Welcome to our dedicated page for Heico news (Ticker: HEI), a resource for investors and traders seeking the latest updates and insights on Heico stock.
HEICO Corporation reports recurring developments as an aerospace and defense supplier operating through its Flight Support Group and Electronic Technologies Group. News commonly covers quarterly results, conference-call notices, acquisitions, and demand for replacement aircraft parts, MRO services, defense components, RF and microwave antennas, and high-reliability electronic products.
Company updates also describe subsidiary contributions to space and defense programs, including 3D PLUS, Exxelia, and VPT components, and HEICO’s dual NYSE-listed common stock classes, HEI and HEI.A, which differ by voting rights while remaining economically similar.
HEICO (NYSE: HEI.A, HEI) closed a $1.2 billion senior notes offering, issuing $550 million of 4.950% Senior Notes due 2031 and $650 million of 5.400% Senior Notes due 2036. According to HEICO, net proceeds will repay borrowings under its $2.2 billion revolving credit agreement, preserving significant borrowing capacity for potential acquisitions.
Management highlighted that HEICO’s operating performance and balance sheet supported investment grade ratings on both its 2023 notes and the new Notes. The company stated that the transaction broadens capital sources, enhances financial flexibility and benefits from a well-staggered debt maturity profile.
HEICO (NYSE:HEI) declared a $0.13 per share semiannual cash dividend, an 8% increase from $0.12. The dividend applies to Common and Class A shares, is the 96th consecutive semiannual dividend since 1979, payable July 15, 2026 to shareholders of record on July 1, 2026.
HEICO (NYSE:HEI) expanded its unsecured revolving credit facility to $2.2 billion, up from $2.0 billion, with a maturity extended to 2031. The Facility includes an accordion feature up to $3 billion and bears interest at SOFR + 75–125 bps, tied to HEICO’s investment-grade rating.
According to HEICO, proceeds will primarily fund acquisitions and general corporate purposes, supporting its long-running acquisition strategy of over 110 deals since 1996.
HEICO (NYSE:HEI) announced that its Exxelia subsidiary acquired 90% of high-voltage ceramic capacitor maker CalRamic Technologies for cash. The remaining 10% is retained by founder and CEO Jeff Day.
HEICO expects the deal to be accretive to earnings within one year and notes this is its fifth acquisition in the current fiscal year.
CalRamic, based in Reno, designs and manufactures high-voltage disc capacitors and MLCCs for aerospace, defense and select industrial markets. The company will operate within Exxelia, keep its Reno facilities and its team of over 40 professionals, and continue under Jeff Day’s leadership.
HEICO (NYSE:HEI) acquired UK-based Cook Defence Systems, a key supplier of armored vehicle track systems, through its Flight Support Group to form HEICO-Cook Defence (HCD). HEICO owns 80%, while William Cook Holdings retains 20%; Managing Director William Cook continues to lead operations.
Transaction terms were not disclosed, but HEICO expects the deal to be accretive to earnings within the year after closing. Cook Defence has about 130 employees in Stanhope, UK and generates most revenue outside the US, providing HEICO added international defense growth exposure.
HEICO (NYSE:HEI) reported record Q2 2026 results, with net income up 49% to $233.8 million ($1.66 per diluted share) and net sales up 25% to $1.38 billion. Operating income rose 41% to $350.4 million, lifting the consolidated operating margin to 25.5%.
For the first six months, net income increased 31% to $424.0 million ($3.01 per share) on net sales of $2.55 billion, up 20%. EBITDA grew 37% in Q2 and 26% year to date. Consolidated quarterly organic net sales growth exceeded 18%, supported by strong demand and contributions from recent acquisitions in both the Flight Support Group and Electronic Technologies Group.
HEICO (NYSE:HEI, HEI.A) will release second-quarter results for the period ended April 30, 2026, after NYSE close on May 27, 2026. HEICO will host a conference call on May 28, 2026 at 9:00 AM EDT to discuss results; dial-in and replay details are available on the company website.
The company notes both classes of common stock trade on the NYSE with different voting rights (HEI one vote, HEI.A one-tenth vote).
XLCS Partners advised Sherwood Avionics and Accessories on its sale to HEICO Corporation (NYSE: HEI / HEI.A). HEICO acquired 80% of Sherwood Aviation, with remaining 20% retained by Sherwood management. The deal closed on April 6, 2026, and Sherwood brings FAA and EASA Part 145 MRO capabilities across APUs, landing gear, avionics, and related systems.
The transaction expands HEICO's Flight Support Group footprint into mission-critical defense and select commercial MRO services while preserving Sherwood's technical team and OEM relationships.
HEICO (NYSE:HEI) reported that subsidiaries 3D PLUS, Exxelia and VPT supplied mission-critical electronic components for NASA's Artemis II crewed lunar mission on April 13, 2026. 3D PLUS supplied memory devices; Exxelia supplied capacitors and magnetics; VPT supplied radiation-hardened DC-DC converters and EMI filters used in Orion and SLS avionics.
The announcement highlights HEICO's role in deep-space systems and continued exposure to high-reliability aerospace and space programs.
HEICO (NYSE:HEI) acquired 90% of Southwest Antennas, Inc. (SWA) on April 9, 2026, for cash at closing, with SWA CEO Ben Culver retaining the balance. HEICO expects the deal to be accretive to earnings within one year.
SWA operates a 25,000 sq ft Poway, CA facility, employs >110 people, and makes rugged RF/microwave antennas to 8.5GHz plus RF accessories.