Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging

The expansion combines a completed acquisition, a planned Taiwan manufacturing line and a long-term development partnership.

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Entegris addresses critical industry need through strategic acquisition, Taiwan manufacturing investment, and partnership with Element Six

BILLERICA, Mass.--(BUSINESS WIRE)-- Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, today announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging.

“Growth in AI compute, from model training to inference, is intensifying power and heat-management demands in data centers,” said Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris. “We are excited to announce that Entegris is entering this fast-growing market to bring necessary innovation to meet our customers’ chip and package level materials demands.”

First, Entegris has completed its acquisition of Advanced Abrasives Corporation, a New Jersey-based specialty producer of diamond-made precision super-abrasive consumables used in hard-substrate polishing processes. The acquisition builds on Entegris’ existing SiC CMP solutions capabilities that span slurries, pads, cleans and surface conditioning, as well as on its intellectual property portfolio in materials science and surface engineering. In connection with the acquisition and following strong customer engagement, Entegris plans to invest in a new manufacturing line in Taiwan to bring these SiC solutions to market, while continuing U.S.-based exploratory research and development for next-generation thermal interface materials.

Furthermore, Entegris has entered into a long-term development partnership with Element Six, a global leader in synthetic diamond, part of De Beers Group, designed to accelerate the integration of diamond-enabled thermal management solutions into advanced packaging. The strategic collaboration will focus on scalable, cost-effective wafer-level and heterogeneous integration approaches that can reduce manufacturing complexity, minimize thermal boundary resistance and support the performance requirements of next-generation logic and memory chips and their 3-D integration.

“Thermal management is emerging as a critical industry challenge. We believe the move from conventional heat-spreading materials to novel materials and engineered thermal interfaces will mark a major shift in semiconductor manufacturing,” said Mr. Blachier. “Our goal is to facilitate better heat dissipation without compromising performance or reliability. We’re helping customers make that transition through materials innovation and integration at scale.”

At its upcoming Capital Markets Day on November 9, 2026, in New York, Entegris will present its advanced thermal management platform strategy.

ABOUT ENTEGRIS
Entegris is a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-tech industries. Entegris has approximately 9,000 employees throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service and/or research facilities in the United States, Canada, China, Germany, Israel, Japan, Malaysia, Singapore, South Korea, and Taiwan. Additional information can be found at www.entegris.com.

CAUTIONARY NOTE ON FORWARD-LOOKING STATEMENTS
This news release contains “forward-looking statements.” The words “believe,” “expect,” “anticipate,” “intend,” “estimate,” “forecast,” “project,” “should,” “may,” “will,” “would” or the negative thereof and similar expressions are intended to identify such forward-looking statements. These forward-looking statements include, but are not limited to, those related to entry into the market for thermal management materials solutions, the expected size and growth of that market, the anticipated benefits of our acquisition of Advanced Abrasives, our planned investment in manufacturing capacity, our partnership with Element Six and the anticipated results of that collaboration, and our product development and commercialization plans, and are based on current management expectations and assumptions only as of the date of this news release. They are not guarantees of future performance and they involve substantial risks and uncertainties that are difficult to predict, including, but not limited to, those identified in the risk factors and additional information described in the Company’s Annual Report on Form 10-K for the fiscal year ended December 31, 2025, filed with the Securities and Exchange Commission (the “SEC”) on February 11, 2026, including under the heading “Risk Factors” in Item 1A, and in the Company’s other periodic filings with the SEC. Except as required under the federal securities laws and the rules and regulations of the SEC, Entegris undertakes no obligation to update publicly any forward-looking statements or information contained herein, which speak as of their respective dates.

View source version on businesswire.com: https://www.businesswire.com/news/home/20261103466170/en/

Investor Contact:
Jeffrey Schnell
Vice President, Investor Relations
+1 201 207 3029
jeffrey.schnell@entegris.com

Media Contact:
Jessica Emond
Senior Director, Global Corporate Communications
+1 978 436 6520
jessica.emond@entegris.com

Source: Entegris, Inc.

Key Terms

silicon carbide technical

Silicon carbide is a hard, durable material made from silicon and carbon, often used in industrial applications like cutting tools and electronics. Its ability to withstand high temperatures and conduct electricity efficiently makes it valuable in manufacturing advanced electronic devices. For investors, companies working with silicon carbide are seen as key players in the growing market for high-performance electronics and energy-efficient technologies.

cmp technical

CMP stands for Current Market Price, the most recent price at which a stock or security traded on an exchange. It matters to investors because it acts like a live price tag or scoreboard, showing what buyers and sellers are willing to pay right now and forming the basis for measuring gains or losses, setting trade orders, and valuing holdings.

heterogeneous integration technical

Heterogeneous integration is the practice of combining different types of electronic components — such as processors, memory, sensors and specialized chips — into a single package or tightly linked module, rather than building everything on one uniform chip. Like putting varied ingredients into one compact lunchbox to save space and improve function, it matters to investors because it can boost product performance, lower power use, shorten development time and create competitive or cost advantages that affect revenue and margins.

thermal boundary resistance technical

Thermal boundary resistance is the resistance to heat flow across the interface between two materials; it quantifies how much temperature difference appears at the junction for a given heat flux. It arises from imperfect coupling of heat carriers (phonons, electrons) across the boundary and depends on factors such as the materials' vibrational properties, surface roughness, contact pressure, and any interfacial layers; it is distinct from bulk thermal conductivity because it is a property of the interface and can dominate heat transfer in thin films, microdevices, or poorly contacted surfaces. Units are typically K·m²/W and the term is sometimes called thermal contact resistance or Kapitza resistance in low-temperature physics.

3-d integration technical

A manufacturing approach for electronic systems that stacks multiple semiconductor dies or components vertically and links them electrically inside a single package. 3‑D integration can use tiny vertical interconnects (for example, through‑silicon vias), micro-bumps, or advanced bonding to connect logic, memory, sensors, or different process nodes tightly together, reducing circuit path lengths and board space. It trades improved performance, bandwidth density, and form‑factor for greater thermal management challenges and added manufacturing and testing complexity compared with conventional side‑by‑side (planar) chip layouts.