Compal at CloudFest 2025: SG720-2A/OG720-2A AI Server with ZutaCore Pioneers a New Era of High-Efficiency, Energy-Saving Data Centers!

Rhea-AI Summary

Compal Electronics unveils its innovative SG720-2A/OG720-2A AI server at CloudFest 2025 in Germany. The 7U server features advanced specifications including support for 8x AMD Instinct™ MI325X GPUs with CDNA 3 architecture, delivering up to 20.9 PFLOPs in FP16 performance and exceeding 41.8 PFLOPs with FP8 computations.

The system incorporates 2TB of HBM3E memory with 48TB/s bandwidth and utilizes ZutaCore® HyperCool® 2-Phase DLC liquid cooling technology. Notable features include an optimized 850mm chassis depth, compatibility with standard EIA 19" and Open Rack v3 setups, and front-facing hot-pluggable I/Os.

Testing revealed the ZutaCore HyperCool technology achieved a partial Power Usage Effectiveness (pPUE) of 1.01, performing 5% better than single-phase liquid cooling solutions, positioning the server as an efficient solution for next-generation data centers.

Positive

• Advanced GPU performance capabilities with 20.9 PFLOPs FP16 and 41.8 PFLOPs FP8
• Superior cooling efficiency with pPUE of 1.01, 5% better than alternatives
• Hot-swappable components reduce system downtime
• High-capacity memory system with 2TB HBM3E and 48TB/s bandwidth

Negative

• 7U form factor may limit rack density compared to smaller servers

RUST, Germany, March 18, 2025 /PRNewswire/ -- Compal Electronics (Compal; Stock Ticker: 2324.TW) makes a grand debut at CloudFest 2025 (March 17–20, 2025) with the launch of its groundbreaking SG720-2A/OG720-2A AI server—a milestone that marks a major breakthrough in the convergence of high-performance GPU Accelerator and two-phase direct-to-chip (DTC) liquid cooling technology.

The SG720-2A/OG720-2A 7U AI server not only supports 8x AMD Instinct™ MI325X GPUs —built on the advanced CDNA 3 architecture up to 896GB/s Infinity Fabric™ bandwidth, which achieves a theoretical FP16 performance of approximately 20.9 PFLOPs with sparsity and exceeds 41.8 PFLOPs with sparsity in FP8 computations—but also incorporates total 2TB of high-speed HBM3E memory in the platform with up to 48TB/s of memory bandwidth, delivering unparalleled compute power and ultra-fast data access for large-scale AI inference and data processing. Additionally, it is equipped with the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, and the synergistic integration of these technologies elevates the SG720-2A/OG720-2A's performance and operational stability to unprecedented levels.

With an optimized 850mm chassis depth, the SG720-2A/OG720-2A seamlessly integrates into a standard EIA 19" 1-meter-deep rack or Open Rack v3-compatible setup. It enhances power efficiency and simplifies management with front-facing, hot-pluggable I/Os, making it a scalable and high-performance solution for data centers.

Its modular architecture facilitates straightforward maintenance and upgrades, with independent component replacement that minimizes downtime, while hot-swappable PCIe slots offer the crucial advantage of minimizing downtime and maximizing efficiency by allowing for network card replacement or upgrades without shutting down the entire system.

Compal recently conducted an experiment to evaluate the efficiency of direct-to-chip liquid cooling methods, revealing that ZutaCore's HyperCool technology achieved an impressively low partial Power Usage Effectiveness (pPUE) of 1.01. In comparative testing against single-phase liquid cooling, HyperCool consistently outperformed across all test conditions with 5% lower pPUE, demonstrating its superior efficiency and effectiveness in optimizing thermal management. This benchmark cements HyperCool as a game-changing solution for sustainable, high-performance data centers.

At CloudFest 2025, Compal, in partnership with ZutaCore®, showcases cutting-edge core technologies and solutions for the data centers of the future. In addition to showcasing the all-new SG720-2A/OG720-2A, other leading-edge server technologies are also on display. Interested visitors are warmly invited to visit the exhibit and explore the latest advancements in AI and HPC technologies.

CloudFest 2025 – Compal Booth
Dates: March 17–20, 2025
Location: Europa-Park, Germany
Booth Number: R07

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal server, please visit https://www.compalserver.com/

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SOURCE COMPAL ELECTRONICS,INC.

FAQ

What are the key performance specifications of Compal's new SG720-2A/OG720-2A AI server?

The server supports 8x AMD Instinct MI325X GPUs, delivering 20.9 PFLOPs in FP16 and 41.8 PFLOPs in FP8 computations, with 2TB HBM3E memory and 48TB/s bandwidth.

How does the ZutaCore cooling technology improve the server's efficiency?

ZutaCore HyperCool achieved a pPUE of 1.01, performing 5% better than single-phase liquid cooling solutions.

What are the key maintenance features of the SG720-2A/OG720-2A server?

It features modular architecture, independent component replacement, and hot-swappable PCIe slots for minimal downtime during maintenance.

What are the physical specifications and compatibility of the new AI server?

It has an 850mm chassis depth and is compatible with standard EIA 19" 1-meter-deep racks and Open Rack v3 setups.