Credo Joins Open CPX MSA Organization

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Supports Development of Interoperable Near-Package and Co-Packaged Optical Interconnects for Next-Generation AI Infrastructure

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it is now a member of the Open CPX MSA (Open Co-packaged Interface Multi-Source Agreement). Credo joins a growing consortium of companies collaborating through the Open CPX MSA to advance interoperable near-package and co-packaged optical interconnect architectures for future AI scale-out and scale-up networks.

News Highlights:

• Credo joins the Open CPX MSA to help drive an ecosystem of interoperable optical solutions that deliver the bandwidth, density, and power efficiency required for next-generation AI infrastructure.
• Established in March of 2026, the Open CPX MSA is developing open specifications for optimized optical engines that enable high-speed, high-density connectivity between ASICs and near-package optics (NPO) and co-packaged optics (CPO) interconnects.
• The Open CPX MSA specifications will standardize mechanical, thermal, electrical, optical, and management interfaces, helping ensure interoperability and accelerate the adoption of next-generation AI networking architectures.
• Credo will support silicon photonics-based photonic integrated circuits (SiPho PICs), optical DSPs, and other components for the Open CPX MSA standard.

“The Open CPX MSA provides an important framework for advancing an open, multi-vendor ecosystem as the industry explores new architectures to scale AI by bringing optical connectivity closer to the ASIC,” said Ronnen Lovinger, Vice President of Silicon Photonics at Credo. “Joining the Open CPX MSA will enable Credo to support the ecosystem with a full suite of SiPho PICs, optical DSPs and other components to meet the growing needs of our customers.”

As AI infrastructure scales, moving data between ASICs and optical interconnects becomes increasingly challenging due to the power, signal integrity, and density limitations of high-speed electrical connections. By bringing optical connectivity closer to the ASIC, CPO and NPO architectures can reduce the distance data must travel electrically before being converted to light.

The Open CPX MSA brings the industry together to advance next-generation optical solutions that improve AI network efficiency and scalability while preserving the flexibility and benefits of a multi-vendor ecosystem. The initial target of the MSA is an optimized optical engine with a defined pluggable socket and electrical connector system that supports both optical and copper connectivity.

About the Open CPX MSA

Open CPX MSA is an international organization dedicated to easing the adoption of optical engines by providing commonized mechanical and performance parameters for ecosystem suppliers and end users. Its goal is to reduce power, cost, and latency, while improving bandwidth density, capacity, and the reliability of high-speed co-packaged and near-package interconnects for AI data center applications. For more information about Open CPX MSA, please visit www.OpenCPXMSA.org.

About Credo

Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI.

Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world.

For more information, please visit https://www.credosemi.com. Follow Credo on LinkedIn.

Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260831608038/en/

Media Contact:
Kristin Hehir
kristin.hehir@credosemi.com

Investor Contact:
Dan O’Neil
dan.oneil@credosemi.com

Source: Credo

Key Terms

co-packaged optics technical

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

photonic integrated circuits technical

Photonic integrated circuits are chips that use tiny optical components to generate, route and detect light instead of moving electrical signals, performing functions similar to electronic computer chips but with photons. They matter to investors because they can enable much faster data transfer and lower power use in telecommunications, data centers and sensing, creating new markets and potential cost advantages — but they also require specialized manufacturing and carry technology and supply risks.

optical dsps technical

Optical DSPs are specialized chips that clean up and interpret light-based data sent over fiber-optic cables, converting noisy, distorted optical signals into accurate digital information. For investors, they matter because these chips determine how fast and reliably networks, data centers, and telecom systems can transmit information—so improvements or supply changes can affect equipment performance, costs, and the competitive landscape in high-speed communications.