Himax Confirm CPO Collaboration and Strategic Partnership with FOCI Remain Ongoing and Unchanged
Himax (Nasdaq: HIMX) confirmed its collaboration and strategic partnership with FOCI on Co-Packaged Optics (CPO) remains ongoing and unchanged as of Jan. 5, 2026.
Rhea-AI Summary
Himax (Nasdaq: HIMX) confirmed its collaboration and strategic partnership with FOCI on Co-Packaged Optics (CPO) remains ongoing and unchanged as of Jan. 5, 2026. The companies say they combine Himax's WLO advanced nano imprinting technology with FOCI's silicon photonics work to achieve breakthroughs. The firms report the first-generation CPO solution is under validation by key customers and partners for technology and reliability, and they are working toward mass production readiness in 2026. Concurrent joint development targets future-generation high-speed optical transmission and advanced CPO architectures aimed at AI data-center and HPC bandwidth demands.
Positive
- WLO nano imprinting technology applied to CPO
- First-generation CPO solution under customer validation
- Targeting mass production readiness in 2026
- Joint development with global customers on future CPO
Negative
- First-generation solution not yet commercially launched; validation ongoing
- Mass-production timing remains a 2026 target, not a confirmed shipment date
Details
News Market Reaction – HIMX
On Jan 5, the day this news came out, HIMX closed 1.17% below the previous close.
Data tracked by StockTitan Argus for the Jan 5 session.
Key Figures
- Share price
- $8.53
- Pre-news last close for HIMX
- Daily change
- 4.15%
- Price change over prior 24 hours pre-news
- Volume today
- 591,329 shares
- Compared with 20-day average volume of 1,039,329
- 52-week high
- $13.91
- 52-week trading range high for HIMX
- 52-week low
- $5.66
- 52-week trading range low for HIMX
- Price vs 52-week high
- -38.68%
- Distance from 52-week high prior to this news
- Market cap
- $1,427,517,000
- Equity value before the partnership clarification
- 200-day MA
- $8.30
- Long-term moving average level for HIMX
Historical Context
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Unveiled ultra-slim high-brightness LCoS microdisplay for AR glasses at CES.
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Announced Drone AI imaging solution with edge-AI vision SoC for CES showing.
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Launched AI-enabled Pro-Eye vision-care monitor for reduced eye strain.
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Reported Q3 results beating profit guidance and issued flat-to-up Q4 outlook.
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Showcased WiseEye palm vein authentication with on-device AI at Sectech Sweden.
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
co-packaged optics technical
silicon photonics technical
nano imprinting technical
ai data center technical
high-performance computing technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
TAINAN, Taiwan, Jan. 05, 2026 (GLOBE NEWSWIRE) -- In response to recent media reports, Himax Technologies, Inc. (“Himax” or “Company”) (Nasdaq: HIMX), an industry leader in fabless display driver ICs and other semiconductors, today issued a statement clarifying that Himax is an important collaboration and strategic partner of FOCI Fiber Optic Communications, Inc. (“FOCI”) in the field of Co-Packaged Optics (CPO). All ongoing collaborations between the two parties continue to progress actively, and there has been no change as claimed in a certain media report.
In the field of CPO, Himax leverages its proprietary WLO advanced nano imprinting technology. Together with FOCI, the two companies have achieved significant breakthroughs in silicon photonics technology. The first-generation solution is currently being validated by key customers and partners for the technologies and their reliability while the companies work toward mass production readiness in 2026.
Concurrent with the development of the first-generation CPO solution, as strategic partners, the two companies are conducting joint development efforts with global leading customers and ecosystem partners, focusing on future-generation high-speed optical transmission technologies and advanced CPO architectures to address the explosive bandwidth demands driven by AI data center and high-performance computing (HPC) applications.
About Himax Technologies, Inc.
Himax Technologies, Inc. (NASDAQ: HIMX) is a leading global fabless semiconductor solution provider dedicated to display imaging processing technologies. The Company’s display driver ICs and timing controllers have been adopted at scale across multiple industries worldwide including TVs, PC monitors, laptops, mobile phones, tablets, automotive, ePaper devices, industrial displays, among others. As the global market share leader in automotive display technology, the Company offers innovative and comprehensive automotive IC solutions, including traditional driver ICs, advanced in-cell Touch and Display Driver Integration (TDDI), local dimming timing controllers (Local Dimming Tcon), Large Touch and Display Driver Integration (LTDI) and OLED display technologies. Himax is also a pioneer in tinyML visual-AI and optical technology related fields. The Company’s industry-leading WiseEyeTM Ultralow Power AI Sensing technology which incorporates Himax proprietary ultralow power AI processor, always-on CMOS image sensor, and CNN-based AI algorithm has been widely deployed in consumer electronics and AIoT related applications. Himax optics technologies, such as diffractive wafer level optics, LCoS microdisplays and 3D sensing solutions, are critical for facilitating emerging AR/VR/metaverse technologies. Additionally, Himax designs and provides touch controllers, OLED ICs, LED ICs, EPD ICs, power management ICs, and CMOS image sensors for diverse display application coverage. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,200 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan, Germany, and the US. Himax has 2,586 patents granted and 371 patents pending approval worldwide as of September 30, 2025.
Forward Looking Statements
Factors that could cause actual events or results to differ materially from those described in this conference call include, but are not limited to, the effect of the Covid-19 pandemic on the Company’s business; general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortage in supply of key components; changes in environmental laws and regulations; changes in export license regulated by Export Administration Regulations (EAR); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2024 filed with the SEC, as may be amended.
Himax Contacts:
Karen Tiao, Head of IR/PR
Himax Technologies, Inc.
Tel: +886-2-2370-3999
Fax: +886-2-2314-0877
Email: hx_ir@himax.com.tw
www.himax.com.tw
Mark Schwalenberg, Director
Investor Relations - US Representative
MZ North America
Tel: +1-312-261-6430
Email: HIMX@mzgroup.us
FAQ
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