Coherent Introduces Next-Gen 2D VCSEL and Photodiode Arrays To Accelerate AI-Driven Optical Interconnects
Coherent (NYSE:COHR) has unveiled next-generation 2D VCSEL and photodiode arrays for optical interconnects, specifically designed for AI-driven datacenter applications. The new technology features a high-density 2D array architecture (1.6T, 850 nm, 32x50G NRZ) built on their 100G PAM4 multimode platform.
The arrays are optimized for "slow and wide" interconnections in scale-up AI networks, offering advantages in power efficiency, reduced latency, and cost effectiveness. The company plans to expand its portfolio with 1060 nm backside-emitting flip-chip VCSEL/PD array variants in 2026, supporting the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO).
Coherent (NYSE:COHR) ha presentato array 2D di VCSEL e fotodiodi di nuova generazione per interconnessioni ottiche, progettati specificamente per applicazioni nei data center guidate dall'IA. La nuova tecnologia presenta una architettura di matrice 2D ad alta densità (1.6T, 850 nm, 32x50G NRZ) costruita sulla loro piattaforma multimodale 100G PAM4.
Gli array sono ottimizzati per connessioni "lente e ampie" nelle reti AI su scala, offrendo vantaggi in efficienza energetica, latenza ridotta e convenienza. L'azienda prevede di espandere il proprio portafoglio con varianti di array VCSEL/PD flip-chip a emissione posteriore a 1060 nm nel 2026, supportando la transizione verso Near-Packaged Optics (NPO) e Co-Packaged Optics (CPO).
Coherent (NYSE:COHR) ha presentado matrices 2D de VCSEL y fotodiodos de nueva generación para interconexiones ópticas, diseñados específicamente para aplicaciones en centros de datos impulsadas por IA. La nueva tecnología presenta una arquitectura de matriz 2D de alta densidad (1.6T, 850 nm, 32x50G NRZ) construida sobre su plataforma multimodal 100G PAM4.
Las matrices están optimizadas para interconexiones "lentas y anchas" en redes de IA a gran escala, ofreciendo ventajas en eficiencia energética, reducción de latencia y rentabilidad. La compañía planea ampliar su cartera con variantes de matrices VCSEL/PD de flip-chip de emisión trasera a 1060 nm en 2026, apoyando la transición hacia Near-Packaged Optics (NPO) y Co-Packaged Optics (CPO).
Coherent (NYSE:COHR)는 AI 구동 데이터 센터 애플리케이션을 위해 특별히 설계된 광학 인터커넥트를 위한 차세대 2D VCSEL 및 포토다이오드 어레이를 발표했습니다. 새로운 기술은 고밀도 2D 어레이 아키텍처(1.6T, 850 nm, 32x50G NRZ)를 100G PAM4 다중 모드 플랫폼 위에 구축합니다.
이 어레이는 대규모 AI 네트워크에서의 "느리고 넓은" 인터커넥션에 최적화되어 전력 효율성, 지연 감소 및 비용 효과성의 이점을 제공합니다. 회사는 2026년 1060 nm 백사출 플립칩 VCSEL/PD 어레이 변종을 포트폴리오에 추가하여 Near-Packaged Optics(NPO) 및 Co-Packaged Optics(CPO)로의 전환을 지원할 계획입니다.
Coherent (NYSE:COHR) a dévoilé des réseaux 2D VCSEL et photodiodes de nouvelle génération pour les interconnexions optiques, spécialement conçus pour les applications de centres de données pilotées par l'IA. La nouvelle technologie présente une architecture en matrice 2D haute densité (1.6T, 850 nm, 32x50G NRZ) construite sur leur plateforme multimode 100G PAM4.
Les réseaux sont optimisés pour des interconnexions "lentes et larges" dans les réseaux IA à grande échelle, offrant des avantages en efficacité énergétique, latence réduite et rentabilité. L'entreprise prévoit d'étendre son portefeuille avec des variantes d'array VCSEL/PD flip-chip émettant en arrière à 1060 nm en 2026, soutenant la transition vers Near-Packaged Optics (NPO) et Co-Packaged Optics (CPO).
Coherent (NYSE:COHR) hat Next-Generation 2D VCSEL- und Photodioden-Arrays für optische Schnittstellen vorgestellt, speziell entwickelt für KI-gesteuerte Rechenzentren. Die neue Technologie verfügt über eine hochdichte 2D-Array-Architektur (1.6T, 850 nm, 32x50G NRZ), die auf ihrer 100G-PAM4-Multimode-Plattform basiert.
Die Arrays sind für „langsame und breite“ Verbindungen in skalierbaren KI-Netzwerken optimiert und bieten Vorteile in Energieeffizienz, reduzierter Latenz und Kosteneffektivität. Das Unternehmen plant, sein Portfolio im Jahr 2026 mit 1060 nm Backside-Emitting Flip-Chip VCSEL/PD-Array-Varianten zu erweitern, um den Übergang zu Near-Packaged Optics (NPO) und Co-Packaged Optics (CPO) zu unterstützen.
كوريهينت (NYSE:COHR) كشفت عن مصفوفات VCSEL ثنائية البعد وبالعرض الجديدة لأجهزة الترابط البصري، مصممة خصيصاً لتطبيقات مراكز البيانات المدفوعة بالذكاء الاصطناعي. التقنية الجديدة تتميز بـ بنية مصفوفة ثنائية الأبعاد ذات كثافة عالية (1.6T، 850 نانومتر، 32×50G NRZ) مبنية على منصة PAM4 متعددة الوضعيات 100G الخاصة بهم.
المصفوفات مُحسّنة للاتصالات "البطيئة والواسعة" في شبكات AI القابلة للتوسع، وتقدم مزايا في كفاءة الطاقة، تقليل الكمون، وتكلفة فعّالة. تخطط الشركة لتوسيع محفظتها بواسطة متغيرات مصفوفات VCSEL/PD ذات التغريد الخلفي عند 1060 نانومتر في 2026، دعم الانتقال إلى Near-Packaged Optics (NPO) وCo-Packaged Optics (CPO).
Coherent (NYSE:COHR) 已推出用于光互连的下一代二维 VCSEL 与光电二极管阵列，专为 AI 驱动的数据中心应用而设计。新技术具有一个 高密度二维阵列架构（1.6T，850 nm，32x50G NRZ），基于他们的 100G PAM4 多模平台构建。
这些阵列针对大规模 AI 网络中的“慢而宽”互连进行了优化，在 功率效率、降低延迟和成本效益方面具有优势。公司计划在 2026 年将产品组合扩展为 1060 nm 背面发射翻装芯片 VCSEL/PD 阵列变体，以支持向近端打包光学（NPO）和共封装光学（CPO）的转变。
- Introduction of high-density 2D array architecture enabling copper link replacement
- Technology offers improved power efficiency and reduced latency for AI applications
- Planned expansion to 1060 nm backside-emitting variants in 2026
- Solution supports transition to advanced NPO and CPO technologies
- None.
Insights
Coherent's new 2D VCSEL arrays provide critical optical interconnect solutions for AI computing with significant power and performance advantages.
Coherent's announcement of next-generation 2D VCSEL (Vertical-Cavity Surface-Emitting Laser) and photodiode arrays represents a significant technological advancement in the optical interconnect space. The 2D array architecture delivers an impressive 1.6T throughput using 32x50G NRZ signals at 850 nm wavelength, providing the high-bandwidth density essential for AI/ML workloads.
What makes this development particularly noteworthy is its focus on "slow and wide" interconnections for scale-up AI networks. This approach optimizes for short-reach applications within datacenters, where traditional copper interconnects are reaching their physical limitations. The 2D architecture enables greater parallelism, which is crucial for distributing massive AI computational workloads across multiple processors.
The technology builds upon Coherent's established 100G PAM4 multimode platform, demonstrating the company's ability to leverage existing expertise while pushing technical boundaries. The planned introduction of 1060 nm backside-emitting flip-chip variants in 2026 shows a clear technology roadmap toward enabling Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) – both critical transitions for next-generation datacenter architectures.
From a technical perspective, these optical interconnects deliver three critical advantages: reduced power consumption (essential as AI power demands skyrocket), lower latency (crucial for distributed AI training), and cost efficiency (vital for widespread deployment). By replacing copper links with these optical solutions, datacenter operators can overcome current bandwidth bottlenecks while simultaneously addressing power and thermal challenges.
SAXONBURG, Pa., Sept. 25, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a breakthrough in short-reach optical interconnect technology with the demonstration of its next-generation 2D VCSEL and photodiode (PD) arrays. Best suited for “slow and wide” interconnections in scale-up AI networks, these arrays enable power-efficient and compact links optimized for short reach, addressing the surging data traffic demands in modern datacenters.
Leveraging its proven 100G PAM4 multimode VCSEL and PD platform, Coherent has introduced a high-density 2D array architecture (1.6T, 850 nm, 32x50G NRZ) that enables copper link replacement and optimal degree of parallelism. With advantages in low power consumption, reduced latency, and cost efficiency, these arrays are designed to support the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), accelerating the deployment of AI/ML workloads in hyperscale datacenters.
“We are continuously anticipating the needs of next-generation datacenter interconnects. Our high-density multimode 2D VCSEL and PD arrays represent an important step forward in enabling parallelism, power-efficient design, and flexible architectures that will shape the future of AI and machine learning networks,” said Karlheinz Gulden, Senior Vice President, Laser and Subsystems at Coherent.
As an initial step toward enabling high-performance AI/ML scale-up links, Coherent will introduce 1060 nm backside-emitting (BSE) flip-chip VCSEL/PD array variants in 2026, expanding its product portfolio for next-generation optical networking. Attendees can experience this innovation firsthand at ECOC 2025, Booth C3124 in Copenhagen, Denmark, September 29 – October 1, 2025.
About Coherent
Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter, communications, and industrial markets rely on Coherent’s world-leading technology to fuel their own innovation and growth.
Founded in 1971 and operating in more than 20 countries, Coherent brings the industry’s broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges. For more information, visit us at coherent.com.
Media Contact:
innovations@coherent.com
A photo accompanying this announcement is available at: https://www.globenewswire.com/NewsRoom/AttachmentNg/35cc663b-5b75-4ec4-802f-b548b52867b0
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