ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico

Left to Right: Ou Li (ASE), Dina Grijalva (Jalisco Tech Hub Act), Ingu Yin Chang (ASE), Governor elect Pablo Lemus (
ISE Labs focuses on semiconductor engineering, design and manufacturing scale-up of leading-edge semiconductor devices within
The future establishment of a semiconductor packaging and test facility in
To ensure the recruitment of the highly specialized talent required to operate in
“We are excited to strengthen ISE’s partnership with the state of
“This administration has successfully transformed our semiconductor and advanced electronics manufacturing services industry into a new model focused on technology and innovation,” said Enrique Alfaro Ramírez, Governor of the
Terms of the acquisition have not been disclosed.
GLOSSARY
OSAT: Outsourced Semiconductor Assembly & Test
About ISE Labs, Inc.
Established in 1983, ISE Labs has a wealth of experience and expertise to serve the semiconductor community. The company’s broad offering of engineering services and products includes test engineering support, production test services, test program development, test interface and reliability test hardware, ESD, burn-in, environmental testing, mechanical testing, and failure analysis.
ISE Labs is a subsidiary of ASE, Inc. The world leader in advanced semiconductor packaging and test services, ASE offers a wide portfolio of technology and solutions for IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level packaging, flip chip, system-in-package, and other manufacturing services.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in packaging and test. Alongside a broad portfolio of established packaging and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com, or follow us on LinkedIn & X: @aseglobal
View source version on businesswire.com: https://www.businesswire.com/news/home/20241107202324/en/
Press Contacts:
ASE/ISE: Patricia MacLeod +1.408.314.9740 patricia.macleod@aseus.com
Jalisco State Government: Adriana Reyes Leyva +523314097234 adriana.reyes@jalisco.gob.mx
Source: Advanced Semiconductor Engineering, Inc.