such innovations can attract a broader customer base and potentially increase market share.

However, it's important to monitor how competitors respond to this innovation. AOS's strategy to provide this unit at $0.915 per 1,000-piece quantity is also a strategic pricing move, making it accessible for widespread adoption. The 16-week lead time is reasonable but could be a limiting factor if demand surges unexpectedly.

Overall, the product's market introduction bodes well for AOS's positioning, though it will be important to track market adoption and competitor actions moving forward.

By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET™ provides a leading solution for space-constrained DC-DC Buck applications

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today introduced its AONG36322 XSPairFET designed for space-constrained DC-DC applications. The new AONG36322 features two 30V MOSFETs in a half-bridge configuration where the high-side and the low-side MOSFETs are in an asymmetric DFN3.5x5 XSPairFET package. This innovative design allows the AONG36322 to replace an existing DFN5x6 asymmetric half-bridge MOSFET with an approximate 60 percent space-saving solution, thereby reducing the PCB footprint to further streamline the DC-DC architecture, resulting in a more efficient design. These benefits make the AONG36322 ideal for a new generation of smaller DC-DC buck converters in more compact applications such as point-of-load (POL) computing, USB hubs, and power banks.

The AONG36322 XSPairFET™ provides a leading solution for space-constrained DC-DC Buck applications (Photo: Business Wire)

The AONG36322 is an extension to the AOS XSPairFET lineup, designed with the latest bottom-source packaging technology. Its integrated high-side and low-side MOSFETs feature 4.5 mOhms and 1.3 mOhms maximum on-resistance, respectively, where the low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. A definite advantage of the state-of-the-art AONG36322 package design is that it delivers lower parasitic inductance, significantly reducing switch node ringing.

“We designed the AONG36322 in the DFN3.5x5 package to help our customers meet their ongoing board space limitations. Our breakthrough AOS XSPairFET design also gives them the benefit of improved power density and efficiency to overcome the challenge developers face in meeting ever-increasing POL Buck application performance goals,” said Peter H. Wilson, Marketing Sr. Director of MOSFET product line at AOS.

Technical Highlights

Part Number	Package		VDS (V)	VGS (±V)	RDS(ON) (mΩ max) at VGS=		Ciss (pF)	Coss (pF)	Crss (pF)	Qg (nC)
					10V	4.5V
AONG36322	DFN 3.5x5	High Side (Q1)	30	20	4.5	8.0	1150	380	555	7.5
		Low Side (Q2)	30	12	1.3	1.75	4180	880	125	30

Pricing and Availability

The AONG36322 is immediately available in production quantities with a lead time of 16 weeks. The unit price in 1,000-piece quantities is $0.915.

About AOS

Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, including a wide portfolio of Power MOSFET, SiC, IGBT, IPM, TVS, HV Gate Drivers, Power IC, and Digital Power products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry, which enables us to introduce innovative products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions. AOS’ portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment. For more information, please visit www.aosmd.com.

Forward-Looking Statements

This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the U.S. Securities and Exchange Commission. Although the Company believes that the expectations reflected in the forward-looking statements are reasonable, it cannot guarantee future results, level of activity, performance, or achievements. You should not place undue reliance on these forward-looking statements. All information provided in this press release is as of today’s date unless otherwise stated, and AOS undertakes no duty to update such information except as required under applicable law.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240523491137/en/

Media Contact: Mina Galvan

Tel: 408.789.3233

Email: mina.galvan@aosmd.com

Source: Alpha and Omega Semiconductor Limited

FAQ

What is the AONG36322 XSPairFET?

The AONG36322 XSPairFET is a compact, space-saving half-bridge MOSFET designed for DC-DC applications by Alpha and Omega Semiconductor (AOSL).

How much space does the AONG36322 save on a PCB?

The AONG36322 saves approximately 60% of the PCB footprint compared to the existing DFN5x6 asymmetric half-bridge MOSFET.

What are the key applications for the AONG36322 XSPairFET?

Key applications include point-of-load computing, USB hubs, and power banks.

What is the on-resistance of the AONG36322's high-side and low-side MOSFETs?

The high-side MOSFET has a maximum on-resistance of 4.5 mOhms, and the low-side MOSFET has a maximum on-resistance of 1.3 mOhms.

When will the AONG36322 be available?

The AONG36322 is available immediately with a lead time of 16 weeks.

What is the cost of the AONG36322 in bulk quantities?

The unit price for the AONG36322 is $0.915 for 1,000-piece quantities.