Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
Rhea-AI Summary
DuPont is showcasing its advanced circuit materials and solutions at the International Electronic Circuits Exhibition 2025 in Shanghai from March 24-26. The company is presenting innovations designed for fine-line technology, signal integrity, and thermal management.
The showcase highlights several key products including Circuposit SAP8000 electroless copper for AI server applications, Microfill SFP-II-M acid plating copper for large AI chips, and Riston DI1600 & DI1600M dry film photoresist for IC substrate applications.
These solutions address the growing demands in the IC substrate and high-end PCB market, driven by AI servers, data centers, networking, autonomous vehicles, and 5G technologies. DuPont's portfolio includes dielectrics, metallization chemistries, and dry film imaging photoresists, focusing on performance, miniaturization, reliability, and cost efficiency.
Positive
- Expanding product portfolio for high-growth AI and 5G markets
- Innovation in specialized materials for advanced AI chip manufacturing
- Technical solutions addressing miniaturization and performance demands
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, DD gained 2.53%, reflecting a moderate positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
"As artificial intelligence (AI), machine learning, and 5G technologies continue to advance, the demand for high-performance devices is propelling innovations in packaging substrates and high-end PCBs," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "With our cutting-edge materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance, paving the way for the next generation of AI-driven substrates. Our advancement in interconnect materials plays a critical role in enabling AI infrastructure to optimize speed, efficiency, and reliability."
DuPont is leveraging decades of expertise in material science to address the evolving demands of the rapidly expanding IC substrate and high-end PCB market, fueled by the surge from AI servers and data centers, networking, autonomous vehicles, and 5G. The IC substrate offerings encompass a wide array of solutions, including dielectrics, metallization chemistries for electroless copper seed layer, redistribution layer, copper pillars, solder bumps, and dry film imaging photoresists. This comprehensive portfolio tackles critical challenges in performance, miniaturization, reliability, and cost efficiency.
At the show, DuPont experts will be available at the company's booth to share their in-depth knowledge on technological innovations and industry trends. Attendees can explore DuPont's comprehensive solutions for the PCB market, featuring the following product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an innovative SAP metallization technology designed for AI server CPU or GPU chip applications. This ionic-based catalyst electroless copper process is optimized for advanced packaging. It meets the demands for low-roughness dielectrics as well as low dielectric constant (Dk) and low dissipation factor (Df) properties essential for fine-line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid plating copper is a novel pattern plating solution specifically designed to optimize pattern distribution for large AI chips. It is engineered to deliver consistent pattern distribution across large unit sizes, making it ideal for high-performance computing applications.
DuPont™ Riston® DI1600 & DI1600M dry film photoresist is an advanced fine line direct imaging photoresist solution specifically designed for IC substrate applications. It boasts exceptional fine line adhesion and resolution, paired with high-yield performance.
DuPont™ Riston® DWB8100M dry film photoresist is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. It offers excellent fine line and via resolution, with strong bottom adhesion to minimize underplating risks. It ensures stable yield performance while providing a straight dry film and copper trace profile with low trace voids, making it optimal for advanced IC substrate applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.
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SOURCE DuPont
FAQ
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