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Celestica and AMD Announce Collaboration to Advance the Next Era of AI with “Helios” Rack-Scale AI Platform

(Moderate)
(Positive)
Tags
AI

Celestica (TSX: CLS) and AMD (NASDAQ: AMD) announced a strategic collaboration to commercialize the “Helios” rack-scale AI platform, combining AMD Instinct MI450 Series GPUs with Celestica’s R&D, design and manufacturing of scale-up networking switches.

The Helios architecture follows OCP ORW form-factor and UALoE connectivity; Celestica will support global production and supply chain delivery, with availability targeted for late 2026.

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Positive

  • Celestica tasked with R&D, design, and manufacturing of Helios scale-up switches
  • Platform optimized for AMD Instinct MI450 Series GPUs
  • Helios adopts OCP ORW form-factor and UALoE for scale-up connectivity
  • Targeted customer segments: cloud, enterprise, and research
  • Availability timeline: late 2026

Negative

  • None.

News Market Reaction – CLS

+2.68%
11 alerts
+2.68% Session close to close
+3.9% Peak in 26 hr 48 min
$32.72B Market Cap
0.3x Rel. Volume

In the Mar 16 session, CLS gained 2.68%, reflecting a moderate positive market reaction. Argus tracked a peak move of +3.9% during that session. Our momentum scanner triggered 11 alerts that day, indicating notable trading interest and price volatility.

Data tracked by StockTitan Argus on the day of publication.

Market Context

This announcement expands Celestica’s AI portfolio through a strategic Helios rack-scale collaborati...
Analysis

This announcement expands Celestica’s AI portfolio through a strategic Helios rack-scale collaboration with AMD, targeting large AI clusters with OCP-based networking and next-generation GPUs available by late 2026. It builds on a history of AI-optimized switches and storage, and sits alongside a fast-growing AI-focused CCS segment described in recent filings. Investors may watch for design wins, deployment scale, and how this platform deepens relationships with major hyperscale and enterprise customers.

Key Figures

Helios availability: Late 2026
1 metrics
Helios availability Late 2026 Expected customer availability timeline for AMD–Celestica Helios platform

Previous AI Reports

5 past events · Latest: Nov 17 (Positive)
Same Type Pattern 5 events
Date Event Sentiment 24h Move Catalyst
Nov 17 AI storage platform Positive -0.5% Launch of SD6300 ultra-dense storage for enterprise, hyperscale and AI workloads.
Oct 10 AI data switches Positive -6.2% Introduction of 1.6TbE data center switches for AI/ML clusters and OCP racks.
Sep 08 AI-robot manufacturing Positive +0.7% Partner role supporting high-volume production of fourth‑generation AI robots.
Jun 23 AI-edge campus switch Positive +0.8% Launch of ES1500 enterprise campus switch targeting AI-edge and modern IT needs.
Oct 11 800G AI switch Positive +3.0% Debut of DS4100 800G switch optimized for AI/ML and hyperscale data centers.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

AI-related announcements have generally been viewed positively but produced modest and mixed price reactions, with a slight tilt toward alignment on recent AI hardware and platform launches.

Recent Company History

Over the past year, Celestica has repeatedly expanded its AI-focused hardware portfolio. AI-tagged news includes launches of high-density storage (SD6300) and multiple AI/ML-optimized switches like the DS6000 family and DS4100, plus an AI-edge campus switch ES1500. Average move around these 5 AI events was -0.44%, indicating that while strategically important, prior AI announcements have not consistently driven large upside moves.

Key Terms

open compute project, open-rack-wide (orw), gpu, ultra accelerator link over ethernet (ualoe), +1 more
5 terms
open compute project technical
"based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor."
An industry collaboration that creates and shares open designs for data-center hardware—like servers, storage and networking—so companies can build or buy compatible, efficient equipment without proprietary lock-in. For investors, it matters because those shared designs can lower capital and operating costs, speed innovation, and increase competition among suppliers, all of which can influence profit margins and capital spending needs for technology-focused businesses.
open-rack-wide (orw) technical
"based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor."
Open-rack-wide (ORW) is a data-center hardware standard that describes server and equipment dimensions built to fit an open, wide rack frame rather than traditional enclosed cabinets. Investors should care because ORW designs can lower cooling and maintenance costs, increase equipment density, and reduce vendor lock-in—similar to switching from proprietary light bulbs to a common, energy-saving socket that makes operations cheaper and upgrades easier.
gpu technical
"interconnect of the next-generation AMD Instinct™ MI450 Series GPUs, enabling leading-edge"
A GPU (graphics processing unit) is a specialized computer chip designed to handle many calculations at once, originally for rendering images and video but now widely used for tasks like artificial intelligence, data analysis and high-performance computing. Investors watch GPU demand and prices because strong sales often signal growth for chip makers and their customers, affect profit margins and capital spending, and can forecast wider trends in gaming, AI adoption and cloud services.
rack-scale ai platform technical
"announced a strategic collaboration to bring the new “Helios” rack-scale AI platform to market."
A rack-scale AI platform is a complete, ready-to-deploy AI computing system built to fit inside a single server rack, combining processors, accelerators, storage, cooling and software tuned to run large machine-learning tasks. Think of it as a self-contained kitchen for AI workloads instead of buying individual appliances; it simplifies setup, boosts performance and efficiency, and matters to investors because it can lower operating costs, shorten time to market and concentrate demand on specific hardware and service providers.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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TORONTO and SANTA CLARA, Calif., March 16, 2026 (GLOBE NEWSWIRE) -- Celestica Inc. (TSX: CLS) (NYSE: CLS), a global leader in data center infrastructure and advanced technology solutions, and AMD (NASDAQ: AMD), a leader in high-performance and AI computing, today announced a strategic collaboration to bring the new “Helios” rack-scale AI platform to market. The collaboration pairs AMD computing leadership with Celestica’s expertise in delivering leading-edge networking switch technologies.

At launch, Celestica will undertake the R&D, design and manufacturing of scale-up networking switches in the AMD “Helios” rack-scale AI architecture, based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor.

The scale-up switches will utilize advanced networking silicon to enable the high-speed interconnect of the next-generation AMD Instinct™ MI450 Series GPUs, enabling leading-edge computing, optimized for large-scale AI clusters. Consistent with the open standards-based design of the “Helios” platform, the networking switches will utilize the Ultra Accelerator Link over Ethernet (UALoE) architecture for scale-up connectivity. AMD “Helios” will be available to customers in late 2026.

“Deploying AI at scale requires infrastructure that can be delivered quickly, consistently, and with the performance customers expect,” said Steven Dorwart, senior vice president and general manager, Hyperscalers, Celestica. “Our collaboration with AMD on the “Helios” platform brings together our global engineering, manufacturing, and supply chain capabilities with AMD’s innovation in high-performance computing. Together, we are accelerating access to AI systems optimized for the most demanding workloads of the next era.”

“‘Helios’ represents a new blueprint for AI infrastructure, enabling customers to deploy AI at scale with the performance, efficiency, and flexibility required for the next generation of workloads,” said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. “We are pleased to work with Celestica, leveraging their expertise in delivering leading-edge networking switch technology with AMD’s leadership in high-performance and AI computing.”

The companies are collaborating to support deployments of “Helios” across cloud, enterprise, and research environments, helping to address a growing need for solutions that reduce time-to-value and improve supply chain resiliency for organizations investing in AI.

About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.

About Celestica
Celestica is a technology leader dedicated to driving customer success and market advancements. With deep expertise in design, engineering, manufacturing, supply chain, and platform solutions, Celestica enables critical data center infrastructure for AI, cloud, and hybrid cloud and advances technologies in high-growth markets. With a talented team and a strategic global network, Celestica helps its customers achieve competitive advantages. For more information on Celestica, visit www.celestica.com.

Cautionary Note Regarding Forward-Looking Statements

Statements in this press release relating to AMD’s and Celestica’s future plans, expectations, beliefs, and intentions are “forward-looking statements” and are subject to material risks, uncertainties, and as applicable, assumptions. Those statements may include the anticipate benefits of the strategic collaboration between AMD and Celestica; and the expected timing and availability of, Helios rack-scale AI platform, all of which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995, and where applicable, Canadian securities laws. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD’s and Celestica’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Investors are urged to review in detail the risks, uncertainties, and as applicable assumptions contained in AMD’s and Celestica’s Securities and Exchange Commission (SEC) filings, including AMD’s and Celestica’s most recent reports on Form 10-K, Form 10-Q, Current Reports on Form 8-K and other documents filed with, or furnished to, the SEC, and as applicable, the Canadian Securities Administrators. These filings are available on the SEC’s website, and as applicable, www.sedarplus.ca, or on Celestica’s website at https://corporate.celestica.com/sec-filings and AMD’s website at https://ir.amd.com. AMD and Celestica undertake no duty to update any statement in light of new information or future events or otherwise, except as expressly required by applicable law.

Celestica Contacts:

Celestica Global Communications
(416) 448-2200
media@celestica.com

Celestica Investor Relations
(416) 448-2211
clsir@celestica.com


FAQ

What will Celestica (CLS) do for the AMD Helios rack-scale AI platform?

Celestica will handle R&D, design, and manufacturing of Helios scale-up networking switches. According to Celestica, the work covers production of OCP ORW form-factor switches to enable high-speed interconnect for AMD GPUs.

When will the AMD Helios platform be available to customers and who announced the timing?

Helios is scheduled to be available to customers in late 2026. According to the companies, that timeline reflects combined AMD and Celestica plans for engineering, manufacturing ramp, and supply chain readiness.

Which AMD GPUs are the Helios switches optimized for and what connectivity do they use?

Helios switches are designed to support AMD Instinct MI450 Series GPUs and use Ultra Accelerator Link over Ethernet. According to AMD, UALoE provides scale-up connectivity for high-speed interconnect in large AI clusters.

What form-factor and open standards does the Helios platform follow for networking?

Helios follows the Open Compute Project Open-Rack-Wide (ORW) form-factor and open-standards design. According to the companies, the OCP ORW specification guides hardware compatibility and modular infrastructure deployment.

Which customer segments are targeted by the Celestica and AMD Helios collaboration?

The collaboration targets cloud, enterprise, and research deployments for AI infrastructure. According to Celestica and AMD, Helios aims to reduce time-to-value and improve supply chain resiliency for large-scale AI customers.

How does the Celestica-AMD partnership affect supply chain and deployment for AI systems?

The partnership aims to accelerate delivery and improve supply chain resiliency for AI systems. According to the companies, combined engineering and manufacturing capabilities are intended to speed consistent, large-scale Helios deployments.