Camtek receives multiple Hawk systems order of approximately $25 Million from an IDM for AI applications

Camtek (NASDAQ: CAMT) received a $25 million purchase order for Hawk systems from a tier-1 integrated device manufacturer (IDM) for AI applications, bringing total orders from that customer to $45 million to be delivered in 2026.

Rhea-AI Summary

Camtek (NASDAQ: CAMT) received a $25 million purchase order for Hawk systems from a tier-1 integrated device manufacturer (IDM) for AI applications, bringing total orders from that customer to $45 million to be delivered in 2026.

The Hawk platform targets advanced packaging use cases such as HBM, chiplets, hybrid bonding and wafers with up to 500 million micro-bumps, aiming to expand Camtek's addressable market for AI infrastructure inspection and metrology.

Positive

• $25 million new Hawk systems order from a tier-1 IDM
• Total aggregate orders of $45 million from the same IDM for 2026 deliveries
• Hawk platform targets advanced packaging including HBM, chiplets, hybrid bonding

Negative

• None.

Argus Feb 11 session

+2.86% close to close Open Argus

Details

News Market Reaction – CAMT

In the Feb 11 session, CAMT gained 2.86%, reflecting a moderate positive market reaction.

Data tracked by StockTitan Argus on the day of publication.

Market Context

This announcement adds a new Hawk systems order of $25M, lifting total Hawk orders from a tier‑1 IDM...

Analysis

This announcement adds a new Hawk systems order of $25M, lifting total Hawk orders from a tier‑1 IDM to $45M for 2026 AI applications. It reinforces Camtek’s focus on advanced packaging uses like wafers with up to 500 million micro‑bumps and its role in AI and high-performance computing. Investors may watch how this order momentum relates to upcoming results and whether similar AI-driven demand continues across its customer base.

Key Figures

New Hawk order: $25 million Total Hawk orders: $45 million Micro-bump capacity: 500 million micro-bumps

New Hawk order

$25 million

Single Hawk systems order from tier-1 IDM for AI applications

Total Hawk orders

$45 million

Aggregate Hawk orders from same IDM customer for 2026 delivery

Micro-bump capacity

500 million micro-bumps

Maximum wafer micro-bump count Hawk platform is designed to inspect

Historical Context

5 past events · Latest: Feb 02

5 events

1. Feb 02

   Earnings call timing

   24h Move

   -3.1%

   Announcement of date and time for Q4 and full-year 2025 results call.

2. Nov 10

   Earnings results

   24h Move

   -6.7%

   Record Q3 2025 revenue and non-GAAP earnings alongside guidance for Q4 and 2025.

3. Oct 30

   Earnings call timing

   24h Move

   -3.3%

   Scheduling of Q3 2025 earnings release and investor Zoom conference call.

4. Sep 12

   Convertible note pricing

   24h Move

   +3.5%

   Pricing of upsized $425M 0.00% convertible senior notes due 2030 with extra $75M option.

5. Sep 11

   Convertible note announcement

   24h Move

   +3.5%

   Proposed $400M private offering of 0.00% convertible senior notes due 2030.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

idm, high bandwidth memory, chiplets, hybrid bonding, +2 more

6 terms

idm technical

"received a $25 million Hawk systems order from a tier-1 IDM for AI applications"

An IDM (Integrated Device Manufacturer) is a company that both designs and physically builds its own semiconductor chips rather than outsourcing production. For investors, that matters because owning the whole process can mean tighter control over quality, supply and profit margins, but also requires heavy spending on factories and equipment—like a furniture maker who both crafts designs and runs the workshop versus one that only sells third‑party pieces.

high bandwidth memory technical

"applications, including High Bandwidth Memory (HBM), chiplets, hybrid bonding"

High bandwidth memory (HBM) is a type of computer memory built by stacking chips vertically and placing them very close to a processor so large amounts of data can move much faster and use less power than with traditional memory. For investors, HBM matters because it can noticeably raise the speed and efficiency of data-center, AI and graphics products, influencing a maker’s competitiveness, product value, production cost and market demand—similar to a faster highway letting more trucks deliver goods per hour.

chiplets technical

"including High Bandwidth Memory (HBM), chiplets, hybrid bonding, FE applications"

Small, individual semiconductor components that are manufactured separately and then combined into a single package to perform the function of a larger chip. Like using Lego bricks instead of carving one big block, chiplets let designers mix and match proven parts to reduce cost, shorten development time, improve manufacturing yields and enable upgrades; investors watch them because they can lower production risk, boost product competitiveness and affect profit margins across the semiconductor supply chain.

hybrid bonding technical

"including High Bandwidth Memory (HBM), chiplets, hybrid bonding, FE applications"

Hybrid bonding is a chip-assembly method that joins two silicon pieces face-to-face using very small metal and insulating connections, creating many tiny direct electrical links instead of relying on larger external wires. For investors, it matters because it lets device makers build smaller, faster and more energy-efficient processors and memory stacks, potentially improving product performance, reducing manufacturing costs, and creating competitive advantages along the semiconductor supply chain.

micro-bumps technical

"FE applications and wafers with up to 500 million micro-bumps."

Micro-bumps are very small, short-lived upward moves in a stock’s price, guidance or reported metrics—like tiny ripples on a pond rather than a big wave. For investors they matter because a string of micro-bumps can signal building momentum, minor positive news or steady operational improvement, and can influence short-term trading, sentiment and valuation even though each individual bump may not indicate a lasting trend.

metrology technical

"breakthrough inspection and metrology system designed for the most demanding"

Metrology is the science and practice of making measurements accurate, consistent and traceable so numbers about size, weight, temperature or other properties mean the same thing everywhere. For investors it matters because reliable measurement underpins product quality, regulatory compliance and manufacturing efficiency—like using a well-calibrated ruler so every part fits—reducing recalls, legal risk and wasted costs that can affect a company’s earnings and reputation.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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A total of $45 million was received in Hawk orders from this IDM customer for AI applications to be delivered in 2026

MIGDAL HAEMEK, Israel, Feb. 10, 2026 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it has received a $25 million Hawk systems order from a tier-1 IDM for AI applications. This follows a series of smaller repeating orders from this IDM in recent months for the same applications, such that the total aggregate value of orders received is $45 million.

The Hawk, Camtek's latest platform, is a breakthrough inspection and metrology system designed for the most demanding advanced packaging applications, including High Bandwidth Memory (HBM), chiplets, hybrid bonding, FE applications and wafers with up to 500 million micro-bumps. With significantly enhanced capabilities, unmatched throughput and precision, the Hawk significantly expands Camtek's addressable market and is engineered to support current and future industry roadmaps.

Rafi Amit, Camtek's CEO commented, "These significant orders reflect strong confidence from a leading IDM in the Hawk's capabilities and in our highly strategic role in enabling advanced AI applications. The growing adoption of the Hawk by market-leading customers for high-end packaging technologies, addressing the latest high performance computing requirements, underscores our market leadership and positions us well to benefit from accelerating investments in AI infrastructure."

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.

ABOUT CAMTEK LTD.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers' requirements.

This press release is available at www.camtek.com 

This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change.  Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, risks related to conditions in Israel, and the escalation of hostilities in the Middle East; the continued demand  and future contribution of HBM and Chiplet applications and devices to the Company business resulting from, among other things, the field of AI surging worldwide across companies, industries and nations; formal or informal imposition by countries of new or revised export and/or import and doing-business regulations or sanctions, including but not limited to changes in U.S. trade policies, changes or uncertainty related to the U.S. government entity list and changes in the ability to sell products incorporating U.S originated technology, which can be made without prior notice, and our ability to effectively address such global trade issues and changes; risks related to fluctuations in foreign currency exchange rates; and those other factors discussed in our Annual Report on Form 20-F as published on March 19, 2025 as well as other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the Securities and Exchange Commission. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com 

INTERNATIONAL INVESTOR RELATIONS  
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com 

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SOURCE Camtek Ltd.

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What did Camtek (CAMT) announce on February 10, 2026 about Hawk orders?

Camtek announced a $25 million Hawk systems order from a tier-1 IDM. According to the company, that order raises the customer's total aggregate Hawk orders to $45 million for delivery in 2026.

How large are the aggregate Hawk orders Camtek (CAMT) has from this IDM and when will they be delivered?

Aggregate orders from the IDM total $45 million for Hawk systems. According to the company, these orders are scheduled for delivery during 2026, supporting AI-related packaging applications.

What applications does the Hawk system address and why is it important for CAMT investors?

The Hawk inspects advanced packaging such as HBM, chiplets and hybrid bonding with high throughput and precision. According to the company, these capabilities expand Camtek's addressable market in AI infrastructure inspection and metrology.

Does the February 2026 Hawk order signal stronger customer adoption for Camtek (CAMT)?

The $25 million order, and $45 million aggregate from the same IDM, indicate growing adoption by a tier-1 customer. According to the company, this reflects confidence in Hawk for high-performance AI packaging needs.

What is the expected timing and scale impact of the Hawk orders on Camtek's 2026 operations (CAMT)?

The orders are slated for delivery in 2026 and represent multi-million-dollar system sales. According to the company, the shipments are intended to support AI applications and expand its advanced packaging market footprint.