ZutaCore and Compal Transform AI Data Center Cooling at Yotta 2025
Compal (OTC:CMPFF) and ZutaCore have announced a strategic partnership to revolutionize AI data center cooling solutions, showcasing their innovations at Yotta 2025. The collaboration integrates ZutaCore's HyperCool® waterless liquid cooling technology with Compal's high-performance server platforms.
Two key platforms were unveiled: the SG720-2A-L2, a 7U 8-GPU system achieving PUE of 1.04-1.1, and the SD221-8A-L2, a 2U 4-Node platform reaching an industry-leading pPUE of 1.01. The solutions utilize non-conductive, non-corrosive dielectric fluid for direct-to-chip cooling, offering enhanced safety and efficiency for AI workloads.
The technology promises higher rack performance, lower energy costs, improved reliability, and significant sustainability benefits for data center operations.Compal (OTC:CMPFF) e ZutaCore hanno annunciato una partnership strategica per rivoluzionare le soluzioni di raffreddamento dei data center per l'AI, presentando le loro innovazioni a Yotta 2025. La collaborazione integra la tecnologia HyperCool® di raffreddamento liquido senza acqua di ZutaCore con le piattaforme server ad alte prestazioni di Compal.
Sono state svelate due piattaforme principali: la SG720-2A-L2, un sistema 7U con 8 GPU che raggiunge un PUE di 1,04-1,1, e la SD221-8A-L2, una piattaforma 2U a 4 nodi che arriva a un pPUE record di 1,01. Le soluzioni impiegano un fluido dielettrico non conduttivo e non corrosivo per il raffreddamento diretto al chip, offrendo maggiore sicurezza ed efficienza per i carichi di lavoro AI.
La tecnologia promette prestazioni di rack superiori, costi energetici ridotti, maggiore affidabilità e rilevanti benefici di sostenibilità per le operazioni dei data center.
Compal (OTC:CMPFF) y ZutaCore han anunciado una alianza estratégica para transformar las soluciones de refrigeración de centros de datos para IA, mostrando sus innovaciones en Yotta 2025. La colaboración integra la tecnología HyperCool® de refrigeración líquida sin agua de ZutaCore con las plataformas de servidores de alto rendimiento de Compal.
Se presentaron dos plataformas clave: la SG720-2A-L2, un sistema 7U con 8 GPU que alcanza un PUE de 1.04-1.1, y la SD221-8A-L2, una plataforma 2U de 4 nodos que logra un pPUE líder en la industria de 1.01. Las soluciones usan un fluido dieléctrico no conductor y no corrosivo para el enfriamiento directo al chip, proporcionando mayor seguridad y eficiencia para las cargas de trabajo de IA.
La tecnología promete mayor rendimiento por rack, menores costes energéticos, mejor fiabilidad y significativos beneficios de sostenibilidad para las operaciones de los centros de datos.
Compal (OTC:CMPFF)과 ZutaCore가 AI 데이터센터 냉각 솔루션 혁신을 위해 전략적 파트너십을 발표하고 Yotta 2025에서 기술을 선보였습니다. 이번 협업은 ZutaCore의 HyperCool® 무수(無수) 액체 냉각 기술을 Compal의 고성능 서버 플랫폼에 통합한 것입니다.
두 가지 주요 플랫폼이 공개되었습니다: 8 GPU를 탑재한 7U 시스템인 SG720-2A-L2는 PUE 1.04-1.1을 달성했고, 4노드 구성의 2U 플랫폼인 SD221-8A-L2는 업계 선도적인 pPUE 1.01을 기록했습니다. 이 솔루션들은 칩 직접 냉각을 위해 비전도성·비부식성 유전체 유체를 사용하여 AI 워크로드에 대해 향상된 안전성과 효율성을 제공합니다.
이 기술은 랙 성능 향상, 에너지 비용 절감, 신뢰성 개선 및 데이터센터 운영의 지속가능성에 큰 이점을 약속합니다.
Compal (OTC:CMPFF) et ZutaCore ont annoncé un partenariat stratégique pour révolutionner les solutions de refroidissement des centres de données pour l'IA, présentant leurs innovations à Yotta 2025. La collaboration intègre la technologie HyperCool® de refroidissement liquide sans eau de ZutaCore aux plates-formes serveur haute performance de Compal.
Deux plates-formes clés ont été dévoilées : la SG720-2A-L2, système 7U à 8 GPU atteignant un PUE de 1,04–1,1, et la SD221-8A-L2, plate-forme 2U à 4 nœuds atteignant un pPUE leader de 1,01. Les solutions utilisent un fluide diélectrique non conducteur et non corrosif pour le refroidissement direct du processeur, offrant plus de sécurité et d'efficacité pour les charges de travail IA.
La technologie promet des performances par rack supérieures, des coûts énergétiques réduits, une fiabilité accrue et des bénéfices significatifs en matière de durabilité pour l'exploitation des centres de données.
Compal (OTC:CMPFF) und ZutaCore haben eine strategische Partnerschaft zur Neugestaltung von KI-Rechenzentrumskühlungen angekündigt und präsentieren ihre Innovationen auf der Yotta 2025. Die Zusammenarbeit integriert ZutaCores HyperCool®-Wasserloses Flüssigkühlverfahren in Compals leistungsstarke Serverplattformen.
Vorgestellt wurden zwei Schlüsselplattformen: das SG720-2A-L2, ein 7U-8-GPU-System mit einem PUE von 1,04–1,1, und das SD221-8A-L2, eine 2U-4-Knoten-Plattform mit einem branchenführenden pPUE von 1,01. Die Lösungen verwenden ein nicht leitfähiges, nicht korrodierendes dielektrisches Fluid für Direct-to-Chip-Kühlung und bieten so erhöhte Sicherheit und Effizienz für KI-Workloads.
Die Technologie verspricht höhere Rack-Leistung, geringere Energiekosten, verbesserte Zuverlässigkeit und erhebliche Nachhaltigkeitsvorteile für den Rechenzellenbetrieb.
- Achieved breakthrough PUE scores of 1.04-1.1 for SG720-2A-L2 and pPUE of 1.01 for SD221-8A-L2
- Non-conductive, non-corrosive cooling technology eliminates hardware damage risk
- Dual compatibility with both EIA 19-inch racks and ORv3 infrastructure
- Technology enables higher AI workload density while reducing energy costs
- None.
Breakthrough waterless, two-phase liquid cooling delivers unmatched efficiency, reliability, and sustainability for next-generation AI workloads
"Partnering with ZutaCore allows us to bring truly transformative cooling technology into our high-performance server portfolio," said Alan Chang, Vice President of the Infrastructure Solutions Business Unit, Compal. "The combination of our engineering expertise and ZutaCore's HyperCool® platform enables data centers to scale AI workloads more sustainably and cost-effectively."
My D. Truong, ZutaCore CTO, said the partnership delivers the best of both technologies designed for AI's most demanding workloads—from hyperscale data centers to the edge. "With Edge AI accelerating faster than ever, cooling becomes a critical enabler of real-time intelligence,' he said. "Our waterless two-phase direct-to-chip cooling uses a non-conductive, non-corrosive dielectric fluid that instantly removes heat at the source, keeping processors cool even in the most constrained edge environments. Unlike water-based systems, it is
From Innovation to Implementation: Next-Generation Platforms
At Yotta 2025, attendees will see two Compal platforms built with ZutaCore's HyperCool® waterless liquid cooling, proving how advanced cooling translates into real-world gains in density, efficiency, performance and reliability.
- SG720-2A-L2 (7U 8-GPU UBB)
Designed for next-generation AI acceleration, this system features AMD Instinct™ MI325X GPUs and is ready for the upcoming MI355X. Its 850mm chassis delivers maximum flexibility: it fits seamlessly into today's EIA 19-inch racks—the universal rack size used in nearly every data center—while also supporting ORv3 (Open Rack Version 3) infrastructure, a new open standard from the Open Compute Project backed by Meta and Microsoft that enables hyperscale efficiency and sustainability. Supporting both ensures compatibility with today's environments and future-readiness for tomorrow's. A modular, tool-less design streamlines maintenance and upgrades, while liquid cooling integration enables an impressive PUE (Power Usage Effectiveness) score as low as 1.04–1.1 - SD221-8A-L2 (2U 4-Node Dual Processor)
Built for high-density computing, this platform redefines efficiency with a 2U4N architecture and waterless two-phase cooling, achieving an industry-leading pPUE (partial Power Usage Effectiveness) of 1.01. pPUE measures efficiency at the rack level, showing how little extra energy is needed beyond the servers themselves. Unlike water-based systems, ZutaCore's cooling uses a non-conductive, non-corrosive dielectric heat transfer fluid that is completely IT-safe, protecting hardware even in the event of a leak. This design minimizes risk, ensures reliability under heavy AI workloads, and combines sustainability with peace of mind.
"PUE and pPUE are the industry's gold standards for energy efficiency," noted Truong. "A perfect score of 1.0 means every watt of power goes into computing, with none wasted on cooling. Reaching values this close to 1.0 is a breakthrough that redefines sustainable, high-performance data center operations."
ZutaCore's Cooling Technology Brings Game-Changing Benefits
ZutaCore's waterless, direct-to-chip liquid cooling, with its exclusive pool boiling technology, represents a fundamental shift from traditional air or single-phase liquid cooling. Instead of moving heat away gradually, it removes it instantly at the source by turning liquid into vapor, keeping processors consistently cool even under the most extreme workloads.
For operators, the impact is immediate:
- Higher performance per rack — Run more AI and HPC workloads in the same footprint.
- Lower energy costs — Drive PUE and pPUE closer to the ideal of 1.0, cutting power bills dramatically.
- Greater reliability — Eliminate risks of condensation, corrosion, or hardware damage.
- Sustainability gains — Reduce both water and electricity use, accelerating ESG progress.
About Compal
Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of
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SOURCE COMPAL ELECTRONICS INC.
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